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公开(公告)号:CA2851839C
公开(公告)日:2020-09-15
申请号:CA2851839
申请日:2012-10-17
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , SANCHEZ NEVADA , CHARVAT GREGORY , RALSTON TYLER
Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index ofrefraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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公开(公告)号:CA181031S
公开(公告)日:2020-07-16
申请号:CA181031
申请日:2018-04-25
Applicant: BUTTERFLY NETWORK INC
Abstract: The design is the features of shape, configuration and ornament of the portions of the ultrasound probe as shown in solid lines in the drawings. The portions shown in stippled lines do not form part of the design. The dot-dash broken lines illustrate boundaries of the design and do not form part of the design. The length varies within the break lines. Drawings of the design are included. FIG. 1 is a bottom, front, right side perspective view of an ULTRASOUND PROBE showing the design; FIG. 2 is a front elevation view thereof; FIG. 3 is a rear elevation view thereof; FIG. 4 is a left side elevation view thereof; FIG. 5 is a right side elevation view thereof; FIG. 6 is a top plan view thereof; and FIG. 7 is a bottom plan view thereof.
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公开(公告)号:AU2015247484B2
公开(公告)日:2020-05-14
申请号:AU2015247484
申请日:2015-04-17
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , FIFE KEITH G , SANCHEZ NEVADA J , ALIE SUSAN A
IPC: H01L27/06 , A61B5/02 , A61B8/00 , B06B1/02 , B81C1/00 , H01L21/768 , H01L27/092
Abstract: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.
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公开(公告)号:CA3111475A1
公开(公告)日:2020-04-02
申请号:CA3111475
申请日:2019-09-27
Applicant: BUTTERFLY NETWORK INC
Inventor: LIU JIANWEI , FIFE KEITH G , LUTSKY JOSEPH , MIAO LINGYUN
Abstract: A method of forming an ultrasound transducer device includes bonding a membrane to a substrate so as to form a sealed cavity between the membrane and the substrate. An exposed surface located within the sealed cavity includes a getter material that is electrically isolated from a bottom electrode of the cavity.
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