公开(公告)号：WO2008033484A2

公开(公告)日：2008-03-20

申请号：PCT/US2007/019969

申请日：2007-09-14

Applicant: UKA, Harshad, K.

Inventor： UKA, Harshad, K.

IPC: H01R9/24

CPC classification number: H05K3/363 ,  H01R4/027 ,  H01R12/523 ,  H01R43/0256 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10666 ,  H05K2201/2036 ,  H05K2203/063 ,  H05K2203/1178

Abstract: Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board. Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board. The solder paste is reflowed and forms a rivet structure attaching the flex circuit to the rigid circuit board as well as providing an electrical connection between the conductive pads of the flex circuit and the rigid circuit board.

Abstract translation: 柔性电路的导电焊盘可以电连接到刚性电路板的导电焊盘。 柔性电路的导电焊盘的尺寸，构造和对准刚性电路板的导电焊盘。 具有多个孔的间隔物的尺寸，配置和对准到柔性电路和刚性电路板的导电垫。 焊膏可以设置在柔性电路的相应导电焊盘和间隔件的孔内的刚性电路板之间。 当柔性电路，刚性电路板和间隔件组装时，焊膏通过柔性电路，刚性电路板或柔性电路或刚性电路板的导电焊盘形成的通孔形成位移。 焊膏被回流并且形成将柔性电路连接到刚性电路板的铆钉结构，以及在柔性电路的导电焊盘和刚性电路板之间提供电连接。

公开(公告)号：WO2007024354A2

公开(公告)日：2007-03-01

申请号：PCT/US2006/027100

申请日：2006-07-13

Applicant: MOTOROLA, INC. ,  DIAZ, Jose

Inventor： DIAZ, Jose

IPC: H05K7/20

CPC classification number: H01L23/40 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K3/3431 ,  H05K2201/10166 ,  H05K2201/10666 ,  H01L2924/00

Abstract: An assembly (100) is provided which allows high power packaged power components (122) to operate at optimum power levels without degradation in performance. The assembly includes a heat sink (102), a printed circuit board (pcb) isolator (104) and a contact ring (106). The pcb isolator (104) provides electrical contacts (108, 128) upon which to mount the component and includes an opening (110) through which the component is soldered to the heat sink (102). The contact ring (106) is mounted to the pcb isolator (104) to form a cavity (124) within which the component (122) is contained. The assembly (100) can be coupled into a product having a chassis (320) and a product circuit board (324) such that the contact ring (106) is soldered to the product circuit board for electrical connection, and the heat sink is thermally coupled to the product chassis for heat dissipation

Abstract translation: 提供了一种组件（100），其允许高功率封装功率部件（122）在最佳功率水平下工作而不降低性能。 组件包括散热器（102），印刷电路板（pcb）隔离器（104）和接触环（106）。 pcb隔离器（104）提供电触头（108,128），在其上安装部件并包括开口（110），部件通过该开口焊接到散热器（102）。 接触环（106）安装到pcb隔离器（104）以形成容纳部件（122）的空腔（124）。 组件（100）可以耦合到具有底架（320）和产品电路板（324）的产品中，使得接触环（106）被焊接到产品电路板用于电连接，并且散热器是热的 耦合到产品底盘散热

公开(公告)号：WO2004098252A1

公开(公告)日：2004-11-11

申请号：PCT/JP2004/005951

申请日：2004-04-23

Applicant: 日本圧着端子製造株式会社 ,  内田 真司 ,  山根 浩 ,  杉原 渉

Inventor： 内田 真司 ,  山根 浩 ,  杉原 渉

IPC: H05K1/14

CPC classification number: H05K3/363 ,  H05K2201/09163 ,  H05K2201/10666

Abstract: 　本発明は、ＦＰＣが電気的に接続されるプリント配線板の接続構造に関する。ＦＰＣは、長尺状の基材と、この基材の表面に積層され基材の軸方向に沿って延びる複数の導体部と、を備える。プリント配線板は、平板状の配線板本体と、この配線板本体の一端面に設けられＦＰＣの先端が挿入される挿入口と、配線板本体の表面から挿入口の内壁面まで貫通する複数のスルーホール端子と、を備える。ＦＰＣをプリント配線板の挿入口に挿入することにより、ＦＰＣの導体部は、それぞれ、前記スルーホール端子に当接する。この発明によれば、ＦＰＣが接続されるコネクタ構造を、プリント配線板の内部に設けたので、回路素子を高密度で実装できるうえに、配線パターンの設計の自由度を向上できる。

Abstract translation: 一种用于电连接FPC的印刷线路板连接结构。 FPC具有细长的基部和设置在基部上并且沿着基部的轴线延伸的导电部分。 印刷布线板具有平坦的布线板主体，插入开口，其设置在布线板主体的一个边缘中，FPC的边缘通过该插入孔以及从布线板主体的表面延伸到通孔端子 插入孔的内壁。 当FPC通过插入口插入时，FPC的导电部分与各个孔端子接触。 由于FPC连接的连接器结构被设置在印刷电路板中，所以可以高密度地安装电路器件，并且可以提高布线图案的设计自由度。

公开(公告)号：WO2002067644A1

公开(公告)日：2002-08-29

申请号：PCT/IT2001/000083

申请日：2001-02-21

Applicant: CANDORE, Amedeo

Inventor： CANDORE, Amedeo

IPC: H05K3/46

CPC classification number: B23K37/0408 ,  B23K2201/42 ,  B32B38/1841 ,  B32B2457/08 ,  H05K3/4614 ,  H05K3/4638 ,  H05K2201/09781 ,  H05K2201/10666 ,  H05K2203/167

Abstract: A method of fabricating a multilayer printed circuit board, comprises alternately stacking on a template (1) having at least two vertical alignment pins (2), predefined printed circuit sub-boards (3) and pre-impregnated sheets (12) precursors of dielectric layers of reinforced resin between said sub-boards, all provided with alignment holes (14, 5), binding together the components of the assembled stack, lifting the stack off the alignment pins (2), transferring it between the platens of a press and hot pressing it causing polymerization of the resin of said pre-impregnated sheets. The method consists in defining at least a pair of soldering pads (7) with hole therethrough at certain positions relative to said alignment holes (14, 5) on both faces of each of said sub-boards (3) except the lowermost sub-board on which blind pads (6) are defined on at least its upper face; indenting or perforating each pre-impregnated sheet (12) such not to overlap said pads (6, 7) and soldering each newly stacked sub-board (3) to the previously stacked underlying sub-board (3) through the respective pads (7) with a hole therethrough. The machine employs a template (1) having at least two vertical alignment pins (2); a least two electric soldering irons (16), soldering each sub-board (3) just stacked to the previously stacked underlying one through welding pads (7) having a hole therethrough and has means (18) for moving each one of said soldering irons along three orthogonal axis onto a respective one of said pads (7) with a hole therethrough to make the soldering, and off and away from the stack when the soldering have been done.

Abstract translation: 一种制造多层印刷电路板的方法，包括交替地堆叠在具有至少两个垂直对准销（2），预定印刷电路子板（3）和预浸渍片（12）的模板（1）上，所述预浸渍片（12） 在所述子板之间的增强树脂层，均设有对准孔（14,5），将组装好的堆叠的部件结合在一起，将堆叠从对准销（2）上提起，将其转移到压力机的压板和 热压它导致所述预浸渍片材的树脂聚合。 该方法包括在每个所述子板（3）的两个面上的相对于所述对准孔（15）的某些位置处至少限定一对具有孔的焊盘（7），除了最下面的子板 至少在其上表面上限定了盲垫（6）; 每个预浸渍片材（12）的凹陷或穿孔，使得不与所述垫片（6,7）重叠，并且通过相应的垫片（7）将每个新堆叠的子板材（3）焊接到先前堆叠的下面的子板材（3） ）。 机器采用具有至少两个垂直对准销（2）的模板（1）; 至少两个电烙铁（16），通过具有穿过其中的孔的焊接垫（7）将每个子板（3）焊接到刚堆叠到先前堆叠的下层的子板上，并具有用于移动每个所述烙铁的装置（18） 沿着三个正交轴线到相应的一个所述焊盘（7）上，具有穿过其中的孔以进行焊接，并且在进行焊接时离开和离开堆叠。

公开(公告)号：WO02049165A1

公开(公告)日：2002-06-20

申请号：PCT/US2001/025959

申请日：2001-08-20

IPC: H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K5/00 ,  H01R13/46

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10666 ,  H05K2201/10856 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49211 ,  H01L2924/00

Abstract: A low impedance surface mount connector (20) having an I-shaped cross section for connecting between the first and second circuit boards (51, 61).

Abstract translation: 具有用于连接在第一和第二电路板（51,61）之间的具有I形横截面的低阻抗表面安装连接器（20）。

公开(公告)号：WO02023963A3

公开(公告)日：2002-05-16

申请号：PCT/US2001/028917

申请日：2001-09-14

IPC: H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K3/3442 ,  H05K1/141 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/10666 ,  H05K2201/10984 ,  Y02P70/613

Abstract: A method and device are disclosed for mounting a printed circuit board to another printed circuit board. The device (1) includes a first printed circuit board (2) having a plurality of electrical components (3) disposed thereon, the first printed circuit board (2) including a plurality of wire segments (4) electrically connecting the electrical components (3) together and a plurality of input-output wire segments (5) being routed to side surfaces (2B) of the first printed circuit board (2). The device further includes a plurality of plate members (6) of electrically conductive material disposed along the side surfaces (2B) of the first printed circuit board (2) and associated with the input-output wire segments (5) thereof. A solder bump (8) is disposed against each plate member (6). The first printed circuit board (2) is disposed on a second printed circuit board (B) and maintained thereon by the solder bumps (8), the second printed circuit board (B) providing electrical connectivity to each input-output wire segment (5) of the first printed circuit board (2). Because each solder bump (8)/plate member (6)/input-output segment (5) of the first printed circuit board (2) is located at the periphery thereof, the solder bumps (8)/plate members (6)/input-output segments (5) of the first printed circuit board (2) is easily inspected, reworked or removed.

Abstract translation: 公开了用于将印刷电路板安装到另一印刷电路板的方法和装置。 所述装置（1）包括第一印刷电路板（2），所述第一印刷电路板（2）具有设置在其上的多个电气部件（3），所述第一印刷电路板（2）包括电连接所述电气部件 ）和多个输入 - 输出线段（5）被路由到第一印刷电路板（2）的侧表面（2B）。 该装置还包括沿着第一印刷电路板（2）的侧表面（2B）设置并与其输入 - 输出线段（5）相关联的多个导电材料板件（6）。 焊接凸起（8）抵靠每个板构件（6）设置。 第一印刷电路板（2）设置在第二印刷电路板（B）上并由焊料凸块（8）保持在其上，第二印刷电路板（B）提供与每个输入 - 输出线段（5）的电连接 ）的第一印刷电路板（2）。 由于第一印刷电路板（2）的每个焊料凸块（8）/板构件（6）/输入 - 输出段（5）位于其周边，所以焊料凸块（8）/板构件（6）/ 第一印刷电路板（2）的输入输出段（5）容易被检查，返工或去除。

公开(公告)号：WO9962105A3

公开(公告)日：2000-06-29

申请号：PCT/US9911824

申请日：1999-05-27

Applicant: ROMPOWER INC

Inventor： JITARU IONEL

IPC: H01F27/06 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H01F27/06 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/141 ,  H05K1/165 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2201/10666 ,  H01L2924/00

Abstract: A package for power converters in which a multilayers circuit board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portions of the bottom layers are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic core (26a). The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiments of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The base plate has cutouts or cavities to accomodate the magnetic cores. A thermally conductive material is placed between the magnetic core (26a) and the metal plate on the bottom of the cavity.

Abstract translation: 电源转换器的封装，其中多层电路板可以容纳这些组件。 磁性元件的缠绕结合在多层电路板中。 顶层和底层的一些部分也支持电子元件。 一些组件被放置在顶层上，这可能不被用于磁绕组，从而减小了磁芯（26a）的占地面积。 功率耗散装置放置在通过连接顶层到底层涂覆多个铜的垫上。 通过这些热量从功率器件传递到PCB的另一侧。 在本发明的一些实施例中，热量可以进一步传递到经由导热绝缘体连接到多层电路板的金属板。 基板具有切口或空腔以容纳磁芯。 导热材料放置在磁芯（26a）和空腔底部上的金属板之间。

公开(公告)号：WO99062105A2

公开(公告)日：1999-12-02

申请号：PCT/US1999/011824

申请日：1999-05-27

IPC: H01F27/06 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K7/20 ,  H01L

CPC classification number: H05K1/0204 ,  H01F27/06 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/141 ,  H05K1/165 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2201/10666 ,  H01L2924/00

Abstract: A package for power converters in which a multilayers circuit board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portions of the bottom layers are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic core (26a). The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiments of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The base plate has cutouts or cavities to accomodate the magnetic cores. A thermally conductive material is placed between the magnetic core (26a) and the metal plate on the bottom of the cavity.

Abstract translation: 一种用于电力转换器的封装，其中多层电路板保持部件。 磁性元件的绕组结合在多层电路板中。 底层的顶部和一些部分也支持电子部件。 一些部件被放置在顶层上，这可能不能用于磁性绕组，减少了磁芯（26a）的占地面积。 功率耗散器件放置在焊盘上，通过连接顶层到底层，镀有多种铜。 通过这些通过热量从功率器件传递到PCB的另一侧。 在本发明的一些实施例中，可以通过导热绝缘体将热量进一步转移到连接到多层电路板的金属板上。 基板具有用于容纳磁芯的切口或空腔。 将导热材料放置在磁芯（26a）和空腔底部的金属板之间。

公开(公告)号：JP4763309B2

公开(公告)日：2011-08-31

申请号：JP2005043303

申请日：2005-02-21

Applicant: セイコーインスツル株式会社

Inventor： 江利子 野口

IPC: G04C10/00 ,  G04G19/00 ,  H01M2/10

CPC classification number: H01M2/10 ,  H01M2/0222 ,  H01M2/0421 ,  H01M2/20 ,  H01M2/30 ,  H05K3/301 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10606 ,  H05K2201/10666

公开(公告)号：JP2011103441A

公开(公告)日：2011-05-26

申请号：JP2010190604

申请日：2010-08-27

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： MIZUTANI DAISUKE

IPC: H01L21/60 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/147 ,  H01L21/76898 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/222 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0379 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same, which facilitate alignment between a semiconductor component and a circuit board. SOLUTION: The semiconductor device includes a first circuit base member 20 including a surface having multiple first electrodes 22 formed thereon, a second circuit base member 30 being provided above the first circuit base member 20 and having first through-holes 30a and second through-holes 30b formed respectively above the first electrodes 22, a semiconductor package 50 provided above the second circuit base member 30, and multiple first bumps 51 provided inside the first through-holes 30a and the second through-holes 30b to connect the first electrodes 22 to the semiconductor package 50. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决的问题：提供一种半导体器件和电路板之间的对准的半导体器件及其制造方法。 解决方案：半导体器件包括第一电路基底构件20，其包括形成有多个第一电极22的表面，第二电路基底构件30设置在第一电路基底构件20的上方，并具有第一通孔30a和第二通孔30a 设置在第一电极22上方的通孔30b，设置在第二电路基体30上方的半导体封装50以及设置在第一通孔30a和第二通孔30b内部的多个第一凸起51，以将第一电极 （C）2011，JPO＆INPIT