Abstract:
A semiconductor device includes a terminal case containing a semiconductor element, a plurality of pin terminals of equal length mounted in the terminal case and electrically connected to the semiconductor element, the plurality of pin terminals projecting outward from a predetermined surface of the terminal case in the same direction, and at least one protruding pin terminal mounted in the terminal case and projecting outward from the predetermined surface of the terminal case in the same direction farther than the plurality of pin terminals.
Abstract:
A pin having a contact part may be inserted into a receiving opening in a printed circuit board and anchored in the receiving opening with a press fit. Also, a method provides for inserting a pin into a receiving opening in a printed circuit board, in which the pin is inserted into the receiving opening from one side of the printed circuit board, and a contact part of the pin is anchored in the receiving opening with a press fit. The contact part is inserted into the receiving opening in a contactless manner or with a sliding fit and is subsequently deformed within the receiving opening by expansion transversally to the insertion direction in order to anchor the contact part in the receiving opening with a press fit.
Abstract:
An example electronic device (2) having a grounded structure includes a conductive bearing board (220) having at least one fixing pole (221); a circuit board (210) having at least one through hole (211) corresponding to the fixing pole, and a grounded layer (215) respectively formed at a peripheral region of the at least one through hole. The at least one fixing pole respectively fixed at the at least one through hole and contacts with the grounded layer. The electronic device has a simple structure, and it can be connected with a ground perfectly.
Abstract:
An interposition structure interposed between substrates and capable of guiding the insertion of a connection pin for electrically connecting the substrates to each other, whereby the connection pin can be inserted properly even in cases where the substrates to be connected or other members have a dimensional error caused during production thereof, a positioning error or the like. The interposition structure has an interposition body in which a through hole is formed such that connection pin inlet and outlet portions thereof each have an inner diameter gradually increasing in a direction from the inner part to the corresponding outer open end thereof, and also has a positioning protuberance provided on the underside of the interposition body. The interposition structure is interposed between upper and lower substrates with the positioning protuberance received in a recess formed in the upper surface of the lower substrate, and the connection pin is inserted through a hole in the upper substrate, the through hole, and a hole in the lower substrate.
Abstract:
Provided is a system to reduce the force required for inserting a circuit board assembly including a plurality of circuit boards into the card edge connectors. A circuit board assembly includes a first circuit board, a second circuit board and a coupling part. The first circuit board includes printed circuit elements and a connecting part. In the same manner as the first circuit board, the second circuit board includes printed circuit elements and a connecting part. The front edge of the connecting parts are shifted from the front edge of the other connecting part by a distance “d” along the connecting or inserting direction of the circuit boards toward the card edge connectors, so that the distance between the front edge of the connecting part of the first circuit board and the first card edge connector differs from the distance between the front edge of the connecting part of the second circuit board and the second card edge connector.
Abstract:
An apparatus for automatically mounting an electronic device having a plurality of leads on a printed circuit board, by inserting the leads into mount holes of the printed circuit board. A plurality of extension pins are connected straight to the leads to hold the leads of the electronic device. The extension pins are inserted into the mount holes, while the connection between the extension pins and the leads is maintained. The extension pins are then removed from an opposite side of the printed circuit board, thus guiding and inserting the tips of the leads into the mount holes.
Abstract:
PROBLEM TO BE SOLVED: To provide a printed wiring board which can prevent an inclination or floating of electronic parts without using a special structure as existent electronic parts. SOLUTION: In a latch 11 and terminal holes 12, 13 for attaching electronic parts; narrow parts 11b, 12b, 13b having the width substantially identical to an attachment leg or a connection terminal of electronic parts, and guiding parts 11a, 12a, 13a wider than those, are formed. The attachment leg or connection terminal is inserted into the guiding part, and the electronic parts are slid, so that the attachment leg or connection terminal is sandwiched between the narrow parts. Thus, it is possible to prevent an offset or inclination of the electronic parts. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To realize a method for manufacturing a power module which can attain easy electric connection between a control substrate and a relay terminal. SOLUTION: The diameter of each of through-holes 201a in a control substrate 102 is gradually reduced as the through-hole 201a proceeds through the through-hole 201a from the insert side of each of relay terminals 103, and the diameter of one end 103b of the relay terminal 103 is made smaller than the diameter of the other part of the relay terminal 103. Since the diameter of the through-hole 201a at the insert side of the relay terminal 103 is made sufficiently larger than the diameter of one end 103b of the relay terminal 103, the relay terminal 103 can be easily passed through the through-hole 201a. Even when the relay terminal 103 is shifted in formation position, one end 103b of the relay terminal 103, upon being inserted into the through-hole 201a, can be guided along the wall surface of the through-hole 201a. Consequently, the relay terminal 103 can be corrected at a suitable position. COPYRIGHT: (C)2006,JPO&NCIPI