公开(公告)号：EP2329696A4

公开(公告)日：2012-05-02

申请号：EP09815607

申请日：2009-09-23

Applicant: BYD CO LTD

Inventor： WANG PING

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34 ,  H05K7/14

CPC classification number: H05K3/3447 ,  H05K1/119 ,  H05K3/42 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10333 ,  H05K2201/10409

公开(公告)号：EP1486105B1

公开(公告)日：2009-09-30

申请号：EP03723786.4

申请日：2003-03-20

Applicant: Andrew LLC

Inventor： BUONDELMONTE, Charles, J. ,  MENDELSOHN, Joseph, Patrick ,  BROWN, Richard, William ,  LI, Min ,  SCHWARTZ, Richard, Franklin ,  UPASANI, Sanjay, Sudhakar

IPC: H05K3/36

CPC classification number: H05K3/368 ,  B23K2201/42 ,  H01R12/523 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10871 ,  H05K2201/10962 ,  H05K2203/0415 ,  Y10T29/53174

Abstract: A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole. Upon heating to a solder reflow temperature, a ring of solder, around the periphery of the head portion of the pin and the shoulder portion of the socket, flows under the head of the pin and the shoulder of the socket, thereby forming a soldered electrical connection between the pin and the first board, and the socket and the second board. By aligning the pin with the socket and inserting the tail portion of the pin into the cavity of the socket, a separable reliable mechanical and electrical interconnection is formed between the first board and the second board.

公开(公告)号：EP0268890B1

公开(公告)日：1992-02-26

申请号：EP87116267.3

申请日：1987-11-05

Applicant: Inotec Electronics GmbH

Inventor： Schmitt, Fred R.

IPC: H01R9/09

CPC classification number: H05K3/222 ,  H01R12/58 ,  H01R12/718 ,  H05K2201/10333

公开(公告)号：EP0364056A3

公开(公告)日：1991-04-17

申请号：EP89202587.5

申请日：1989-10-13

Applicant: Menzies, L. William, Jr. ,  Menzies, Stephen W.

Inventor： Menzies, L. William, Jr. ,  Menzies, Stephen W.

IPC: H01L23/64 ,  H01G4/40

CPC classification number: H01G2/065 ,  H01G4/35 ,  H01G4/40 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/049 ,  H05K2201/10333 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10939 ,  Y02P70/611 ,  H01L2924/00

Abstract: A decoupling capacitor (40) is mounted on a thin auxiliary board (20) and connected by metallization traces (37, 33) on the board to a single pair of plug-in contacts (50, 51) press-fitted into a pair of apertures (36) in a pair of integral tabs (31, 32) extending from the board (30). The auxiliary board (20) and capacitor (40) height is not more than about 0.070 inches. The plug-in contacts (50, 51) are pluggable into a pair of sockets in a printed circuit board. The auxiliary insulative board (20) with its attached capacitor (40) is sandwiched between a surface of a printed circuit board (12) having a plurality of sockets, and the underside of a dual-in-line (DIP) integrated circuit package (11). At least two leads (15a, 14x) of the DIP package (11) are inserted into the pair of insertable contacts (50, 51) in the auxiliary insulative board (20) while the remainder of the DIP package leads are inserted directly into other sockets in the printed circuit board (16a, 16x, 17a, 17x). In one embodiment, other DIP leads pass through clearance holes (69, 68) in a second pair of integral tabs (63, 65). Another embodiment provides for redundant capacitors each connected to separate pairs of contacts (82, 83; 84, 85) on the auxiliary board (81) for interconnection of two ground leads and two power leads of the DIP to respective PC board sockets.

公开(公告)号：EP0162474B1

公开(公告)日：1990-05-23

申请号：EP85106413.9

申请日：1985-05-24

Applicant: FUJITSU LIMITED

Inventor： Tanibe, Norio

IPC: H05K9/00 ,  H05K3/30

CPC classification number: H04M1/0277 ,  H01R12/58 ,  H01R12/718 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/308 ,  H05K3/368 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10371 ,  H05K2201/10871

公开(公告)号：EP0364056A2

公开(公告)日：1990-04-18

申请号：EP89202587.5

申请日：1989-10-13

Applicant: Menzies, L. William, Jr. ,  Menzies, Stephen W.

Inventor： Menzies, L. William, Jr. ,  Menzies, Stephen W.

IPC: H01L23/64 ,  H01G4/40

CPC classification number: H01G2/065 ,  H01G4/35 ,  H01G4/40 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/049 ,  H05K2201/10333 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10939 ,  Y02P70/611 ,  H01L2924/00

Abstract: A decoupling capacitor (40) is mounted on a thin auxiliary board (20) and connected by metallization traces (37, 33) on the board to a single pair of plug-in contacts (50, 51) press-fitted into a pair of apertures (36) in a pair of integral tabs (31, 32) extending from the board (30). The auxiliary board (20) and capacitor (40) height is not more than about 0.070 inches. The plug-in contacts (50, 51) are pluggable into a pair of sockets in a printed circuit board. The auxiliary insulative board (20) with its attached capacitor (40) is sandwiched between a surface of a printed circuit board (12) having a plurality of sockets, and the underside of a dual-in-line (DIP) integrated circuit package (11). At least two leads (15a, 14x) of the DIP package (11) are inserted into the pair of insertable contacts (50, 51) in the auxiliary insulative board (20) while the remainder of the DIP package leads are inserted directly into other sockets in the printed circuit board (16a, 16x, 17a, 17x). In one embodiment, other DIP leads pass through clearance holes (69, 68) in a second pair of integral tabs (63, 65). Another embodiment provides for redundant capacitors each connected to separate pairs of contacts (82, 83; 84, 85) on the auxiliary board (81) for interconnection of two ground leads and two power leads of the DIP to respective PC board sockets.

Abstract translation: 去耦电容器（40）安装在薄辅助板（20）上，并且通过板上的金属化引线（37,33）连接到一对插入式接头（50,51）上， 一对从板（30）延伸的一对整体式突片（31,32）中的孔（36）。 辅助板（20）和电容器（40）的高度不大于约0.070英寸。 插入式触点（50,51）可插入印刷电路板中的一对插座中。 具有附加电容器（40）的辅助绝缘板（20）夹在具有多个插座的印刷电路板（12）的表面和双列直插（DIP）集成电路封装 11）。 DIP封装（11）的至少两个引线（15a，14x）插入到辅助绝缘板（20）中的一对可插入触点（50,51）中，而DIP封装引线的其余部分直接插入其他 印刷电路板（16a，16x，17a，17x）中的插座。 在一个实施例中，其它DIP引线通过第二对整体接头（63,65）中的间隙孔（69,68）。 另一个实施例提供了冗余电容器，每个冗余电容器分别连接到辅助板（81）上的分离的触点对（82,83,84,85），用于将两个接地引线和DIP的两个电源引线互连到相应的PC板插槽。

公开(公告)号：EP0139662A4

公开(公告)日：1987-04-14

申请号：EP84900935

申请日：1984-02-06

Applicant: ADVANCED INTERCONNECTIONS

Inventor： MURPHY JAMES V

IPC: B23P19/02 ,  B23P19/00 ,  B23P21/00 ,  B65D73/00 ,  H01R4/02 ,  H01R43/20 ,  H05K3/30 ,  H05K3/34 ,  H05K13/04 ,  B23P17/00 ,  B65D73/02

CPC classification number: B65D73/0042 ,  H01R4/02 ,  H01R12/58 ,  H01R12/65 ,  H01R43/205 ,  H05K3/306 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2203/0195 ,  Y10T29/4987 ,  Y10T29/49876

Abstract: An improved method and construction for positioning a plurality of socket terminals (34) on an electrical circuit board (22) in a predetermined configuration prior to the solder connection thereto. A sheet of electrically insulative, flexible, resinous plastic material (30, 30a) is provided with a plurality of holes (32, 32a) in an array conforming to the desired positioning of the sockets on the circuit boards. The socket terminals are provided with an enlarged generally cylindrical head (50) including an intermediate groove (68) such that the heads extend into the holes (32, 32a) and are adapted for frictional snap engagement with the sheet (30, 30a). The sheet with the array of sockets temporarily held thereby is positioned on the circuit board which is then conventionally soldered so as to electrically and mechanically fix the sockets to the boards. Thereafter, the sheet may be removed. The enlarged head (50) of the circuit terminal is provided with leading edge sheet contacting surface (66) to enable the terminals to be push positioned into the holes without injuring the sheet.

公开(公告)号：EP0139662A1

公开(公告)日：1985-05-08

申请号：EP84900935.0

申请日：1984-02-06

Applicant: ADVANCED INTERCONNECTIONS, INC.

Inventor： MURPHY, James, V.

IPC: B23P19 ,  B23P21 ,  B65D73 ,  H05K3 ,  H05K13 ,  H01R4 ,  H01R43

CPC classification number: B65D73/0042 ,  H01R4/02 ,  H01R12/58 ,  H01R12/65 ,  H01R43/205 ,  H05K3/306 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2203/0195 ,  Y10T29/4987 ,  Y10T29/49876

Abstract: Construction et procédé améliorés de positionnement d'une pluralité de bornes femelles (34) sur une plaque de circuit électrique (22) selon une configuration prédéterminée avant le soudage. Une feuille de matériau plastique résineux flexible électriquement isolante (30, 30a) est pourvue d'une pluralité de trous (32, 32a) selon une matrice conforme au positionnement désiré des bornes sur les circuits imprimés. Les bornes femelles sont pourvues d'une tête élargie généralement cylindrique (50) comprenant une rainure intermédiaire (68) permettant à la tête de s'étendre dans les trous (32, 32a) et sont conçues pour s'engager par déclic à friction dans la feuille (30, 30a). La feuille avec le réseau de bornes qu'elle contient temporairement est positionnée sur la plaque de circuit qui est alors soudée de manière conventionnelle afin de fixer électriquement et mécaniquement les bornes sur les plaques. La feuille peut ensuite être enlevée. La tête élargie (50) de la borne de circuit est pourvue d'une surface de contact de feuille de bord d'attaque (66) permettant aux bornes femelles d'être positionnées par pression dans les trous sans abîmer la feuille.

公开(公告)号：JP6007413B2

公开(公告)日：2016-10-12

申请号：JP2013546505

申请日：2012-05-30

Applicant: パナソニックIPマネジメント株式会社

Inventor： 齋藤 孝夫 ,  大島 誠

IPC: H01R4/02 ,  H01R4/38 ,  H05K1/18

CPC classification number: H01R12/515 ,  H01R12/58 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/10333

公开(公告)号：JPWO2013179403A1

公开(公告)日：2016-01-14

申请号：JP2013546505

申请日：2012-05-30

Applicant: パナソニックIpマネジメント株式会社

Inventor： 孝夫 齋藤 ,  孝夫 齋藤 ,  誠 大島 ,  誠 大島

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H01R12/515 ,  H01R12/58 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/10333

Abstract: 【課題】配線基板に取り付けられる端子台における発熱を抑えることができる配線基板を提供することを目的とする。【解決手段】配線パターン11と、足31を有し半田付可能な板部材から折り曲げ構成された端子台13と、配線パターン11とこの配線パターン上に配置される端子台13とを接続するための半田付部14と、半田付部14に設けられ足31が挿入されるスルーホール12と、を備え、足31をスルーホール12内に挿入して半田接続する配線基板10において、半田付部14上に端子台13に沿って配置される半田付け可能な金属線17を備え、半田付けに際して、スルーホール12を介して供給される半田で半田付部14、端子台13、及び金属線17が一体に半田付けされる。【選択図】図1

Abstract translation: 本发明的一个目的是提供一种能够被安装在布线板抑制端子块的发热的布线基板。 和布线图案11，其构成从弯曲可焊接板件的接线盒13具有一个底部31，以在东光布线图案设置在配线图案11的端子台13连接 焊接部14，贯通孔设置在所述焊接部1412英尺31插入，设置有，在布线基板10连接的焊料插入脚31中的通孔12，钎焊部 包括在所述14可焊金属丝沿端子台13设置17，在焊接过程中，在通过贯通孔12，端子台13和金属线供给的焊料焊接部14 17 有焊接在一起。 点域1