公开(公告)号：EP2101406B1

公开(公告)日：2011-01-12

申请号：EP09164310.6

申请日：2002-04-17

Applicant: Epson Toyocom Corporation

Inventor： Takanashi, Hitoshi ,  Uchiyama, Tsuneo ,  Nagano, Youji ,  Horie, Kyo ,  Watanabe, Noriyuki ,  Shii, Kazuhiro

IPC: H03B5/32 ,  H01B1/18 ,  H05K5/00

CPC classification number: H03H9/1021 ,  H03H9/0547 ,  H03H9/0552 ,  H05K1/181 ,  H05K3/3442 ,  H05K5/0091 ,  H05K2201/10083 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10515 ,  H05K2201/2018 ,  Y02P70/611

Abstract: A piezoelectric oscillator comprising a piezoelectric vibrator with a piezoelectric vibrating element housed in a package and bottom terminals formed on the outer side of the bottom of the package, a circuit board with at least one electronic circuit component mounted and conductor patterns formed on the top side, and columnlike supports which mechanically and electrically connects the bottom terminals of the piezoelectric vibrator and the conductor patterns on the circuit board. The piezoelectric oscillator has a smaller board occupation area, and can be manufactured by quantity production using a batch process at a high productivity and a reduced cost.

公开(公告)号：EP1009202A4

公开(公告)日：2005-08-17

申请号：EP98923088

申请日：1998-06-02

Applicant: IBIDEN CO LTD

Inventor： TSUKADA KIYOTAKA ,  KOBAYASHI HIROYUKI ,  UKAI YOSHIKAZU ,  CHIHARA KENJI ,  TOHYAMA YOSHIHIDE ,  OKUDA YASUYOSHI ,  KODERA YOSHIHIRO

IPC: B23K35/00 ,  B23K35/26 ,  H01L23/498 ,  H05K3/24 ,  H05K3/34

CPC classification number: H05K3/244 ,  B23K35/007 ,  B23K35/262 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T428/12028 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12875 ,  Y10T428/12903 ,  Y10T428/12944 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A soldering member for connection to an external unit, which is joined to a connection terminal having a nickel/gold electroless plating layer on the surface formed correspondingly to a conductor pattern on a printed wiring board. The member comprises a soldering ball containing finely powdered copper, and exhibits excellent strength of junction to the connection terminal.

公开(公告)号：EP1492201A2

公开(公告)日：2004-12-29

申请号：EP04009171.2

申请日：2004-04-16

Applicant: Rexroth Indramat GmbH

Inventor： Amend, Matthias

IPC: H01R12/32

CPC classification number: H05K1/141 ,  H01R12/52 ,  H05K7/142 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: Verbindungsstift 1, der eine Grundplatine 2 mit einer Zusatzplatine 3 unter Einhaltung eines Mindest-Querabstandes der Platinen verbindet, wobei ein Verlötende des Verbindungsstiftes mit einem Einsetz-Längsabschnitt in eine korrespondierende Ausnehmungsgeometrie 25 an der Grundplatine eingreift und im Eingriff dort zu verlöten ist, um bei gleichem bis verringertem Fertigungsaufwand und verringerter Ausschussrate eine zuverlässigere und belastbarere Verbindung zu schaffen, wobei der Einsetz-Längsabschnitt mit dem Verbindungsstift 1 einstückig ausgebildet ist und in seiner Eingriffsstellung mit der Ausnehmungsgeometrie 25 einen Drehformschluss bezüglich einer Verbindungsstift-Längsachse ausbildet, wobei Formschluss-Geometrieelemente der Ausnehmungsgeometrie 25 in der Grundplatine 2 vorgesehen sind.

Abstract translation: 连接销（1）将基板（2）连接到附加板（3），同时保持板的最小距离（4），由此销的焊接端在基板上与相应的适应几何形状接合， 插入件纵向部分并焊接到其中。 插入部分与销一体成型并形成具有接合几何形状的旋转锁定连接，由此形状锁定几何元件设置在底板中。 还包括以下独立权利要求：（a）制造本发明的装置（b）的方法和具有用于本发明的连接销的至少一个容纳几何形状的基板。

公开(公告)号：EP1168445A1

公开(公告)日：2002-01-02

申请号：EP99961416.7

申请日：1999-12-27

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： MORI, Kazuhiro, Mitsubishi Denki ,  KOYAMA, Masato, Mitsubishi Denki

IPC: H01L25/04

CPC classification number: H05K1/141 ,  H01L23/552 ,  H01L24/01 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/145 ,  H05K1/182 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09781 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10636 ,  H05K2201/2036 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/1572 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: An integrated circuit device (1) in accordance with the present invention includes a mother board (2), a module substrate (3), a solder bump (6) and a supporting member (7a). Module substrate (3) is mounted onto mother board (2), and an electronic component (4) is mounted on the front and back surfaces of module substrate (3). Mother board (2) and module substrate (3) are electrically connected through solder bump (6), and supporting member for prohibiting module substrate (3) from inclining is disposed between mother board (2) and module substrate (3).

Abstract translation: 根据本发明的集成电路器件（1）包括母板（2），模块衬底（3），焊料凸块（6）和支撑构件（7a）。 模块基板（3）安装在母板（2）上，电子部件（4）安装在模块基板（3）的正面和背面上。 母板（2）和模块基板（3）通过焊料凸块（6）电连接，在母板（2）和模块基板（3）之间配置阻止模块基板（3）倾斜的支撑部件。

公开(公告)号：EP3373709A1

公开(公告)日：2018-09-12

申请号：EP17159505.1

申请日：2017-03-07

Applicant: Heraeus Deutschland GmbH & Co. KG

Inventor： Ditzel, Eckhard ,  Benedikt, Michael ,  Krueger, Frank ,  Walter, Siegfried ,  Muschelknautz, Christian

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/495 ,  H05K3/28

CPC classification number: H05K1/028 ,  H01L23/4985 ,  H01L25/0753 ,  H01L33/62 ,  H05K3/281 ,  H05K2201/09227 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/2009

Abstract: Ein Trägersubstrat für eine Lichtanwendung, aufweisend zumindest eine elektrisch leitende Trägerschicht (3), wobei die Trägerschicht (3) als vorbestimmtes Muster mit Anschlusspunkten (7a, 7b) für Leuchtmittel ausgestaltet ist und zumindest bereichsweise zumindest drei zumindest abschnittsweise mäanderförmige Leiterbahnen (5a, 5b, 5c) in dem vorbestimmten Muster ausgebildet sind zur Verschaltung der Leuchtmittel, wobei eine äußere Sinuosität zumindest einer äußeren Leiterbahn (5a, 5b) größer ist als eine innere Sinuosität zumindest einer inneren Leiterbahn (5c). Auch betrifft die vorliegende Erfindung ein Verfahren zur Herstellung eines Trägersubstrats.

公开(公告)号：EP2790476B1

公开(公告)日：2018-04-25

申请号：EP12871458.1

申请日：2012-12-13

Applicant: Huawei Technologies Co., Ltd.

Inventor： HUANG, Mingli ,  FENG, Tao ,  LI, Songlin

IPC: H05K3/40 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/144 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/10242

Abstract: Embodiments of the present invention provide a multi-layer printed circuit board and a method for fabricating a multi-layer printed circuit board, which relate to the field of electronics, and can avoid a problem that signal transmission performance is affected by a plated hole. The antenna feeder printed circuit board includes at least two layers of core plates that are adhered, where an antenna feeder circuit mechanical part is disposed on the core plates, a via is also provided on the core plates, and a metal column is embedded in the via, where one end of the metal column is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on the core plate, and the other end is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on an adjacent layer of the core plate. The method is used for fabricating a multi-layer printed circuit board.

公开(公告)号：EP2532216A4

公开(公告)日：2018-04-11

申请号：EP11740411

申请日：2011-02-04

Applicant: BLACK TANK LLC

Inventor： KODADEK III ROBERT E

IPC: H05K1/02 ,  F21V29/67 ,  F21Y115/10

CPC classification number: F21V29/67 ,  F21V29/02 ,  F21V29/673 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10545

Abstract: A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.

公开(公告)号：EP3193360A4

公开(公告)日：2018-04-04

申请号：EP14901571

申请日：2014-09-09

Applicant: SENJU METAL INDUSTRY CO

Inventor： KAWASAKI HIROYOSHI ,  ROPPONGI TAKAHIRO ,  SOMA DAISUKE ,  SATO ISAMU ,  KAWAMATA YUJI

IPC: H01L21/60 ,  B22F1/00 ,  B23K35/26 ,  B23K35/30 ,  C22C9/00 ,  C22C13/00 ,  C25D3/30 ,  C25D3/60 ,  C25D5/12 ,  H01B1/02 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/50 ,  H01L23/522 ,  H05K3/34

CPC classification number: H01L24/13 ,  B22F1/00 ,  B23K35/0227 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/302 ,  B23K35/3615 ,  B32B15/01 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  C22C9/00 ,  C22C13/00 ,  C25D3/30 ,  C25D3/60 ,  C25D5/12 ,  H01B1/026 ,  H01L21/2885 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/76885 ,  H01L23/481 ,  H01L23/50 ,  H01L23/522 ,  H01L24/11 ,  H01L2224/11825 ,  H01L2224/13005 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/1358 ,  H01L2224/13582 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/1369 ,  H01L2924/0002 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0109 ,  H01L2924/01092 ,  H01L2924/35 ,  H05K3/4015 ,  H05K2201/10242

Abstract: Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3µm, and its Vickers hardness is equal to or higher than 20HV and equal to or less than 60HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.

公开(公告)号：EP2996448A1

公开(公告)日：2016-03-16

申请号：EP15181374.8

申请日：2015-08-18

Applicant: Rolls-Royce plc

Inventor： Armstrong, Daniel ,  Cort, Simon

IPC: H05K3/36 ,  H05K1/14

CPC classification number: H01R12/78 ,  F02C7/00 ,  F02C7/32 ,  F05D2230/238 ,  H01R12/61 ,  H01R13/6594 ,  H01R43/205 ,  H05K1/144 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/058 ,  H05K2201/10242 ,  H05K2201/10295 ,  H05K2201/10303 ,  Y02T50/672

Abstract: An electrical assembly is disclosed in which two flexible printed circuits are electrically joined. This allows greater lengths of flexible printed circuits to be provided, for example for gas turbine engine harnesses. Each flexible printed circuit has a terminating region having electrically conductive through holes that are connected to respective electrical tracks of the flexible printed circuit. The terminating regions are adjacent each other in the electrical assembly, and an electrically conductive pin is passed through the aligned through holes, then permanently bonded in position, for example by welding. This results in a robust, reliable connection of two flexible printed circuits.

Abstract translation: 公开了一种电气组件，其中两个柔性印刷电路电连接。 这允许提供更大长度的柔性印刷电路，例如用于燃气涡轮发动机线束。 每个柔性印刷电路具有端接区域，其具有连接到柔性印刷电路的相应电气轨道的导电通孔。 终端区域在电气组件中彼此相邻，并且导电销穿过对准的通孔，然后例如通过焊接永久地粘合就位。 这导致两个柔性印刷电路的牢固，可靠的连接。

公开(公告)号：EP2868171A1

公开(公告)日：2015-05-06

申请号：EP13724836.5

申请日：2013-05-23

Applicant: Sagemcom Broadband SAS

Inventor： KOHN, Stéphane

IPC: H05K3/36 ,  H05K3/34

CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10409 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036

Abstract: The invention concerns a solder spacer comprising an elongate body (102) having one end provided with a tapped hole (104) and an opposite end provided with a transverse support surface (106) from which a smooth centring pin (103) extends protruding, the pin (103) comprising a longitudinal outer passage (108) extending over a least a portion of the length of same to the transverse support surface (106), allowing a molten soldering paste to rise by capillarity to the transverse support surface (106). The invention also concerns a module (112) comprising such a spacer.

Abstract translation: 本发明提供了一种用于焊接的间隔件，其包括细长本体，其一端设置有螺纹孔，并且相对端设置有具有从其突出的平滑定心栓的横向支承表面，所述钉具有延伸至少一部分的纵向外部通道 其长度为横向轴承表面，以使熔融焊料能够通过毛细管力渗透到横向支承表面。 本发明还提供了一种包括这种间隔物的模块。