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公开(公告)号：KR1020150083344A
公开(公告)日：2015-07-17
申请号：KR1020140002979
申请日：2014-01-09
Applicant: 삼성전기주식회사
IPC: H05K3/46
Abstract: 본발명은인쇄회로기판및 인쇄회로기판의제조방법에관한것이다. 본발명의실시예에따른인쇄회로기판은관통비아홀이형성된절연층, 관통비아홀에형성되며, 시드층및 시드층에형성된도금층을포함하는관통비아, 및절연층의상부및 하부중 적어도하나에형성되며, 시드층및 도금층을포함하는회로층을포함할수 있다.
Abstract translation: 印刷电路板及其制造方法技术领域本发明涉及印刷电路板及其制造方法。 根据本发明的实施例，印刷电路板包括：绝缘层，其包括通孔; 在通孔中形成的贯通孔，其包括种子层和形成在种子层中的镀层; 以及电路层，其形成在绝缘层的上部或下部的至少一个中，并且包括种子层和电镀层。
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公开(公告)号：KR1020140081276A
公开(公告)日：2014-07-01
申请号：KR1020120150852
申请日：2012-12-21
Applicant: 삼성전기주식회사
IPC: H01G11/54 , H01M10/0566
Abstract: The present invention relates to a lithium ion capacitor which includes electrolytic solutions containing 5 to 40 wt% of acetate solvents. According to the present invention, the diffusion speed of lithium ions is increased and the resistance of the lithium ion capacitor is reduced by including a preset amount of acetate solutions with carbonate electrolytic solvents which are used in a conventional method. Also, according to the present invention, provided is the lithium ion capacitor with an improved low temperature property by including the acetate solvents with a lower melting point as the electrolytic solvents.
Abstract translation: 锂离子电容器技术领域本发明涉及含有5〜40重量％的乙酸酯溶剂的电解液的锂离子电容器。 根据本发明，通过使用常规方法中使用的碳酸酯电解溶剂，预先设定量的乙酸酯溶液，锂离子的扩散速度提高，并且降低了锂离子电容器的电阻。 此外，根据本发明，通过将具有较低熔点的乙酸酯溶剂作为电解溶剂，提供具有改善的低温性能的锂离子电容器。
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公开(公告)号：KR1020140048564A
公开(公告)日：2014-04-24
申请号：KR1020120114669
申请日：2012-10-16
Applicant: 삼성전기주식회사
CPC classification number: H05K1/115 , H05K1/0206 , H05K3/0014 , H05K3/4046 , H05K3/445 , H05K2201/09854 , H05K2203/0369 , H05K2203/1476
Abstract: The present invention relates to a core substrate, a manufacturing method thereof, and a structure for a metal via. According to one embodiment of the present invention, suggested is the core substrate which includes: an insulation layer; a plurality of metal vias which pass through the insulation layer and formed to become wider from the upper and lower surfaces to the middle surface of the insulation layer; and a conductive layer which is formed on the upper and lower surfaces of the insulation layer and is connected to the metal vias. Also, suggested are the manufacturing method thereof and the structure for the metal via.
Abstract translation: 芯基板及其制造方法以及金属通孔的结构体技术领域本发明涉及芯基板及其制造方法以及金属通孔的结构。 根据本发明的一个实施例，提出的核心基板包括：绝缘层; 多个金属通孔，穿过绝缘层并形成为从绝缘层的上表面到下表面变宽; 以及形成在绝缘层的上表面和下表面上并连接到金属通孔的导电层。 另外，建议其制造方法和金属通孔的结构。
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公开(公告)号：KR101062326B1
公开(公告)日：2011-09-05
申请号：KR1020090116127
申请日：2009-11-27
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K3/4608
Abstract: 인쇄회로기판 및 그 제조방법이 개시된다. 구리층의 양면에 인바(invar)층이 형성되는 메탈코어; 메탈코어의 일면에 형성되는 절연층; 및 절연층의 일면에 결합되는 회로패턴을 포함하는 인쇄회로기판은, 열전도도와 휨 변형에 대한 저항력을 동시에 향상시킬 수 있다.
메탈 코어, 인바, 구리, 합금-
公开(公告)号：KR1020110058113A
公开(公告)日：2011-06-01
申请号：KR1020090114788
申请日：2009-11-25
Applicant: 삼성전기주식회사
IPC: H05K7/20
CPC classification number: B32B7/12 , B32B3/266 , B32B15/08 , B32B27/06 , B32B27/34 , Y10T156/1039 , Y10T428/24479
Abstract: PURPOSE: A core substrate and a manufacturing method thereof are provided to improve heat radiation efficiency by including an inorganic filler with high thermal conductivity. CONSTITUTION: A core substrate comprises an adhesive resin layer(130), a metal sheet(121), and an insulation layer(140,160). The adhesive resin layer includes an inorganic filler. The inorganic filler includes alumina or silica. A metal sheet is embedded in the adhesive resin layer. The insulation layer is laminated on both sides of the adhesive resin layer.
Abstract translation: 目的：提供核心基板及其制造方法，以通过包括具有高导热性的无机填料来提高散热效率。 构成：核心基板包括粘合树脂层（130），金属板（121）和绝缘层（140,160）。 粘合树脂层包括无机填料。 无机填料包括氧化铝或二氧化硅。 将金属片嵌入粘合树脂层中。 绝缘层层叠在粘合树脂层的两侧。
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Patent Agency Ranking
公开(公告)号：KR1020100055184A
公开(公告)日：2010-05-26
申请号：KR1020080114140
申请日：2008-11-17
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0203 , H05K1/056 , H05K2201/066
Abstract: PURPOSE: The radiation substrate and manufacturing method thereof use the heat dissipation insulating layer and metal sheet without the use of the metal core. The protection against heat performance is improved. CONSTITUTION: The first circuit layer(114a) is formed in the single-side of the heat dissipation insulating layer(106). The first circuit layer comprises the first metal sheet and the first plating layer(112a). The second circuit layer(114b) is formed in the other side of the heat dissipation insulating layer. The second circuit layer comprises the second metal sheet(102b) and the second plating layer(112b).
Abstract translation: 目的：辐射基板及其制造方法使用散热绝缘层和金属片，而不使用金属芯。 提高了防热性能。 构成：第一电路层（114a）形成在散热绝缘层（106）的单侧。 第一电路层包括第一金属片和第一镀层（112a）。 第二电路层（114b）形成在散热绝缘层的另一侧。 第二电路层包括第二金属片（102b）和第二镀层（112b）。
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公开(公告)号：KR100127130B1
公开(公告)日：1998-04-02
申请号：KR1019910020534
申请日：1991-11-18
Applicant: 삼성전기주식회사
Inventor： 최재훈
IPC: H01C3/00
Abstract: A magnetic resistive device of bias-type and method thereof are provided to improve an adhesive force of chip and bias magnet and reliability. The magnetic resistor comprises: a magnetic resistive chip(2) having a via hole formed an electrode; a leadframe(3) fixed to the rear surface of the magnetic resistive chip(2) by soldering; and a complex body(5) having a bias magnet(4) located at the back side of the leadframe(3). The complex body(5) is built-in with a resistive device holder(1), thereby increasing the adhesive force between the chip(2) and the bias magnet(4).
Abstract translation: 提供了一种偏置型磁阻元件及其方法，以提高芯片和偏置磁铁的粘附力和可靠性。 磁阻电阻器包括：具有形成电极的通孔的磁阻片（2）; 通过焊接固定到所述磁阻芯片（2）的后表面的引线框架（3）; 以及具有位于引线框架（3）的后侧的偏置磁体（4）的复合体（5）。 复合体（5）内置有电阻器件保持器（1），从而增加了芯片（2）和偏置磁体（4）之间的粘附力。
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公开(公告)号：KR1019970003331B1
公开(公告)日：1997-03-17
申请号：KR1019930022765
申请日：1993-10-29
Applicant: 삼성전기주식회사
Inventor： 최재훈
IPC: H01C7/00
Abstract: In the magneto resistance element in which a magneto resistance pattern is formed on the fore face of a substrate made of glass or silicone and each of lead terminals is soldered and fixed to each of terminal electrodes formed in several numbers on the substrate, it is characterized by soldering and fixing the lead terminal onto the rear face thereof so that a projecting part is not formed on the fore face of the substrate.
Abstract translation: 在其中在由玻璃或硅树脂制成的基板的前表面上形成磁阻图案的磁阻元件中，并且每个引线端子焊接并固定到在基板上以多个数目形成的每个端子电极，其特征在于 通过将引线端子焊接并固定到其后表面上，使得在基板的前表面上不形成突出部分。
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