公开(公告)号：CA2719646A1

公开(公告)日：2009-12-23

申请号：CA2719646

申请日：2009-06-19

Applicant: IBM

Inventor： DELAMARCHE EMMANUEL ,  LOVCHIK ROBERT ,  SOLIS DANIEL J

IPC: B01L3/00 ,  B01J19/00 ,  G01N33/543 ,  G01N33/545

Abstract: Disclosed herein is a system comprising a chip; a flow channel disposed in the chip; the flow channel being in communication with an entry port and an exit port; the flow channel being operative to permit the flow of a library from the entry port to the exit port; a substrate; the substrate being disposed upon the chip; the substrate being operative to act as an upper wall for the flow channel; and a receptor; the receptor being disposed on the substrate; the receptor being operative to interact with a component from the library.

公开(公告)号：DE60024046T2

公开(公告)日：2006-07-27

申请号：DE60024046

申请日：2000-06-15

Applicant: IBM

Inventor： BIEBUYCK HANS ,  DELAMARCHE EMMANUEL ,  GEISSLER MATTHIAS ,  KIND HANNES ,  MICHEL BRUNO

IPC: C23C18/16 ,  C23C18/18 ,  H05K3/18

Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.

公开(公告)号：DE60024046D1

公开(公告)日：2005-12-22

申请号：DE60024046

申请日：2000-06-15

Applicant: IBM

Inventor： BIEBUYCK HANS ,  DELAMARCHE EMMANUEL ,  GEISSLER MATTHIAS ,  KIND HANNES ,  MICHEL BRUNO

IPC: C23C18/18 ,  C23C18/16 ,  H05K3/18

Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.

公开(公告)号：AU2003278515A1

公开(公告)日：2004-07-14

申请号：AU2003278515

申请日：2003-11-13

Applicant: IBM

Inventor： DELAMARCHE EMMANUEL ,  MICHEL BRUNO ,  AMONTOV SERGEY

IPC: B01J19/00 ,  C12Q1/68 ,  G01N33/53 ,  G01N33/543

公开(公告)号：AU2003256008A1

公开(公告)日：2004-03-29

申请号：AU2003256008

申请日：2003-08-28

Applicant: IBM

Inventor： BIETSCH ALEXANDER ,  DELAMARCHE EMMANUEL ,  MICHEL BRUNO ,  SCHMID HEINZ ,  WOLF HEIKO

IPC: B01J19/00 ,  B01L99/00 ,  B41K1/30 ,  B41M3/00 ,  C40B30/08 ,  C40B40/18 ,  C40B60/14 ,  G01N35/10 ,  H05K3/12

Abstract: A stamp for transferring a pattern to a substrate in the presence of a third medium, includes a permeable hydrophilic matrix for guiding excess third medium away from the surface of the stamp.