公开(公告)号：US20010011111A1

公开(公告)日：2001-08-02

申请号：US09815059

申请日：2001-03-23

Applicant: NEC Corporation

Inventor： Yoshitsugu Funada ,  Koji Matsui

IPC: C08L001/00 ,  B05D005/12

CPC classification number: H05K1/0373 ,  C08L63/00 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0218 ,  H05K2201/0254 ,  C08L2666/04 ,  C08L2666/02

Abstract: A resin matrix with resistances to alkali and acid includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative component particles have a particle diameter in the range of 1-20 micrometers.

Abstract translation: 具有对碱和酸的电阻的树脂基体包括绝缘有机颗粒和具有有机组分和无机组分的绝缘复合颗粒中的至少一种，这些颗粒的总量在5-50体积％的范围内，其中 绝缘性有机粒子和绝缘性复合粒子的有机成分被碱或酸腐蚀，其中不小于90体积％的绝缘有机粒子和绝缘成分粒子的粒径在 1-20微米。

公开(公告)号：US06232398B1

公开(公告)日：2001-05-15

申请号：US08986104

申请日：1997-12-05

Applicant: Yoshitsugu Funada ,  Koji Matsui

Inventor： Yoshitsugu Funada ,  Koji Matsui

IPC: C08L6310

CPC classification number: H05K1/0373 ,  C08L63/00 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0218 ,  H05K2201/0254 ,  C08L2666/04 ,  C08L2666/02

Abstract: A resin matrix with resistances to alkali and acid such as a fluorene-containing epoxy acrylate and/or a benzocyclobutene resin includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative composite particles have a particle diameter in the range of 1-20 micrometers.

Abstract translation: 含有芴环氧丙烯酸酯和/或苯并环丁烯树脂的耐酸碱性树脂基体包括绝缘性有机颗粒和具有有机成分和无机成分的绝缘性复合颗粒中的至少一种，其总量为 颗粒在5-50体积％的范围内，其中绝缘有机颗粒和绝缘复合颗粒的有机组分被碱或酸腐蚀，并且其中不小于90体积％的绝缘体 有机颗粒和绝缘复合颗粒的粒径在1-20微米的范围内。

公开(公告)号：US5733639A

公开(公告)日：1998-03-31

申请号：US684136

申请日：1996-06-28

Applicant: Daniel T. Gosselin

Inventor： Daniel T. Gosselin

IPC: B32B5/18 ,  H05K1/03 ,  H05K3/38 ,  B32B3/00 ,  B32B5/14 ,  B32B7/12 ,  B32B27/00

CPC classification number: B32B5/18 ,  H05K1/0313 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0254 ,  H05K2201/0355 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249958 ,  Y10T428/249983 ,  Y10T428/263 ,  Y10T428/2804 ,  Y10T428/31547 ,  Y10T428/31591

Abstract: A laminated circuit board comprising a high frequency, low dielectric, and low dissipation factor foam substrate layer and at least one metal cladding layer laminated to the foam substrate layer. The foam substrate layer is formed of a closed-cell polyisocyanurate rigid foam having a closed-cell structure greater than 95%.

Abstract translation: 一种层压电路板，包括高频，低电介质和低耗散因子泡沫基底层和层压到泡沫基底层上的至少一个金属覆层。 泡沫基材层由闭孔结构大于95％的闭孔聚异氰脲酸酯硬质泡沫形成。

公开(公告)号：US5676781A

公开(公告)日：1997-10-14

申请号：US453365

申请日：1995-05-30

Applicant: Shigenori Aoki ,  Wataru Yamagishi

Inventor： Shigenori Aoki ,  Wataru Yamagishi

IPC: H01L23/13 ,  B32B18/00 ,  H01L21/48 ,  H01L23/12 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  B32B31/26

CPC classification number: B32B18/00 ,  H01L21/4857 ,  H01L21/4867 ,  H05K1/024 ,  H05K1/0306 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/62 ,  C04B2237/68 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4676 ,  Y10T156/1056

Abstract: A method of producing multi-layered ceramic circuit boards comprising laminated, component ceramic layers containing at least one hollow inorganic powder and at least one non-hollow inorganic powder. Signal transmitting conductor patterns of the boards are free from an irregular cross-sectional profile which is caused by particles of the hollow inorganic powder contained in the component ceramic layers. These multi-layered ceramic circuit boards are particularly useful for high speed transmission of digital signals of particularly high frequency.

Abstract translation: 一种制造多层陶瓷电路板的方法，包括含有至少一种中空无机粉末和至少一种非中空无机粉末的层压陶瓷层。 板的信号传输导体图案没有由包含在组分陶瓷层中的中空无机粉末的颗粒引起的不规则横截面轮廓。 这些多层陶瓷电路板对于特别高频的数字信号的高速传输特别有用。

公开(公告)号：US5141972A

公开(公告)日：1992-08-25

申请号：US692767

申请日：1991-04-29

Applicant: Yoshiaki Sato

Inventor： Yoshiaki Sato

IPC: C08K7/22 ,  B29C70/66 ,  C08J9/32 ,  C08J9/40 ,  C08K7/16 ,  C08L101/00 ,  H01B3/00 ,  H01B3/44 ,  H05K1/03

CPC classification number: H05K1/0373 ,  B29C70/66 ,  C08J9/32 ,  C08J9/40 ,  H01B3/445 ,  B29K2105/165 ,  H05K1/034 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0254

Abstract: An insulation material made of rigid microballons within the pores of a porous polymeric base material.

Abstract translation: 在多孔聚合物基材的孔内由刚性微球形成的绝缘材料。

公开(公告)号：US4994316A

公开(公告)日：1991-02-19

申请号：US381753

申请日：1989-07-18

Applicant: James M. Browne ,  James J. Jarvis

Inventor： James M. Browne ,  James J. Jarvis

IPC: H05K1/03 ,  H05K1/05

CPC classification number: H05K1/0373 ,  H05K1/036 ,  H05K1/056 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0254 ,  H05K2201/0323 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/31504

Abstract: An article of manufacture comprising a circuit board construction which comprises a composite of a electronic circuit provided on a dielectric article in which the article comprises a layer of syntactic film.

Abstract translation: 一种包括电路板结构的制品，其包括设置在电介质制品上的电子电路的复合物，其中所述制品包括一层复合膜。

公开(公告)号：US4940623A

公开(公告)日：1990-07-10

申请号：US230401

申请日：1988-08-09

Applicant: Alexander A. Bosna ,  Louis M. Riccio

Inventor： Alexander A. Bosna ,  Louis M. Riccio

IPC: C23C4/02 ,  H05K3/00 ,  H05K3/14 ,  H05K3/38

CPC classification number: H05K3/14 ,  C23C4/02 ,  H05K3/38 ,  H05K2201/0116 ,  H05K2201/0254 ,  H05K2201/2072 ,  H05K2203/0522 ,  H05K2203/107 ,  H05K2203/1344 ,  H05K3/0017 ,  Y10S428/901 ,  Y10T428/24496

Abstract: A method of making printed circuit boards, particularly 3-Dimensional circuit boards, wherein a surface layer of micron sized hollow spheres, beads or spacers are ruptured or fractured in a pattern defining the electrical circuit. The circuit pattern is thermally sprayed with molten copper particles. The molten copper particles shape themselves to the nooks, crannies and undercuts of the fractured spheres or beads to mechanically lock the electrical circuitry to the board. The current carrying capacity can be adjusted by the thickness of the sprayed metal. The overspray does not adhere to smooth non porous surfaces adjacent the fractured spheres or beads.

Abstract translation: 制造印刷电路板，特别是三维电路板的方法，其中微米级中空球，珠或间隔物的表面层以限定电路的图案破裂或断裂。 电路图案用熔融的铜颗粒热喷涂。 熔融的铜颗粒自身形成到断裂的球体或珠的角落，裂缝和底切以将电路机械地锁定到板上。 载流量可以通过喷涂金属的厚度来调节。 过喷不粘附在断裂的球体或珠粒附近的光滑的非多孔表面。

公开(公告)号：US09258892B2

公开(公告)日：2016-02-09

申请号：US14334876

申请日：2014-07-18

Applicant: Rogers Corporation

Inventor： Jessica Crosley

IPC: B32B3/02 ,  H05K1/03 ,  C03C11/00 ,  H05K3/46

CPC classification number: H05K1/0373 ,  C03C11/00 ,  C03C14/00 ,  C03C23/008 ,  C03C2214/12 ,  H05K3/4626 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/24893 ,  Y10T428/249971 ,  Y10T428/249974

Abstract: A circuit subassembly is disclosed comprising a conductive metal layer and a dielectric substrate layer having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz, wherein the composition of the dielectric substrate layer comprises about 5 to about 70 volume percent of borosilicate microspheres that have been treated with an alkaline solution.

Abstract translation: 公开了一种电路子组件，其包括导电金属层和介电常数小于约3.5的电介质基底层，在10GHz下的耗散因数小于约0.006，其中电介质基底层的组成包括约5至约 已经用碱性溶液处理的70体积％的硼硅酸盐微球。

公开(公告)号：US20130341818A1

公开(公告)日：2013-12-26

申请号：US13862893

申请日：2013-04-15

Applicant: MBDA UK Limited

Inventor： Michael Dunleavy ,  Sajad Haq ,  Jason Karl Rew ,  Joseph Maurice Davies

IPC: B29C39/10

CPC classification number: B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

Abstract: A bulk dielectric material comprises a solid composite material comprising a solid matrix material and a plurality of filler elements distributed within the matrix material. The bulk dielectric material has, at a frequency greater than 1 MHz, (i) a permittivity having a real part of magnitude greater than 10 and an imaginary part of magnitude less than 3, and (ii) an electrical breakdown strength greater than 5 kV/mm and has a minimum dimension greater than 2 mm.

Abstract translation: 体电介质材料包括固体复合材料，其包含固体基质材料和分布在基质材料内的多个填料元素。 体积电介质材料具有大于1MHz的频率，（i）具有大于10的实际部分幅度和小于3的虚数部分的介电常数，以及（ii）大于5kV的电击穿强度 / mm，最小尺寸大于2mm。

公开(公告)号：US08440121B2

公开(公告)日：2013-05-14

申请号：US12594569

申请日：2008-04-04

Applicant: Michael Dunleavy ,  Sajad Haq ,  Joseph Maurice Davies ,  Jason Karl Rew

Inventor： Michael Dunleavy ,  Sajad Haq ,  Joseph Maurice Davies ,  Jason Karl Rew

IPC: C04B35/00

CPC classification number: B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

Abstract: A bulk dielectric material can include a solid composite material having a solid matrix material and a plurality of filler elements distributed within the matrix material. The bulk dielectric material can have, at a frequency of greater than 1 MHz, (i) a permittivity with a real part of magnitude greater than 10 and an imaginary part of magnitude less than 3, and (ii) an electrical breakdown strength greater than 5 kV/mm and can have a minimum dimension greater than 2 mm.

Abstract translation: 体电介质材料可以包括具有固体基质材料和分布在基质材料内的多个填料元素的固体复合材料。 大体积电介质材料可以具有大于1MHz的频率，（i）具有大于10的实际部分幅度的电容率和小于3的虚数部分，以及（ii）电击穿强度大于 5 kV / mm，最小尺寸可以大于2 mm。