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    ELECTRONIC SUPPORTS AND METHODS AND APPARATUS FOR FORMING APERTURES IN ELECTRONIC SUPPORTS
    71.
    发明申请
    ELECTRONIC SUPPORTS AND METHODS AND APPARATUS FOR FORMING APERTURES IN ELECTRONIC SUPPORTS 审中-公开
    电子支持的电子支持和方法及设备在电子支持中的形成

    公开(公告)号：WO01063984A1

    公开(公告)日：2001-08-30

    申请号：PCT/US2001/005680

    申请日：2001-02-22

    IPC: B32B5/28 ,  B23Q11/10 ,  B32B27/18 ,  C03C25/10 ,  H05K1/03 ,  H05K3/00

    CPC classification number: H05K1/036 ,  B23Q11/10 ,  C03C25/47 ,  H05K1/0373 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/029 ,  H05K2201/068 ,  H05K2201/0769 ,  H05K2203/127

    Abstract: The present invention provides an electronic support (210) comprising: (A) a prepeg layer (214) comprising: (1) at least one reinforcement material (220); (2) at least one matrix material (216) in contact with at least a portion of the at least one reinforcement material (220); and (B) at least one layer (217) in contact with at least a portion (224) of at least one surface of the prepeg layer (214), the at least one layer (217) comprising at least one inorganic filler (218) and not greater than 25 weight percent of adhesive materials based on the total weight of at least one layer (217) on a total solids basis.

    Abstract translation: 本发明提供了一种电子支撑件（210），包括：（A）预浸层（214），包括：（1）至少一个增强材料（220）; （2）与所述至少一种增强材料（220）的至少一部分接触的至少一种基质材料（216）; 和（B）至少一层与所述预制层（214）的至少一个表面的至少一部分（224）接触的层（217），所述至少一层（217）包含至少一种无机填料 ）和不大于25重量％的基于总固体的至少一层（217）的总重量的粘合剂材料。

    FORMING SIZE COMPOSITIONS, GLASS FIBERS COATED WITH THE SAME AND FABRICS WOVEN FROM SUCH COATED FIBERS
    72.
    发明申请
    FORMING SIZE COMPOSITIONS, GLASS FIBERS COATED WITH THE SAME AND FABRICS WOVEN FROM SUCH COATED FIBERS 审中-公开
    成型尺寸组合物，与其相同的玻璃纤维和来自这种涂布纤维的织物

    公开(公告)号：WO01060756A1

    公开(公告)日：2001-08-23

    申请号：PCT/US2001/005190

    申请日：2001-02-16

    IPC: B05C1/06 ,  B05C11/10 ,  C03C25/10 ,  C03C25/24 ,  C03C25/26 ,  C03C25/32 ,  H05K1/03

    CPC classification number: H05K1/0366 ,  B05C1/06 ,  B05C11/1039 ,  B05C11/1042 ,  C03C25/255 ,  C03C25/26 ,  C03C25/321 ,  C03C25/47 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2203/127 ,  Y10T428/2938

    Abstract: The present invention provides coated fiber strand comprising at least one fiber having a residue of an aqueous forming size composition applied to at least a portion of a surface of the at least one fiber, the aqueous forming size composition comprising: (a) at least one starch; (b) at least one film-forming material; (c) at least one lubricant; and (d) a plurality of discrete particles that provide interstitial space between the at least one fiber and at least one adjacent fibre sufficient to allow wet out of the fiber strand. In one embodiment of the invention, the fibers are glass fibers, the at least one starch comprises an oleophobic starch, the at least one film-forming material comprises a N-vinyl amide polymer, the at least one lubricant comprises an ester, and the particles are dimensionally stable particles selected from polymeric organic materials, non-polymeric organic materials, polymeric inorganic materials, non-polymeric inorganic materials, composite materials and mixtures thereof. In one non-limiting embodiment of the invention, the particles comprise hexagonal boron nitride particles and/or hollow particles formed from a copolymer of styrene and acrylic monomer. The present invention also provides a fabric incorporating the coated fabric strand and an electronic support and an electronic circuit board incorporating the fabric.

    Abstract translation: 本发明提供了包含至少一种具有至少一种纤维的水性成型尺寸组合物的残余物的纤维束，所述水性成型剂组合物包含：（a）至少一种 淀粉; （b）至少一种成膜材料; （c）至少一种润滑剂; 和（d）多个离散的颗粒，其在所述至少一个纤维和至少一个相邻纤维之间提供足够的间隙，以允许从纤维束中脱出。 在本发明的一个实施方案中，所述纤维是玻璃纤维，所述至少一种淀粉包含疏油性淀粉，所述至少一种成膜材料包含N-乙烯基酰胺聚合物，所述至少一种润滑剂包含酯， 颗粒是选自聚合有机材料，非聚合有机材料，聚合物无机材料，非聚合无机材料，复合材料及其混合物的尺寸稳定的颗粒。 在本发明的一个非限制性实施方案中，颗粒包括由苯乙烯和丙烯酸单体的共聚物形成的六方氮化硼颗粒和/或中空颗粒。 本发明还提供了一种结合有涂布织物线束的织物和电子支架以及包含该织物的电子电路板。

    METHOD FOR PRODUCING REWIRING SUBSTRATES FOR SEMICONDUCTOR CHIP PACKAGES
    74.
    发明申请
    METHOD FOR PRODUCING REWIRING SUBSTRATES FOR SEMICONDUCTOR CHIP PACKAGES 审中-公开
    用于生产UMVERDRAHTUNGSSUBSTRATEN用于半导体芯片封装

    公开(公告)号：WO00005765A1

    公开(公告)日：2000-02-03

    申请号：PCT/CH1999/000011

    申请日：1999-01-12

    IPC: H01L21/48 ,  H01L23/495 ,  H05K3/00 ,  H05K3/34

    CPC classification number: H05K3/0041 ,  H01L21/4839 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49572 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01057 ,  H05K3/3478 ,  H05K2201/0166 ,  H05K2203/041 ,  H05K2203/0554 ,  H05K2203/1536 ,  H01L2224/05647 ,  H01L2924/00014

    Abstract: The invention relates to a method for producing rewiring substrates (CSP) for integrated circuit packages using starting materials consisting of a layer of dielectric (1) and one or two layers of electrically conductive material (2, 20). According to said method current paths and contact surfaces (2', 20') are formed in a layer of electrically conductive material (2, 20) by photochemical structuring, access holes and/or access points (1') are formed in the dielectric (1) by plasma ablation and solder balls (3) are placed into the access holes and/or access points (1') and soldered to the current paths and contact surfaces (2', 20'). According to the invention, integrated circuit packages are formed by electrically joining integrated circuits (5) to the current paths and contact surfaces (2') of the rewiring substrates (CSP) created in this way.

    Abstract translation: 本发明涉及一种方法，用于为IC封装的制备Umverdrahtungssubstraten（CSP）的，通过利用一层原料电介质（1）和一个或导电材料（2，20），两个层，其中（在当前路径和焊盘中的光化学结构 2“ 20' ）在导电材料（2层，形成20）中，由（1）被形成在电介质等离子消融进入孔和/或添加（1”）的装置和焊球（3）到所述进入孔和/或 “置于与所述电流路径和焊盘（2加法（1）”，20“）被焊接，并且通过电连接的IC（5）与所述电流路径和焊盘（2”这样形成这些Umverdrahtungssubstrate的）（CSP）IC形成包 是。

    LAMINATE
    75.
    发明申请
    LAMINATE 审中-公开
    层压板

    公开(公告)号：WO1996022597A1

    公开(公告)日：1996-07-25

    申请号：PCT/JP1996000060

    申请日：1996-01-17

    Applicant: NIPPON STEEL CHEMICAL CO., LTD. ,  WATANABE, Hisashi ,  TANAKA, Takashi ,  CHINJU, Hiroyuki ,  OKA, Seigo ,  KAWAMURA, Soichiro ,  HAYAMA, Taeko

    Inventor： NIPPON STEEL CHEMICAL CO., LTD.

    IPC: G11B05/60

    CPC classification number: B32B15/08 ,  B32B15/18 ,  B32B27/281 ,  B32B2311/30 ,  B32B2379/08 ,  B32B2457/00 ,  G03F7/11 ,  G11B5/484 ,  H05K1/0346 ,  H05K1/056 ,  H05K3/002 ,  H05K2201/0154 ,  H05K2201/0166 ,  Y10T428/31681 ,  Y10T428/31699 ,  Y10T428/31721

    Abstract: A laminate comprising a conductor, such as a stainless steel foil, and a polyimide precursor resin layer and a photosensitive resin layer successively formed on the conductor, or a laminate for the preparation of an HDD suspension, comprising a stainless steel foil and a polyimide precursor resin layer and a photosensitive resin layer successively formed on the stainless steel foil. In particular, the use of a resin having repeating units derived from specified aromatic diamine and aromatic carboxylic dianhydride as the polyimide precursor resin enables an insulator to be very easily fabricated on the conductor with high fabrication accuracy and excellent reliability and, when the laminate is used in the production of an HDD suspension, enables an HDD suspension integral with circuit wiring to be provided with high accuracy.

    Abstract translation: 包含不锈钢箔的导体和聚酰亚胺前体树脂层以及依次形成在导体上的感光性树脂层或用于制备HDD悬浮液的层叠体的层叠体，包括不锈钢箔和聚酰亚胺前体 树脂层和依次形成在不锈钢箔上的感光性树脂层。 特别是使用具有来自特定芳香族二胺和芳香族羧酸二酐的重复单元的树脂作为聚酰亚胺前体树脂，能够在制造精度高，可靠性优异的情况下，非常容易地在导体上制造绝缘体，使用层叠体时 在制造HDD悬架时，可以高精度地提供与电路布线集成的HDD悬架。

    表示素子用基板およびその製造方法
    77.
    发明申请
    表示素子用基板およびその製造方法 审中-公开
    用于显示装置的基板及其制造方法

    公开(公告)号：WO2008050547A1

    公开(公告)日：2008-05-02

    申请号：PCT/JP2007/067413

    申请日：2007-09-06

    Applicant: 日東電工株式会社 ,  村重 毅 ,  坂田 義昌 ,  長塚 辰樹

    Inventor： 村重 毅 ,  坂田 義昌 ,  長塚 辰樹

    IPC: G09F9/30 ,  G02F1/1333

    CPC classification number: G02F1/133305 ,  B32B17/064 ,  H05K1/03 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/0166 ,  Y10T156/10 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/266 ,  Y10T428/31525

    Abstract: 　ガスバリア性、柔軟性、耐熱性および透明性に優れ、かつ、寸法安定性、操作性および二次加工性に優れた表示素子用基板が提供される。本発明の表示素子用基板は、無機ガラスと、無機ガラスの両側に配置された樹脂層とを備える。好ましくは、樹脂層の合計厚みｄ ｒｓｕｍ と無機ガラスの厚みｄ ｇ との比ｄ ｒｓｕｍ ／ｄ ｇ は０．５～２．２である。好ましくは、無機ガラスの両側の樹脂層は、それぞれ、同一の材料で構成され、同一の厚みを有し、かつ、それぞれの樹脂層の厚みは無機ガラスの厚みと等しい。好ましくは、表示素子用基板の１７０°Cにおける平均線膨張係数は２０ｐｐｍ°C －１ 以下である。    

    Abstract translation: 公开了一种显示装置用基板，其阻气性，柔软性，耐热性，尺寸稳定性，可操作性和二次加工性优异。 具体公开了一种用于显示装置的基板，其包括无机玻璃和布置在无机玻璃两侧的树脂层。 优选的是，树脂层的总厚度d um um um um um of of the d d d d d d d d d d d d d d d d d d d d d d d d d d d 为0.5-2.2。 更优选地，无机玻璃两侧的树脂层由相同的材料构成，具有与无机玻璃的厚度相等的厚度。 显示装置的基板在170℃下的平均线膨胀系数优选为20ppm·℃以下。

    PASSIVE ELECTRICAL ARTICLE
    78.
    发明申请
    PASSIVE ELECTRICAL ARTICLE 审中-公开
    被动电气文章

    公开(公告)号：WO2007002100A1

    公开(公告)日：2007-01-04

    申请号：PCT/US2006/023998

    申请日：2006-06-21

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： PEIFFER, Joel, S. ,  O'BRYAN, Nelson, B.

    IPC: H05K1/16

    CPC classification number: H05K1/162 ,  H05K1/095 ,  H05K1/16 ,  H05K1/167 ,  H05K3/429 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2203/0361 ,  Y10T29/49082

    Abstract: A passive electrical article includes a first electrically conductive substrate having a major surface and a second electrically conductive substrate having a major surface. The major surface of the second substrate faces the major surface of the first substrate. An electrically resistive layer is on at least one of the major surface of the first substrate and the major surface of the second substrate. An electrically insulative layer is between the first and second substrates and in contact with the electrically resistive layer. The insulative layer is a polymer having a thickness ranging from about 1 µm to about 20 µm. The insulative layer has a substantially constant thickness.

    Abstract translation: 无源电器件包括具有主表面的第一导电衬底和具有主表面的第二导电衬底。 第二基板的主表面面向第一基板的主表面。 电阻层位于第一基板的主表面和第二基板的主表面中的至少一个上。 电绝缘层位于第一和第二基板之间并与电阻层接触。 绝缘层是厚度为约1μm至约20μm的聚合物。 绝缘层具有基本恒定的厚度。

    ELECTRONIC SUPPORTS AND METHODS AND APPARATUS FOR FORMING APERTURES IN ELECTRONIC SUPPORTS
    80.
    发明申请
    ELECTRONIC SUPPORTS AND METHODS AND APPARATUS FOR FORMING APERTURES IN ELECTRONIC SUPPORTS 审中-公开
    电子支持的电子支持和方法及设备在电子支持中的形成

    公开(公告)号：WO0163985A3

    公开(公告)日：2002-04-04

    申请号：PCT/US0105729

    申请日：2001-02-22

    Applicant: PPG IND OHIO INC

    Inventor： DANA DAVID E ,  VELPARI VEDAGIRI ,  XU LANGQIU ,  KAHLE CHARLES F II ,  NOVICH BRUCE E

    IPC: B32B5/28 ,  B23Q11/10 ,  B32B27/18 ,  C03C25/10 ,  H05K1/03 ,  H05K3/00 ,  C08K3/00 ,  C08K3/34

    CPC classification number: H05K1/0373 ,  C03C25/47 ,  H05K1/036 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/029 ,  H05K2201/068 ,  H05K2201/0769 ,  H05K2203/127 ,  Y10T442/20 ,  Y10T442/30 ,  Y10T442/3455

    Abstract: The present invention provides an electronic support (10) comprising: (A) at least one woven fiber reinforcement material (20) formed from at least one fiber free of basalt glass; and (B) at least one matrix material (16) in contact with at least a portion of the at least one reinforcement material (20), the at least one matrix material (16) comprising at least one non-fluorinated polymer and at least one inorganic filler (18), wherein the at least one inorganic filler (18) comprises at least one non-hydratable, lamellar inorganic solid lubricant having a high electrical resistivity and wherein the at least one inorganic filler (18) comprises at least 6 weight percent of a total combined weight of the at least one inorganic filler (18) and the at least one matrix material (16) on a total solids basis.

    Abstract translation: 本发明提供了一种电子支撑件（10），包括：（A）由至少一种不含玄武岩纤维的纤维形成的至少一种编织纤维增强材料（20） 和（B）与所述至少一种增强材料（20）的至少一部分接触的至少一种基质材料（16），所述至少一种基质材料（16）包含至少一种非氟化聚合物和至少 一种无机填料（18），其中所述至少一种无机填料（18）包含至少一种具有高电阻率的不可水合的层状无机固体润滑剂，并且其中所述至少一种无机填料（18）包含至少6重量 所述至少一种无机填料（18）和至少一种基质材料（16）的总组合重量的百分比为总固体量。

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