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公开(公告)号：CN1107978C
公开(公告)日：2003-05-07
申请号：CN94113439.3
申请日：1994-12-31
Applicant: 国际商业机器公司
CPC classification number: H01L24/85 , H01L23/142 , H01L23/3121 , H01L23/3672 , H01L23/49572 , H01L23/49816 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/50 , H01L2224/73265 , H01L2224/73269 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , Y10T29/49144 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种电子封装件，它包括一个坚实的支持元件(例如铜片)，其上固定有封装的半导体芯片以及电路化衬底元件。用导热粘合剂来固定芯片，而电路化衬底(最好是一种柔性电路)用电绝缘粘合剂来固定。最好用引线、热压或热声焊接来使芯片电连接到衬底电路的设定部分。可使用包封剂来覆盖并保护芯片和衬底间的连接。此种封装件本身可以电连接到诸如印刷电路板那样的分立的第二衬底上。
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公开(公告)号：CN1317389A
公开(公告)日：2001-10-17
申请号：CN01112135.1
申请日：2001-03-26
Applicant: 德克萨斯仪器股份有限公司
CPC classification number: H01L23/53238 , H01L21/288 , H01L23/53233 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/04042 , H01L2224/05082 , H01L2224/05111 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05171 , H01L2224/0518 , H01L2224/05184 , H01L2224/05556 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/0568 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4845 , H01L2224/48463 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48669 , H01L2224/4868 , H01L2224/48724 , H01L2224/48739 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48769 , H01L2224/4878 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/4888 , H01L2224/78252 , H01L2224/78253 , H01L2224/85013 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/10253 , H01L2924/14 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/3025 , H01L2924/01004 , H01L2224/78 , H01L2924/00 , H01L2224/48824 , H01L2224/48869 , H01L2224/48744
Abstract: 实现集成电路的互连铜金属化的电气丝/带连接的坚固而可靠的低成本金属结构和工艺。该结构包括沉积在无氧化铜表面上阻止铜扩散的一层阻挡层金属(从镍、钴、铬、钼、钛、钨及其合金中选出)，其厚度能把在250℃下铜的扩散比没有阻挡层金属时减少不止80%；以及最外可焊接层(最外可焊接金属层从金、铂和银中选出)，它能把在250℃下阻挡层金属的扩散比没有可焊接金属时减少不止80%。最后，把一金属丝焊接到最外层以进行冶金连接。
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公开(公告)号：CN1215214A
公开(公告)日：1999-04-28
申请号：CN98120434.1
申请日：1998-10-16
Applicant: 日本电气株式会社
CPC classification number: H01L24/48 , H01B7/38 , H01L24/45 , H01L24/73 , H01L24/85 , H01L2224/05624 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/4569 , H01L2224/4579 , H01L2224/4586 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73265 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/01079 , H01L2924/00014 , H01L2924/01004 , H01L2924/00011 , H01L2224/45138 , H01L2924/00012 , H01L2224/78 , H01L2924/00
Abstract: 本发明的目的是提供用作半导体器件中的键合线的涂层细金属线及使用这种涂层细金属线的半导体器件。根据借助于放射处理去掉涂层细金属线的绝缘层的常规方法,在不损伤细金属线和保证高稳定性的情况下很难去掉绝缘层。根据本发明的涂层细金属线的绝缘层含有颜料或染料并以高效率地吸收激光。通过用具有合适发射波长的激光照射绝缘的一部分,以去掉该部分,绝缘层可以在不损伤细金属线的情况下被完全去掉。
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公开(公告)号：CN1213855A
公开(公告)日：1999-04-14
申请号：CN98118657.2
申请日：1998-08-24
Applicant: 株式会社日立制作所 , 日立超大规模集成电路系统株式会社
CPC classification number: H01L24/06 , H01L23/4951 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/4899 , H01L2224/49171 , H01L2224/73215 , H01L2224/85201 , H01L2224/85205 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01039 , H01L2924/01074 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2224/451 , H01L2924/00 , H01L2924/00012
Abstract: 内引线部分被部分排列在半导体芯片主表面上的LOC(芯片上引线)结构封装件中,公开了一种用来减薄封装件并加快信号传输的技术。具体地说,借助于局部减小排列在半导体芯片主表面上的信号内引线的厚度,在确保了封装件的机械强度的同时,减小了密封树脂的厚度。而且,排列在半导体芯片主表面上的信号内引线被安置成离半导体芯片主表面有一预定的间距。馈送电源的内引线被键合于半导体芯片的主表面,从而提供一种降低了寄生电容的封装件。
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公开(公告)号：CN1208368A
公开(公告)日：1999-02-17
申请号：CN96195559.7
申请日：1996-05-24
Applicant: 福姆法克特公司
IPC: B23K31/02
CPC classification number: H05K3/4015 , B23K20/004 , B23K2101/40 , C23C18/1605 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/06711 , G01R1/06727 , G01R1/07357 , G01R3/00 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L23/66 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/05644 , H01L2224/05647 , H01L2224/06136 , H01L2224/11003 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/16145 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48644 , H01L2224/48647 , H01L2224/48747 , H01L2224/48844 , H01L2224/48847 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2224/48744 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754 , H01L2224/05599
Abstract: 首先可将一些互连元件(752)和/或一些互连元件(752)的接点结构(770)制备在牺牲基片(702)上,以便随后固定到电子零件(784)上。这样,在制备过程中电子零件(784)就不会“处于危险”之中。该牺牲基片(702)在互连元件(752)之间建立了一预定的间隔关系,这些互连元件可以是以较软的细长件(752)为芯并有一较硬(弹性材料)涂层(754)的复合互连元件(752)。互连元件(752)可以制备在接点结构(770)上,也可首先固定到电子零件(784)和这接点结构(770)上,这接点结构是与互连元件(752)的自由端相连接的。本发明还介绍了做成悬臂式的接点结构(770)。
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Patent Agency Ranking
公开(公告)号：CN1171167A
公开(公告)日：1998-01-21
申请号：CN95197034.8
申请日：1995-11-13
Applicant: 佛姆法克特股份有限公司
IPC: H01L23/12
CPC classification number: H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
Abstract: 展现良好机械特性的电子组件的复合中间连接元件,是通过将一软材料(诸如金)定型成一具有弹簧形状(包括悬臂梁、S形、U型)的细长元件(芯子),且在该定形的细长元件上外覆一硬材料(诸如镍及其合金),以赋予所需弹簧(弹性)特性而形成的。一具有优越性质(例如,导电性和/或软焊性)材料的最后的外覆可施加于复合中间连接元件。此细长元件可以由一线、或由一薄片(例如,金属箔)所组成。最终的中间连接元件可以安装在各种电子组件上。
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公开(公告)号：CN1141504A
公开(公告)日：1997-01-29
申请号：CN96106855.8
申请日：1996-05-31
Applicant: 日本电气株式会社
Inventor： 新谷忠之
IPC: H01L21/60
CPC classification number: H01L24/85 , H01L23/4952 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/29339 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/73265 , H01L2224/78268 , H01L2224/78301 , H01L2224/78801 , H01L2224/8502 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01039 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
Abstract: 在一种制造半导体器件的设备中，在第一焊接后即将绝缘体喷涂到连续地由毛细管馈送的焊线上，以使用绝缘体涂敷焊线。在毛细管到达第二焊接位置之前即停止喷涂。然后，当毛细管到达第二焊接位置时进行第二焊接。
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公开(公告)号：CN1110431A
公开(公告)日：1995-10-18
申请号：CN94113439.3
申请日：1994-12-31
Applicant: 国际商业机器公司
IPC: H01L23/36
CPC classification number: H01L24/85 , H01L23/142 , H01L23/3121 , H01L23/3672 , H01L23/49572 , H01L23/49816 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/50 , H01L2224/73265 , H01L2224/73269 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , Y10T29/49144 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种电子封装件，它包括一个坚实的支持元件(例如铜片)，其上固定有封装的半导体芯片以及电路化衬底元件。用导热粘合剂来固定芯片，而电路化衬底(最好是一种柔性电路)用电绝缘粘合剂来固定。最好用引线、热压或热声焊接来使芯片电连接到衬底电路的设定部分。可使用包封剂来覆盖并保护芯片和衬底间的连接。此种封装件本身可以电连接到诸如印刷电路板那样的分立的第二衬底上。
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公开(公告)号：CN85106110B
公开(公告)日：1987-12-09
申请号：CN85106110
申请日：1985-08-13
Applicant: 株式会社东芝
IPC: H01L21/603
CPC classification number: H01L24/97 , H01L24/73 , H01L2224/32245 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85075 , H01L2224/85181 , H01L2224/85201 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/15747 , H01L2924/00014 , H01L2224/83 , H01L2924/00 , H01L2924/00012
Abstract: 一个引线框在充满还原性气体的传送通道中沿传送方向传送。在芯片焊接位置，将半导体芯片放在引线框上。铜或铜合金制做的金属丝提供给相邻的下一个金属丝压焊位置。用气罩包围的氢氧焰来熔化金属丝的下部未端，以形成一个球状体。金属丝由一根毛细管送入到传送通道内。球状体被热压到半导体芯片的电极层上，金属丝的另一端被熔断并在后步压焊位置被热压到引线框的外引线上，从而金属丝被连接在半导体芯片和外引线之间。
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公开(公告)号：CN105047572A
公开(公告)日：2015-11-11
申请号：CN201510101427.5
申请日：2015-03-09
Applicant: 富士电机株式会社
IPC: H01L21/60
CPC classification number: H01L24/78 , B23K20/004 , B23K20/10 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/05599 , H01L2224/29101 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48227 , H01L2224/4847 , H01L2224/73265 , H01L2224/78252 , H01L2224/78313 , H01L2224/78353 , H01L2224/78611 , H01L2224/789 , H01L2224/85048 , H01L2224/85099 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/85207 , H01L2224/85399 , H01L2224/859 , H01L2924/00014 , H01L2924/2076 , H01L2924/20102 , H01L2924/20103 , H01L2924/014 , H01L2924/00 , H01L2924/00015
Abstract: 提供一种能够将直径500μm以上且600μm以下的引线接合到半导体元件上的电极的引线接合装置以及引线接合方法。在本发明的引线接合装置、即通过引线接合来对电极与铝合金制的引线进行电连接的引线接合装置(100)中，具备：引线提供装置(10)，其用于提供直径500μm以上且600μm以下的引线(6)；加热装置(11)，其用于将引线(6)加热到50℃以上且100℃以下；加压装置(12)，其用于在电极(2、7)处对引线(6)进行加压；以及超声波产生装置(13)，其用于对由加压装置(12)加压后的引线(6)施加超声波振动。
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