Abstract:
Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board. Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board. The solder paste is reflowed and forms a rivet structure attaching the flex circuit to the rigid circuit board as well as providing an electrical connection between the conductive pads of the flex circuit and the rigid circuit board.
Abstract:
An assembly (100) is provided which allows high power packaged power components (122) to operate at optimum power levels without degradation in performance. The assembly includes a heat sink (102), a printed circuit board (pcb) isolator (104) and a contact ring (106). The pcb isolator (104) provides electrical contacts (108, 128) upon which to mount the component and includes an opening (110) through which the component is soldered to the heat sink (102). The contact ring (106) is mounted to the pcb isolator (104) to form a cavity (124) within which the component (122) is contained. The assembly (100) can be coupled into a product having a chassis (320) and a product circuit board (324) such that the contact ring (106) is soldered to the product circuit board for electrical connection, and the heat sink is thermally coupled to the product chassis for heat dissipation
Abstract:
A method of fabricating a multilayer printed circuit board, comprises alternately stacking on a template (1) having at least two vertical alignment pins (2), predefined printed circuit sub-boards (3) and pre-impregnated sheets (12) precursors of dielectric layers of reinforced resin between said sub-boards, all provided with alignment holes (14, 5), binding together the components of the assembled stack, lifting the stack off the alignment pins (2), transferring it between the platens of a press and hot pressing it causing polymerization of the resin of said pre-impregnated sheets. The method consists in defining at least a pair of soldering pads (7) with hole therethrough at certain positions relative to said alignment holes (14, 5) on both faces of each of said sub-boards (3) except the lowermost sub-board on which blind pads (6) are defined on at least its upper face; indenting or perforating each pre-impregnated sheet (12) such not to overlap said pads (6, 7) and soldering each newly stacked sub-board (3) to the previously stacked underlying sub-board (3) through the respective pads (7) with a hole therethrough. The machine employs a template (1) having at least two vertical alignment pins (2); a least two electric soldering irons (16), soldering each sub-board (3) just stacked to the previously stacked underlying one through welding pads (7) having a hole therethrough and has means (18) for moving each one of said soldering irons along three orthogonal axis onto a respective one of said pads (7) with a hole therethrough to make the soldering, and off and away from the stack when the soldering have been done.
Abstract:
A low impedance surface mount connector (20) having an I-shaped cross section for connecting between the first and second circuit boards (51, 61).
Abstract:
A method and device are disclosed for mounting a printed circuit board to another printed circuit board. The device (1) includes a first printed circuit board (2) having a plurality of electrical components (3) disposed thereon, the first printed circuit board (2) including a plurality of wire segments (4) electrically connecting the electrical components (3) together and a plurality of input-output wire segments (5) being routed to side surfaces (2B) of the first printed circuit board (2). The device further includes a plurality of plate members (6) of electrically conductive material disposed along the side surfaces (2B) of the first printed circuit board (2) and associated with the input-output wire segments (5) thereof. A solder bump (8) is disposed against each plate member (6). The first printed circuit board (2) is disposed on a second printed circuit board (B) and maintained thereon by the solder bumps (8), the second printed circuit board (B) providing electrical connectivity to each input-output wire segment (5) of the first printed circuit board (2). Because each solder bump (8)/plate member (6)/input-output segment (5) of the first printed circuit board (2) is located at the periphery thereof, the solder bumps (8)/plate members (6)/input-output segments (5) of the first printed circuit board (2) is easily inspected, reworked or removed.
Abstract:
A package for power converters in which a multilayers circuit board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portions of the bottom layers are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic core (26a). The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiments of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The base plate has cutouts or cavities to accomodate the magnetic cores. A thermally conductive material is placed between the magnetic core (26a) and the metal plate on the bottom of the cavity.
Abstract:
A package for power converters in which a multilayers circuit board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portions of the bottom layers are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic core (26a). The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiments of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The base plate has cutouts or cavities to accomodate the magnetic cores. A thermally conductive material is placed between the magnetic core (26a) and the metal plate on the bottom of the cavity.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same, which facilitate alignment between a semiconductor component and a circuit board. SOLUTION: The semiconductor device includes a first circuit base member 20 including a surface having multiple first electrodes 22 formed thereon, a second circuit base member 30 being provided above the first circuit base member 20 and having first through-holes 30a and second through-holes 30b formed respectively above the first electrodes 22, a semiconductor package 50 provided above the second circuit base member 30, and multiple first bumps 51 provided inside the first through-holes 30a and the second through-holes 30b to connect the first electrodes 22 to the semiconductor package 50. COPYRIGHT: (C)2011,JPO&INPIT