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    카메라 모듈의 하우징 구조
    72.
    发明授权
    카메라 모듈의 하우징 구조 失效
    摄像机模块的住房结构

    公开(公告)号：KR100863798B1

    公开(公告)日：2008-10-16

    申请号：KR1020070039667

    申请日：2007-04-24

    Applicant: 삼성전기주식회사

    Inventor： 최재호 ,  최형민

    IPC: H04N5/225

    CPC classification number: H04N5/2252 ,  H04N5/2254 ,  H04N5/2257 ,  H05K2201/10537

    Abstract: A housing structure of a camera module is provided to enable overflow preventing grooves to be formed in at least one inner surface of a lower wall of a housing, thereby preventing a bonding agent from overflowing to the outside of the housing to improve the reliability of the housing structure. A housing structure(100) of a camera module includes an IR(Infrared) filter mounting portion(140), a substrate supporting portion(120), and a lower wall(110). An IR filter is mounted on the IR filter mounting portion. The IR filter cuts off infrared rays in light incident from an upper portion at an inner arbitrary point. An outline portion of a substrate is closely coupled to the substrate supporting portion in the lower part of the IR filter mounting portion. A plurality of parts is mounted on the substrate. The lower wall is extended to the lower part of the substrate supporting portion. The lower wall has overflow preventing grooves(111). The overflow preventing grooves prevents an outflow of a bonding agent interposed between the substrate supporting portion and the outline portion of the substrate.

    Abstract translation: 提供一种照相机模块的壳体结构，以使得能够在壳体的下壁的至少一个内表面中形成溢出防止槽，从而防止粘合剂溢出到壳体的外部，从而提高了壳体的可靠性 住房结构。 相机模块的壳体结构（100）包括IR（红外）滤光器安装部分（140），基板支撑部分（120）和下壁（110）。 IR滤光片安装在IR滤光片安装部分上。 IR滤光器在内部任意点从上部入射的光截断红外线。 衬底的轮廓部分紧密地耦合到IR过滤器安装部分的下部中的衬底支撑部分。 多个部件安装在基板上。 下壁延伸到基板支撑部分的下部。 下壁具有溢流防止槽（111）。 溢流防止槽防止插入在基板支撑部分和基板的轮廓部分之间的粘合剂的流出。

    소자들이 냉각되는 회로 장치 및 그에 따른 냉각 방법
    73.
    发明公开
    소자들이 냉각되는 회로 장치 및 그에 따른 냉각 방법 无效
    用于冷却组件的电路装置，包括要冷却的元件和电感元件和冷却方法的核心之间的导热矩阵

    公开(公告)号：KR1020040081009A

    公开(公告)日：2004-09-20

    申请号：KR1020040014973

    申请日：2004-03-05

    Applicant: 파텐트-트로이한트-게젤샤프트 퓌어 엘렉트리쉐 글뤼람펜 엠베하

    Inventor： 그라브너,마르틴 ,  빗차니,프리드리히

    IPC: H05K7/20

    CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/433 ,  H01L2924/0002 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10689 ,  H01L2924/00

    Abstract: PURPOSE: A circuit apparatus for cooling components, including a thermal conduction mat inserted between element to be cooled and a core of an inductive element and a cooling method are provided to effectively cool components of electronic circuit by using a small space. CONSTITUTION: A circuit apparatus comprises a radiator type electric element including an inductive element(4) having a core; and a thermal conduction element(3) arranged between an element(2) to be cooled and the radiator type electric element such that the element to be cooled and the radiator type electric element directly contact so as to remove heat from the element to be cooled. The thermal conduction element includes an elastic mat.

    Abstract translation: 目的：提供一种用于冷却部件的电路装置，包括插入待冷却元件和感应元件芯之间的导热垫和冷却方法，以通过使用较小的空间来有效地冷却电子电路的部件。 构成：电路装置包括散热器型电元件，其包括具有芯的电感元件（4） 和布置在要冷却的元件（2）和散热器型电气元件之间的导热元件（3），使得待冷却元件和散热器型电气元件直接接触，以便从要冷却的元件去除热量 。 导热元件包括弹性垫。

    INPUT DEVICE FOR DETECTING AN EXTERNAL INPUT
    77.
    发明公开
    INPUT DEVICE FOR DETECTING AN EXTERNAL INPUT 有权
    用于检测外部输入的输入设备

    公开(公告)号：EP2922077A3

    公开(公告)日：2015-10-14

    申请号：EP15158577.5

    申请日：2015-03-11

    Applicant: Samsung Electronics Co., Ltd

    Inventor： Song, Kyunghoon ,  Bang, Jungje ,  Bae, Kicheol ,  Lee, Kwangsub ,  Jang, Seyoung

    IPC: H01H13/48 ,  H01R9/24

    CPC classification number: G06F3/0202 ,  H01H13/48 ,  H01H2215/004 ,  H01H2215/036 ,  H01H2221/05 ,  H01R13/703 ,  H01R24/62 ,  H05K1/184 ,  H05K2201/09163 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10537

    Abstract: An input device comprising a connector (310), a switch (320), a substrate (330) and a key base (340). The connector is configured to recognise a connection of an external device, the connector including a first surface (313). The switch is located at the first surface of the connector, the switching being configured to connect an electrical signal when subjected to a physical input equal to or exceeding a threshold pressure, the switch including a connection terminal (311). The substrate is connected to the connection terminal of the switch and mounted on the first surface of the connector at a position at which the switch is not located. The key base is configured to actuate the switch.

    Abstract translation: 一种输入设备，包括连接器（310），开关（320），基板（330）和键座（340）。 该连接器被配置为识别外部设备的连接，该连接器包括第一表面（313）。 开关位于连接器的第一表面处，所述开关被配置为当经受等于或超过阈值压力的物理输入时连接电信号，所述开关包括连接端子（311）。 基板连接到开关的连接端子，并安装在连接器的第一表面上开关不在的位置。 钥匙底座配置为启动开关。

    INPUT DEVICE FOR DETECTING AN EXTERNAL INPUT
    78.
    发明公开
    INPUT DEVICE FOR DETECTING AN EXTERNAL INPUT 有权
    EINGABEVORRICHTUNG ZUR ERFASSUNG EINERÄUSSERENEINGABE

    公开(公告)号：EP2922077A2

    公开(公告)日：2015-09-23

    申请号：EP15158577.5

    申请日：2015-03-11

    Applicant: Samsung Electronics Co., Ltd

    Inventor： Song, Kyunghoon ,  Bang, Jungje ,  Bae, Kicheol ,  Lee, Kwangsub ,  Jang, Seyoung

    IPC: H01H13/48 ,  H01R9/24

    CPC classification number: G06F3/0202 ,  H01H13/48 ,  H01H2215/004 ,  H01H2215/036 ,  H01H2221/05 ,  H01R13/703 ,  H01R24/62 ,  H05K1/184 ,  H05K2201/09163 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10537

    Abstract: An input device comprising a connector (310), a switch (320), a substrate (330) and a key base (340). The connector is configured to recognise a connection of an external device, the connector including a first surface (313). The switch is located at the first surface of the connector, the switching being configured to connect an electrical signal when subjected to a physical input equal to or exceeding a threshold pressure, the switch including a connection terminal (311). The substrate is connected to the connection terminal of the switch and mounted on the first surface of the connector at a position at which the switch is not located. The key base is configured to actuate the switch.

    Abstract translation: 一种输入装置，包括连接器（310），开关（320），基板（330）和键座（340）。 连接器被配置为识别外部设备的连接，该连接器包括第一表面（313）。 所述开关位于所述连接器的第一表面处，所述开关被配置为当受到等于或超过阈值压力的物理输入时连接电信号，所述开关包括连接端子（311）。 基板连接到开关的连接端子，并且在开关不位于的位置处安装在连接器的第一表面上。 钥匙座配置为启动开关。

    VERTICAL DIE CHIP-ON-BOARD
    79.
    发明公开
    VERTICAL DIE CHIP-ON-BOARD 审中-公开
    CHIP-ON-BOARD MIT VERTIKALEM芯片

    公开(公告)号：EP1718984A1

    公开(公告)日：2006-11-08

    申请号：EP05723703.4

    申请日：2005-02-25

    Applicant: Honeywell International Inc.

    Inventor： WAN, Hong ,  BRATLAND, Tamara, K. ,  BEHLINGER, Michael, J. ,  JENSEN, Ronald, J.

    IPC: G01R33/02

    CPC classification number: G01R33/0206 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/4903 ,  H01L2224/73265 ,  H05K1/181 ,  H05K2201/10151 ,  H05K2201/10454 ,  H05K2201/1053 ,  H05K2201/10537 ,  Y02P70/611 ,  Y10T29/49002 ,  H01L2924/00014

    Abstract: Methods and apparatus for vertical chip-on-board sensor packages can comprise a vertical sensor circuit component comprising a first face, a second face, a bottom edge, a top edge, two side edges, input/output (I/O) pads and at least one sensitive direction wherein the I/O pads are arranged near the bottom edge. Such vertical die chip-on-board sensor packages can also comprise one or more horizontal sensor circuit components comprising a top face, a printed circuit board (PCB) mounting face, a vertical sensor circuit component interface edge, two or more other edges, and one or more sensitive directions wherein the vertical sensor circuit component interface edge supports the vertical sensor circuit component along the Z axis and conductively or non-conductively connects to the vertical sensor circuit component. The methods and apparatus provided include a multi-axis magnetometer for measuring the magnetic field intensity along three orthogonal axes comprising one or more magnetic field sensing circuit components mounted by their PCB mounting face to a PCB and a vertical magnetic sensor circuit component mounted to the PCB such that the vertical magnetic sensor circuit component is attached to and supported by the magnetic field sensing circuit component.

    Abstract translation: 用于垂直芯片对板传感器封装的方法和装置可以包括垂直传感器电路部件，其包括第一面，第二面，底部边缘，顶部边缘，两个侧边缘，输入/输出（I / O）焊盘和 至少一个敏感方向，其中I / O焊盘设置在底部边缘附近。 这种垂直芯片片上传感器封装还可以包括一个或多个水平传感器电路部件，其包括顶面，印刷电路板（PCB）安装面，垂直传感器电路部件接口边缘，两个或更多个其他边缘，以及 一个或多个敏感方向，其中垂直传感器电路部件接口边缘沿着Z轴支撑垂直传感器电路部件，并且导电或非导电地连接到垂直传感器电路部件。 提供的方法和装置包括用于沿着三个正交轴测量磁场强度的多轴磁力计，包括一个或多个由其PCB安装面安装到PCB的磁场感测电路部件和安装到PCB的垂直磁传感器电路部件 使得垂直磁传感器电路部件附接到磁场感测电路部件并由其支持。

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