公开(公告)号：JP5058714B2

公开(公告)日：2012-10-24

申请号：JP2007215189

申请日：2007-08-21

Applicant: スパンション エルエルシー

Inventor： 雅彦 原山 ,  正徳 小野寺 ,  淳二 田中

IPC: H01L21/60

CPC classification number: H05K3/38 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2225/06568 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/20752 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：US20190050054A1

公开(公告)日：2019-02-14

申请号：US16067767

申请日：2017-01-12

Applicant: ELECTROLUX HOME PRODUCTS, INC.

Inventor： Paul Stoufer

IPC: G06F3/01 ,  H05K1/16 ,  H05K1/18

CPC classification number: G06F3/016 ,  G08B6/00 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/09072 ,  H05K2201/1003 ,  H05K2201/10083 ,  H05K2201/10151 ,  H05K2201/1025 ,  H05K2201/10265 ,  H05K2201/10522 ,  Y02P70/611

Abstract: An apparatus such as an appliance with a printed circuit board, PCB, (202) mounted haptic feedback device (200) is provided. The apparatus comprises a printed circuit board (PCB) having an opening (204) defined therein, and a spool (206) affixed to the PCB and having a shaft with a coil (208) wound thereabout. The shaft defines an opening aligned with the opening of the PCB. The apparatus also comprises a spring-loaded plunger positioned and movable within the opening of the shaft. The spring-loaded plunger includes a metallic disk operatively coupled to an end of the plunger and distally positioned to the spool. A control component of the apparatus is configured to energize the coil according to a haptic feedback pattern, and thereby cause the coil to at tract the metallic disk and move the plunger within the opening of the shaft of the spool, and through the opening of the PCB.

公开(公告)号：US20150247629A1

公开(公告)日：2015-09-03

申请号：US14436261

申请日：2013-09-03

Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATION

Inventor： Kiyokazu Hino ,  Takahiro Kurihara

IPC: F21V23/00 ,  F21V19/00

CPC classification number: F21V23/002 ,  F21S43/195 ,  F21S43/37 ,  F21S45/50 ,  F21V19/0025 ,  F21V19/003 ,  F21V19/005 ,  F21V19/0055 ,  F21V23/06 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30 ,  H01R12/58 ,  H01R43/0256 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/1025 ,  H05K2201/1031 ,  H05K2201/10401 ,  Y02P70/611

Abstract: A light emitting device according to the present embodiment includes a substrate on which a wiring portion is provided; a light emitting element which is provided on the substrate and is electrically connected to the wiring portion; a feeding portion to which an electric power is supplied from the outside; a first connection portion which is provided on the substrate and is electrically connected to the wiring portion; a second connection portion which is joined to the first connection portion through soldering and includes a first opening portion into which the feeding portion is inserted; and a soldering portion which is provided between the first opening portion and the feeding portion.

Abstract translation: 根据本实施例的发光器件包括其上设置有布线部分的基板; 发光元件，其设置在所述基板上并与所述布线部电连接; 从外部供给电力的供给部; 第一连接部，其设置在所述基板上并电连接到所述布线部; 第二连接部，其通过焊接接合到所述第一连接部，并且包括第一开口部，所述供给部插入所述第一开口部; 以及设置在第一开口部和供给部之间的焊接部。

公开(公告)号：US08671564B2

公开(公告)日：2014-03-18

申请号：US12554762

申请日：2009-09-04

Applicant: Hueng Jae Oh ,  Tae Joon Chung ,  Dong Gyu Lee ,  Seon Jae Mun ,  Jin Won Choi

Inventor： Hueng Jae Oh ,  Tae Joon Chung ,  Dong Gyu Lee ,  Seon Jae Mun ,  Jin Won Choi

IPC: H01K3/10

CPC classification number: H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12042 ,  H05K3/243 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/1025 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

Abstract translation: 公开了一种用于倒装芯片接合的基板，其中在焊盘和金属柱之间形成基底焊料层，从而提高耐冲击性和安装可靠性。 还提供了一种制造用于倒装芯片接合的基板的方法。

公开(公告)号：US08212156B2

公开(公告)日：2012-07-03

申请号：US12146757

申请日：2008-06-26

Applicant: William Louis Brodsky ,  Mark Kenneth Hoffmeyer

Inventor： William Louis Brodsky ,  Mark Kenneth Hoffmeyer

IPC: H05K7/02 ,  H05K1/11 ,  H01R43/02

CPC classification number: H05K3/4015 ,  H01R12/7082 ,  H05K3/20 ,  H05K3/341 ,  H05K2201/0347 ,  H05K2201/1025 ,  H05K2201/10424 ,  H05K2203/0156 ,  H05K2203/167 ,  Y10T29/49124 ,  Y10T29/49222

Abstract: An enhanced contact metallurgy construction for plastic land grid array (PLGA) modules and printed wiring boards (PWBs). The PWB may, for example, have subcomposite laminate construction and/or a double-sided LGA site. A plurality of preform contacts are each respectively soldered to one of a plurality of metal pads on a PLGA module carrier and/or a PWB. Each of the preform contacts comprises a metal preform base (e.g., copper, nickel) soldered to one of the plurality of metal pads and an electrolytic noble metal plating (e.g., gold) over the metal preform base. An electrolytic non-noble metal underplating (e.g., nickel) may be interposed between the metal preform base and the electrolytic noble metal plating. In one embodiment, the electrolytic non-noble metal underplating is 80-400 microinches thick to provide an enhanced diffusion barrier, and the electrolytic noble metal plating is 30-60 microinches thick and incorporates one or more hardening agents to provide enhanced wear and corrosion resistance.

Abstract translation: 用于塑料焊盘网格阵列（PLGA）模块和印刷电路板（PWB）的增强型接触式冶金结构。 PWB可以例如具有亚复合层压结构和/或双面LGA位点。 多个预成型件触点分别焊接到PLGA模块载体和/或PWB上的多个金属焊盘之一。 每个预成型件触点包括焊接到多个金属焊盘中的一个的金属预制棒基座（例如铜，镍）和在金属预制棒基部上的电解贵金属电镀（例如金）。 可以在金属预制棒基体和电解贵金属电镀之间插入底层电镀非贵金属（例如镍）。 在一个实施方案中，底镀电解非贵金属为80-400微英寸，以提供增强的扩散阻挡层，并且电解贵金属镀层为30-60微英寸，并且包含一种或多种硬化剂以提供增强的耐磨性和耐腐蚀性 。

公开(公告)号：US20100314161A1

公开(公告)日：2010-12-16

申请号：US12554762

申请日：2009-09-04

Applicant: Hueng Jae OH ,  Tae Joon Chung ,  Dong Gyu Lee ,  Seon Jae Mun ,  Jin Won Choi

Inventor： Hueng Jae OH ,  Tae Joon Chung ,  Dong Gyu Lee ,  Seon Jae Mun ,  Jin Won Choi

IPC: H05K1/09 ,  B05D5/12

CPC classification number: H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12042 ,  H05K3/243 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/1025 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

Abstract translation: 公开了一种用于倒装芯片接合的基板，其中在焊盘和金属柱之间形成基底焊料层，从而提高耐冲击性和安装可靠性。 还提供了一种制造用于倒装芯片接合的基板的方法。

公开(公告)号：US20090321125A1

公开(公告)日：2009-12-31

申请号：US12146757

申请日：2008-06-26

Applicant: William Louis Brodsky ,  Mark Kenneth Hoffmeyer

Inventor： William Louis Brodsky ,  Mark Kenneth Hoffmeyer

IPC: H01R43/02 ,  H05K1/11

CPC classification number: H05K3/4015 ,  H01R12/7082 ,  H05K3/20 ,  H05K3/341 ,  H05K2201/0347 ,  H05K2201/1025 ,  H05K2201/10424 ,  H05K2203/0156 ,  H05K2203/167 ,  Y10T29/49124 ,  Y10T29/49222

Abstract: An enhanced contact metallurgy construction for plastic land grid array (PLGA) modules and printed wiring boards (PWBs). The PWB may, for example, have subcomposite laminate construction and/or a double-sided LGA site. A plurality of preform contacts are each respectively soldered to one of a plurality of metal pads on a PLGA module carrier and/or a PWB. Each of the preform contacts comprises a metal preform base (e.g., copper, nickel) soldered to one of the plurality of metal pads and an electrolytic noble metal plating (e.g., gold) over the metal preform base. An electrolytic non-noble metal underplating (e.g., nickel) may be interposed between the metal preform base and the electrolytic noble metal plating. In one embodiment, the electrolytic non-noble metal underplating is 80-400 microinches thick to provide an enhanced diffusion barrier, and the electrolytic noble metal plating is 30-60 microinches thick and incorporates one or more hardening agents to provide enhanced wear and corrosion resistance.

Abstract translation: 用于塑料焊盘网格阵列（PLGA）模块和印刷电路板（PWB）的增强型接触式冶金结构。 PWB可以例如具有亚复合层压结构和/或双面LGA位点。 多个预成型件触点分别焊接到PLGA模块载体和/或PWB上的多个金属焊盘之一。 每个预成型件触点包括焊接到多个金属焊盘中的一个的金属预制棒基座（例如铜，镍）和在金属预制棒基部上的电解贵金属电镀（例如金）。 可以在金属预制棒基体和电解贵金属电镀之间插入底层电镀非贵金属（例如镍）。 在一个实施方案中，底镀电解非贵金属为80-400微英寸，以提供增强的扩散阻挡层，并且电解贵金属镀层为30-60微英寸，并且包含一种或多种硬化剂以提供增强的耐磨性和耐腐蚀性 。

公开(公告)号：US20080061434A1

公开(公告)日：2008-03-13

申请号：US11852179

申请日：2007-09-07

Applicant: Ky-Hyun JUNG ,  Wha-Su SIN ,  Heui-Seog KIM ,  Sang-Jun KIM ,  Jun-Young KO

Inventor： Ky-Hyun JUNG ,  Wha-Su SIN ,  Heui-Seog KIM ,  Sang-Jun KIM ,  Jun-Young KO

IPC: H01L23/488 ,  H01K3/22

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K3/285 ,  H05K3/3452 ,  H05K3/4092 ,  H05K2201/0215 ,  H05K2201/0245 ,  H05K2201/0397 ,  H05K2201/1025 ,  Y02P70/613 ,  Y10T29/49158 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A substrate for a semiconductor package and a method of manufacturing the same are provided. More particularly, the substrate for the semiconductor package and the method for manufacturing the same include metal pieces, with some of the metal pieces having one end embedded within an insulating layer for insulating an external connection electrode of the substrate and the other end embedded within a solder. The substrate for the semiconductor package has the effects of preventing or retarding a connection failure in a solder connection portion by blocking or retarding the propagation of a crack, and allowing a solder to be easily permeated under the metal pieces and formed at a desired position.

Abstract translation: 提供一种半导体封装用基板及其制造方法。 更具体地，用于半导体封装的衬底及其制造方法包括金属片，其中一些金属片的一端嵌入绝缘层内，用于绝缘衬底的外部连接电极，另一端嵌入 焊接。 用于半导体封装的衬底具有通过阻止或延迟裂纹的传播来防止或延迟焊料连接部分中的连接故障的效果，并且允许焊料容易地渗透在金属片下方并形成在期望的位置。

公开(公告)号：US20080023852A1

公开(公告)日：2008-01-31

申请号：US11495678

申请日：2006-07-31

Applicant: Yu-Cheng Huang ,  Tzu-Chih Lin

Inventor： Yu-Cheng Huang ,  Tzu-Chih Lin

IPC: H01L23/48

CPC classification number: H05K3/244 ,  H05K3/4015 ,  H05K2201/1025 ,  H05K2203/0338

Abstract: A metal pad of mode dial and a manufacturing method thereof, wherein the metal pad is disposed on a substrate and the metal pad comprises at least one metal base pad and at least one conductive foil layer. The conductive foil layer is fixed on the metal base pad in an attached way instead of plating with gold on the metal base pad to reduce production costs so as to prevent oxidization of the metal base pad.

Abstract translation: 一种模式拨盘的金属焊盘及其制造方法，其中金属焊盘设置在基板上，金属焊盘包括至少一个金属基焊盘和至少一个导电箔层。 导电箔层以连接的方式固定在金属基垫上，而不是在金属基底垫上镀金，以降低生产成本，从而防止金属基垫的氧化。

公开(公告)号：US20060043608A1

公开(公告)日：2006-03-02

申请号：US10711185

申请日：2004-08-31

Applicant: William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

Inventor： William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

IPC: H01L23/48

CPC classification number: H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Abstract translation: 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。