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公开(公告)号:AT188498T
公开(公告)日:2000-01-15
申请号:AT96930255
申请日:1996-09-12
Applicant: IBM
Inventor: AFZALI-ARDAKANI ALI , GELORME JEFFREY DONALD , KOSBAR LAURA LOUISE
IPC: B32B27/00 , B32B27/16 , B32B27/18 , C08G59/40 , C08H3/00 , C08H6/00 , C08H7/00 , C08J5/04 , C08K3/00 , C08K5/1515 , C08K5/16 , C08L5/00 , C08L63/00 , C08L91/00 , C08L93/00 , C08L97/00 , C08L99/00 , H05K1/03 , C08H5/02
Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fibreglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.
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公开(公告)号:CZ82298A3
公开(公告)日:1998-10-14
申请号:CZ82298
申请日:1996-09-12
Applicant: IBM
Inventor: AFZALI-ARDAKANI ALI , GELORME JEFFREY DONALD , KOSBAR LAURA LOUISE
IPC: B32B27/00 , B32B27/16 , B32B27/18 , C08G59/40 , C08H3/00 , C08H6/00 , C08H7/00 , C08J5/04 , C08K3/00 , C08K5/1515 , C08K5/16 , C08L5/00 , C08L63/00 , C08L91/00 , C08L93/00 , C08L97/00 , C08L99/00 , H05K1/03 , C08H5/02
Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fibreglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.
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公开(公告)号:DE69222824D1
公开(公告)日:1997-11-27
申请号:DE69222824
申请日:1992-08-19
Applicant: IBM
Inventor: AFZALI-ARDAKANI ALI , BRAREN BODIL E , DAIJAVAD SHAHROKH , HODGSON RODNEY T , MOLIS STEVEN E , VIEHBECK ALFRED
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74.
公开(公告)号:CA2184761A1
公开(公告)日:1997-03-19
申请号:CA2184761
申请日:1996-09-04
Applicant: IBM
Inventor: AFZALI-ARDAKANI ALI , GELORME JEFFREY D , KOSBAR LAURA L
IPC: B32B27/00 , B32B27/16 , B32B27/18 , C08G59/40 , C08H3/00 , C08H6/00 , C08H7/00 , C08J5/04 , C08K3/00 , C08K5/1515 , C08K5/16 , C08L5/00 , C08L63/00 , C08L91/00 , C08L93/00 , C08L97/00 , C08L99/00 , H05K1/03 , C08L1/00 , C08K5/07 , H01B1/20
Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fiberglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.
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公开(公告)号:DE3476356D1
公开(公告)日:1989-03-02
申请号:DE3476356
申请日:1984-11-27
Applicant: IBM
Inventor: AFZALI-ARDAKANI ALI , COHEN MITCHELL SIMMONS , PENNINGTON KEITH SAMUEL , SACHDEU KRISHNA GANDHI
Abstract: Electroerosion recording materials of superior scratch resistance are provided without the need for a lubricant overcoat by incorporating a hard, lubricating hydrophobic polymer layer between the support and the removable, thin conductive layer to reduce plastic deformation of the support under stylus writing pressure. The intermediate polymer layer provides a highly adhering surface for the overlying aluminum film and contains graphite fluoride and/or fluorocarbon resins such as Teflon R and hard particles such as silica. The materials may be used in various printing processes including making directly readable images, direct negatives and wear resistant offset printing masters.
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