公开(公告)号：US20240090134A1

公开(公告)日：2024-03-14

申请号：US18515892

申请日：2023-11-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Hirofumi OIE

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K2201/0212 ,  H05K2201/0707 ,  H05K2201/09472 ,  H05K2201/095 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10287

Abstract: An electronic circuit module includes: a substrate; a first electronic component mounted on one main surface of the substrate; a substrate electrode provided on the one main surface; a second electronic component supported on a support surface opposite to a surface facing the one main surface of the first electronic component; a conductor provided on the support surface of the first electronic component; a wire connected to the conductor and the substrate electrode; and a component electrode provided on a surface of the second electronic component and electrically connected to the conductor.

公开(公告)号：US11894175B2

公开(公告)日：2024-02-06

申请号：US17159658

申请日：2021-01-27

Applicant: Applied Materials, Inc.

Inventor： Vasu Mogaveera

IPC: H01F27/28 ,  H01F27/26 ,  H01F27/40 ,  H05K1/02

CPC classification number: H01F27/26 ,  H01F27/2804 ,  H01F27/40 ,  H05K1/0254 ,  H01F2027/408 ,  H05K2201/0707

Abstract: A high voltage power supply is disclosed. The high voltage power supply comprises a primary winding and one or more secondary windings. In one embodiment, a single secondary winding is used and the high voltage doubler circuit comprises a capacitor string and a diode string. In another embodiment, a plurality of secondary windings are used and the high voltage doubler circuit comprises a plurality of low voltage doubler circuits arranged in series. To create a more uniform distribution of voltage across the capacitors in the high voltage doubler circuit, one or more shields are disposed on the printed circuit board. In certain embodiments, a high voltage shield is disposed at the high voltage output and a low voltage shield is disposed at the low voltage end of the high voltage doubler circuit. One or more intermediate shields may be disposed in the high voltage doubler circuit.

公开(公告)号：US11728687B2

公开(公告)日：2023-08-15

申请号：US16538328

申请日：2019-08-12

Applicant: Microsoft Technology Licensing, LLC

Inventor： Casey Sean Callan ,  Stefan Jon Kristjansson ,  Daniel Thomas Nevistic ,  George Karavaev ,  Michael Francis Deily ,  David William Voth ,  Srinivas Reddy Nagampet

IPC: H02J50/10 ,  H02J50/40 ,  H05K3/46

CPC classification number: H02J50/402 ,  H02J50/10 ,  H05K3/4691 ,  H05K2201/0707

Abstract: A device for inductively charging an electronic accessory includes a first portion, a second portion, and a spacer. The first portion includes a first transmission coil in a first plane where the first transmission coil is configured to generate a first magnetic field, and the second portion includes a first transmission coil in a second plane where the second transmission coil is configured to generate a second magnetic field. The spacer is positioned between the first transmission coil and the second transmission coil and between the first plane and the second plane. The spacer material magnetically insulates the second transmission coil from the first magnetic field.

公开(公告)号：US09900980B2

公开(公告)日：2018-02-20

申请号：US15060436

申请日：2016-03-03

Applicant: PPG INDUSTRIES OHIO, INC.

Inventor： Krishna K. Uprety ,  Khushroo H. Lakdawala ,  Alexander Bimanand

IPC: H05K1/09 ,  B32B15/08 ,  B32B15/082 ,  B32B15/09 ,  B32B15/095 ,  B32B15/20 ,  B32B17/10 ,  B32B27/08 ,  B32B27/28 ,  B32B27/30 ,  B32B27/36 ,  B32B27/40 ,  B32B3/08 ,  B32B3/14 ,  B32B3/16 ,  H05B3/84

CPC classification number: H05K1/092 ,  B32B3/08 ,  B32B3/14 ,  B32B3/16 ,  B32B15/08 ,  B32B15/082 ,  B32B15/09 ,  B32B15/095 ,  B32B15/20 ,  B32B17/10 ,  B32B17/10018 ,  B32B17/10192 ,  B32B17/1022 ,  B32B17/10761 ,  B32B17/1077 ,  B32B17/10798 ,  B32B27/08 ,  B32B27/28 ,  B32B27/30 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2369/00 ,  B32B2375/00 ,  B32B2605/006 ,  B32B2605/08 ,  B32B2605/18 ,  G02F1/155 ,  H05B3/84 ,  H05B2203/002 ,  H05B2203/013 ,  H05B2203/017 ,  H05K1/0274 ,  H05K1/0296 ,  H05K1/0353 ,  H05K2201/0707 ,  Y10T156/10 ,  B32B2367/00

Abstract: A transparency including a conductive mesh is disclosed. The conductive mesh is formed by a plurality of inkjet printed electrically conductive lines on a polymer film or a glass, polyacrylate, polycarbonate, or polyurethane substrate, wherein at least one inkjet printed electrically conductive line intersects at least one other inkjet printed electrically conductive line. A flying vehicle including a transparency including a conductive mesh is also disclosed. Additionally, a method of preparing a transparency by laminating a polymer film and a substrate together, wherein a conductive mesh is formed on the polymer film by a plurality of inkjet printed electrically conductive lines, is also disclosed.

公开(公告)号：US20170273183A1

公开(公告)日：2017-09-21

申请号：US15610658

申请日：2017-06-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koichiro KAWASAKI ,  Taku KIKUCHI ,  Takashi KITAHARA ,  Hiroki NOTO

IPC: H05K1/18 ,  H03H9/02 ,  H05K3/30 ,  H01L41/047 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/18 ,  H01L23/00 ,  H01L23/28 ,  H01L23/34 ,  H01L41/047 ,  H01L2924/0002 ,  H03H3/08 ,  H03H9/02834 ,  H03H9/0542 ,  H03H9/059 ,  H03H9/1071 ,  H04B1/38 ,  H05K1/0203 ,  H05K1/0216 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0707 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/00

Abstract: An electronic component includes an electronic component element including first and second main surfaces, a heat-dissipation accelerating member on the first main surface, a sealing resin layer sealing the electronic component element, and a shielding member provided on the sealing resin layer and electrically connected to the heat-dissipation accelerating member. The heat-dissipation accelerating member includes fourth and fifth main surfaces. The electronic component includes a connecting member disposed on the fifth main surface of the heat-dissipation accelerating member and electrically connecting at least one portion of the heat-dissipation accelerating member and the shielding member. The connecting member has a higher thermal conductivity than the sealing resin layer. The contact area between the heat-dissipation accelerating member and the connecting member is smaller than the area of the fifth main surface.

公开(公告)号：US09748625B2

公开(公告)日：2017-08-29

申请号：US15285625

申请日：2016-10-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru Kato ,  Satoshi Ishino ,  Jun Sasaki ,  Kuniaki Yosui ,  Takahiro Baba ,  Nobuo Ikemoto

IPC: H01P3/02 ,  H01P5/00 ,  H05K1/02 ,  H05K1/14 ,  H01P3/08 ,  H05K3/36 ,  H01P5/02

CPC classification number: H01P3/02 ,  H01P3/003 ,  H01P3/026 ,  H01P3/08 ,  H01P3/082 ,  H01P3/085 ,  H01P5/00 ,  H01P5/028 ,  H05K1/0218 ,  H05K1/0221 ,  H05K1/0237 ,  H05K1/0242 ,  H05K1/025 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/14 ,  H05K1/148 ,  H05K1/186 ,  H05K3/361 ,  H05K2201/0707 ,  H05K2201/09218

Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.

公开(公告)号：US09743529B2

公开(公告)日：2017-08-22

申请号：US14024115

申请日：2013-09-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je Lee ,  Dek Gin Yang ,  Dong Gi An ,  Jae Ho Shin

IPC: H05K3/02 ,  H05K3/06 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K3/06 ,  H05K1/0218 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/09 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0707 ,  H05K2203/0554 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: A multilayer rigid flexible printed circuit board including a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

公开(公告)号：US09729188B2

公开(公告)日：2017-08-08

申请号：US15276179

申请日：2016-09-26

Applicant: Electrochem Solutions, Inc.

Inventor： Gregory G. Decker ,  Brian R. Peterson ,  Eric Jankins

IPC: H04B1/40 ,  H02J50/10 ,  H02M7/155 ,  H05K1/02 ,  H05K1/11

CPC classification number: H04B1/40 ,  H02J7/0029 ,  H02J7/025 ,  H02J50/10 ,  H02J50/12 ,  H02J50/80 ,  H02J2007/0037 ,  H02J2007/004 ,  H02M7/155 ,  H04B5/0031 ,  H04B5/0037 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K2201/0707 ,  H05K2201/09609

Abstract: A system for harnessing and conditioning wirelessly transmitted electrical energy by near field magnetic induction configured with various magnetic field shielding embodiments is disclosed. The shielding embodiments are designed to minimize electromagnetic interference and induced electrical current. The system comprises an electrical energy capture circuit and an RF communication circuit. The electrical energy capture circuit conditions and modifies the wirelessly received electrical energy. The RF communication circuit enables the system to wirelessly communicate with its sub-circuits and other energy capture systems. The system comprises a tunable band stop filter that is electrically connected to the RF communication sub-circuit. In addition, the RF communication sub-circuit is configured with opposing electrically conductive plates that isolate and shield the circuit from an oscillating magnetic field.

公开(公告)号：US20170048966A1

公开(公告)日：2017-02-16

申请号：US15235148

申请日：2016-08-12

Applicant: InnoSenT GmbH

Inventor： Stefan Bäuerlein ,  Thilo Lenhard

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  G01S2007/028 ,  H05K1/0218 ,  H05K1/0298 ,  H05K3/0044 ,  H05K2201/048 ,  H05K2201/0707 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2203/0228

Abstract: The invention relates to a radar sensor having a printed circuit board which has an electronic circuit and is equipped with electronic components, and having a shielding cover which covers the printed circuit board and the equipment arranged on said printed circuit board, wherein the shielding cover is formed from a printed circuit board material and has a recess which creates space for accommodating the equipment.

Abstract translation: 本发明涉及一种具有印刷电路板的雷达传感器，该印刷电路板具有电子电路并且配备有电子部件，并且具有覆盖印刷电路板的屏蔽盖和布置在所述印刷电路板上的设备，其中屏蔽盖是 由印刷电路板材料形成并且具有形成用于容纳设备的空间的凹部。

公开(公告)号：US09510489B2

公开(公告)日：2016-11-29

申请号：US14627177

申请日：2015-02-20

Applicant: Cinch Connectivity Solutions, Inc.

Inventor： Robert Joseph Baumler ,  Mark Daniel Dvorak ,  James Richard Kerekes

IPC: H05K9/00 ,  H01R13/03 ,  H01R13/6594 ,  H01R13/6598 ,  H01R24/50 ,  H01R103/00

CPC classification number: H05K9/0064 ,  H01R13/03 ,  H01R13/6594 ,  H01R13/6598 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/18 ,  H05K9/00 ,  H05K9/0066 ,  H05K9/0086 ,  H05K2201/0707

Abstract: The device includes a body and a plurality of contact portions. The body is substantially planar. The plurality of contact portions are associated with the body so as to form ports. The plurality of contact portions are in electrical communication with the body. The port of each contact portion having an inside diameter substantially equal to ID1. The body and the contact portions are constructed of a conductive metallic material.

Abstract translation: 该装置包括主体和多个接触部分。 身体基本上是平面的。 多个接触部分与主体相关联以形成端口。 多个接触部分与身体电连通。 每个接触部分的端口具有基本上等于ID1的内径。 主体和接触部分由导电金属材料构成。