公开(公告)号：WO2007146665A2

公开(公告)日：2007-12-21

申请号：PCT/US2007/070401

申请日：2007-06-05

Applicant: SAMTEC, INC. ,  WEIR, Steve ,  MCMORROW, Scott

Inventor： WEIR, Steve ,  MCMORROW, Scott

IPC: H05K1/11

CPC classification number: H05K1/0231 ,  H01L23/50 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/19104 ,  H01L2924/3011 ,  H03K19/00346 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/09309 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: Power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over.

Abstract translation: 用于集成电路的配电系统包括在旁路电容器网络和印刷电路板的电源/接地腔之间阻尼谐振的方法，（a）不需要过量的旁路/阻尼部件，或（b）不需要高平面 空腔电容或替代可以确保在从旁路网络到平面腔阻抗交叉的转变时小于1.4的Q。

公开(公告)号：WO2022217146A1

公开(公告)日：2022-10-13

申请号：PCT/US2022/024275

申请日：2022-04-11

Applicant: SAMTEC, INC.

Inventor： BOHN, Christopher David ,  CRAIN, Mark ,  ROEHM, Justin ,  HAMMANN, Thomas Jacob ,  ROBERTSON, Nathan ,  BROWN, Jeremy ,  PELKEY, Christopher ,  OWENS, Adam ,  PAYTON, Russell ,  FRANK, Russell

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/00

Abstract: A substrate is provided that includes a substrate body made of a material such as glass, and at least one electrical via that can extend at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.

公开(公告)号：WO2022147292A1

公开(公告)日：2022-07-07

申请号：PCT/US2021/065741

申请日：2021-12-30

Applicant: SAMTEC, INC.

Inventor： SHAH, Jignesh, H. ,  BLANDO, Gustavo ,  WILLIAMS BARNETT, Jean Karlo

IPC: H01R13/66 ,  H01R13/629

Abstract: An electrical connector includes a connector housing and a plurality of electrical contacts supported by the connector housing. The electrical contacts are oriented oblique to a mounting interface of the connector housing that mounts to an underlying substrate. The electrical connector can further include a plurality of electrical cables mounted to the electrical contacts. The electrical cables can extend from the electrical contacts along a direction oblique to the mounting interface.

公开(公告)号：WO2021231024A1

公开(公告)日：2021-11-18

申请号：PCT/US2021/027587

申请日：2021-04-16

Applicant: SAMTEC, INC.

Inventor： BIRCH, Daniel R.

IPC: H01R13/66 ,  H01R24/38 ,  H01R103/00

Abstract: A connector includes a housing including a conductive material, a base connected to the housing and including a base center hole and a base groove extending from the base center hole to an edge of the base, a center pin including a trunk and a leg extending perpendicular or substantially perpendicular to the trunk, and a protrusion protruding from the leg to provide electrical contact to a pad on a printed circuit board.

公开(公告)号：WO2021207390A1

公开(公告)日：2021-10-14

申请号：PCT/US2021/026226

申请日：2021-04-07

Applicant: SAMTEC, INC.

Inventor： BEST, Burrell G. ,  VICICH, Brian R. ,  MEREDITH, Kevin R. ,  FAITH, Chadrick P. ,  NOVAK, Istvan ,  BUCK, Jonathan E.

IPC: H05K7/14 ,  H05K3/34 ,  H01R12/71 ,  H01R13/53 ,  H01R13/658

Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.

公开(公告)号：WO2020051183A3

公开(公告)日：2020-03-12

申请号：PCT/US2019/049458

申请日：2019-09-04

Applicant: SAMTEC, INC.

Inventor： EPITAUX, Marc ,  ZBINDEN, Eric, J. ,  CORONATI, John ,  SHAH, Jignesh, H. ,  GORE, Brandon, Thomas

IPC: H01R13/6473 ,  H01R12/77 ,  H01L23/367 ,  H01S5/183 ,  H01L23/528

Abstract: This present disclosure increases the interconnect density by using a different technology approach than the industry is currently using (stamping and molding). By using a MEMS-based technology approach, better geometry and impedance control can be carried out to reduce impedance discontinuities and feature size. Additional concepts include low connector insertion force, no contact wiping, and a precise alignment mechanism between the connector contacts and those on the mating substrate.

公开(公告)号：WO2020014597A2

公开(公告)日：2020-01-16

申请号：PCT/US2019/041576

申请日：2019-07-12

Applicant: SAMTEC, INC.

Inventor： BUCK, Jonathan E. ,  SASAKI, Yasuo ,  FERRY, Julian ,  GORE, Brandon Thomas

IPC: H01R13/6581 ,  H01R13/03

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：WO2019217978A1

公开(公告)日：2019-11-14

申请号：PCT/US2019/070005

申请日：2019-05-08

Applicant: SAMTEC, INC.

Inventor： SASAKI, Yasuo ,  MEREDITH, Kevin, R.

IPC: H01R13/03 ,  H05K7/20

Abstract: A connector includes a thermal metamaterial. The thermal metamaterial provides heat flow paths from inside of the connector to outside of the connector. In addition, an electrical connector includes an electrically insulating housing, an electrically conductive contact included in the electrically insulating housing, and a metamaterial thermally connected to one of the electrically insulating housing or the electrically conductive contact. The metamaterial thermally cools the electrical connector.

公开(公告)号：WO2019099450A1

公开(公告)日：2019-05-23

申请号：PCT/US2018/060929

申请日：2018-11-14

Applicant: SAMTEC INC.

Inventor： DUNLOP, James

IPC: H05K1/11 ,  H05K1/18 ,  H01R12/53 ,  H01R12/72

Abstract: An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.

公开(公告)号：WO2019060817A2

公开(公告)日：2019-03-28

申请号：PCT/US2018/052402

申请日：2018-09-24

Applicant: SAMTEC INC.

Inventor： ZBINDEN, Eric

IPC: G02B6/122

Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.