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公开(公告)号：DE69117120T2
公开(公告)日：1996-06-13
申请号：DE69117120
申请日：1991-09-06
Applicant: MITSUI TOATSU CHEMICALS
Inventor： TAMAI SHOJI , KAWASHIMA SABURO , YAMAGUCHI KEIZABURO , ISHIHARA YUKO , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO , KATAOKA TOSHIYUKI
IPC: C07C225/22 , C08G73/10
Abstract: Disclosed are a novel aromatic diamine; a polyimide comprising 1,3-bis(3-aminobenzoyl)benzene or 4,4 min -bis(3-aminobenzoyl)biphenyl as a diamine component and having recurring structural units represented by the formula (III): wherein R is a tetravalent radical selected from the group consisting of an aliphatic radical having from 2 to 27 carbon atoms, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed aromatic radical connected each other with a direct bond or a bridge member, and X is a divalent radical of or ; and a polyimide having a terminal aromatic group which is essentially unsubstituted or substituted with a radical having no reactivity with amines or dicarboxylic acid anhydrides or a composition comprising said polyimide.
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公开(公告)号：CA2028312C
公开(公告)日：1996-03-12
申请号：CA2028312
申请日：1990-10-23
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAYA NORIMASA , TAMAI SHOJI , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C08G73/12
Abstract: Disclosed is a composition for forming a thermosetting resin having excellent impact resistance and toughness. The composition comprises a bismaleimide compound represented by formula (I): (I) wherein R is a hydrogen atom or methyl, and an amine compound represented by formula (II): (II) wherein X is a radical selected from the group of divalent hydrocarbons having from 1 to 10 carbon atoms, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl, oxo, and O-, or by formula (III)): (III) wherein n is an integer of 0 to 50. Also disclosed is a process for preparing the composition.
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公开(公告)号：DE69012752T2
公开(公告)日：1995-03-02
申请号：DE69012752
申请日：1990-10-24
Applicant: MITSUI TOATSU CHEMICALS
Inventor： TAMAI SHOJI , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
Abstract: A polyimide having a high heat-resistance, good processability and recurring structural units of the formula (I); wherein R is a tetravalent radical selected from the group consisting of an aliphatic radical having at least two carbon atoms, alicyclic radical, monocyclic aromatic radical, fused polycyclic aromatic radical and polycyclic aromatic radical bonded through a direct bond or a bridge member.
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公开(公告)号：DE3689881T2
公开(公告)日：1995-01-05
申请号：DE3689881
申请日：1986-06-30
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OHTA MASAHIRO , KAWASHIMA SABURO , SONOBE YOSHIHO , TAMAI SHOJI , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
Abstract: This new flexible copper-clad circuit board consists of a copper foil bonded firmly and directly without an adhesive to a polyimide (1) film which is fluid at high temperature, the bonding being carried out at high temp.. The polyimide (1) has a repeat unit qwith the general formulae (I), (II), (III), etc. where R; nC-alkyl, nC-cycloalkyl, nC-aromatic, nC-condensed ring aromatic etc. n at least 2.
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公开(公告)号：DE3889380T2
公开(公告)日：1994-12-15
申请号：DE3889380
申请日：1988-05-31
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OHTA MASAHIRO , IIYAMA KATSUAKI , KAWASHIMA SABURO , TAMAI SHOJI , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin composition of this invention consists of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula: l
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Patent Agency Ranking
公开(公告)号：DE68918397D1
公开(公告)日：1994-10-27
申请号：DE68918397
申请日：1989-10-25
Applicant: MITSUI TOATSU CHEMICALS
Inventor： TAMAI SHOJI , KAWASHIMA SABURO , OHTA MASAHIRO , IIYAMA KATSUAKI , OIKAWA HIDEAKI , OHKOSHI KOUJI , YAMAGUCHI AKIHIRO
IPC: C08G73/10
Abstract: The present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carring out condensation of 4,4 min - bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a diamine compound and/or tetracarboxylic acid dianhydride. The polyimides have a non-crystalline structure and exhibit excellent thermal resistance and processability.
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公开(公告)号：DE3888869D1
公开(公告)日：1994-05-11
申请号：DE3888869
申请日：1988-05-27
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OHTA MASAHIRO , KAWASHIMA SABURO , IIYAMA KATSUAKI , TAMAI SHOJI , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
Abstract: The invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention consist of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high-temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is direct bond, thio radical, or o- or p-phenylene dicarbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high-temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula:
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公开(公告)号：DE3788937D1
公开(公告)日：1994-03-10
申请号：DE3788937
申请日：1987-11-12
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OIKAWA HIDEAKI , KOGA NOBUHITO , IIYAMA KATSUAKI , KAWASHIMA SABURO , TAMAI SHOJI , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C08G73/10
Abstract: Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability. The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives. The polyimide has recurring units of the following formula (I): wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage. The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): and successively imidizing the resultant polyamic acid. e
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公开(公告)号：DE3587722D1
公开(公告)日：1994-02-24
申请号：DE3587722
申请日：1985-10-14
Applicant: MITSUI TOATSU CHEMICALS
Inventor： IBI AKIRA , SATO TAKUSHI , YAMAGUCHI AKIHIRO , TAKAHASHI SHIGERU , SHISHIDO SHIGEYUKI , TAMAI SHOJI , NAKAJIMA HISAE
IPC: C08G73/10 , C08J3/12 , C08J5/24 , C09D179/08 , C09J179/08
Abstract: This invention relates to a polyimide powder in use for adhesion and/or coat forming and to a method of preparing said powder, wherein polyamic-acid is chemically imidized. which is obtained by reacting tetracarboxylic acid dianhydride with diamine in organic solvents.This invention further relates to a method for adhesion, and coat forming by using said polyimide powder.This invention still further relates to a method for preparing prepreg by using said polyimide powder, and a method for adhesion and preparing molded laminates by using said prepreg.
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公开(公告)号：DE68905225D1
公开(公告)日：1993-04-15
申请号：DE68905225
申请日：1989-05-04
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OHTA MASAHIRO , IIYAMA KATSUAKI , KAWASHIMA SABURO , TAMAI SHOJI , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
IPC: C08L79/08
Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide.The polyimide consists essentially of recurring units of the following formula: wherein X is and R is, for example, o
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