Abstract:
PURPOSE: An SRAM device having a strapping region is provided to reduce the off-current of driving transistors and the power consumption by increasing the threshold voltages of the driving transistors. CONSTITUTION: A plurality of cell active regions(101) are formed with the first active region formed on the first well region and the second active region formed on the second well region. An extended part of the second well region is arranged on a strapping region(70). The first and the second gate electrodes(110a,110b) are formed across the first and the second active regions. The first and the second gate electrodes are formed in parallel to each other. A common source region is extended from the second active region between the first and the second gate electrodes. A common source line(120) is electrically connected to the common source region. The common source line is formed across the strapping region. The first ground voltage supply line(130) is formed across the common source line within the strapping region and is electrically connected to the common source line. A well voltage supply line is arranged in one side of the ground line within the strapping region and is electrically connected to the extended part of the second well.
Abstract:
PURPOSE: A semiconductor memory device tested by an SDR(Single Data Rate) mode and a DDR(Double Data Rate) mode at a merged DQ mode test process is provided to test the semiconductor memory device by using the SDR mode and the DDR mode at the merged DQ mode test process. CONSTITUTION: A semiconductor memory device tested by an SDR mode and a DDR mode at a merged DQ mode test process includes a first path part, a second path part, and an integrated output signal generator. The first path part(310) is used for transferring selectively the first inner data, which are outputted, from the first edge block of clock signals. The second path part(330) is used for transferring selectively the second inner data, which are outputted, from the second edge block of the clock signals. The integrated output signal generator(350) is used for outputting integrated output signals of an SDR mode or a DDR mode in response to the outputs of the first and the second path parts.
Abstract:
생산성 향상을 위해 집적회로 칩을 패키징한 상태에서 상기 집적회로 칩내의 옵션 패드에 제어신호를 인가하는 방법이 개시된다. 그러한 방법은, 상기 집적회로 칩을 패키징한 집적회로 패키지에 할당된 복수의 전원인가용 핀들중 적어도 하나의 핀을, 상기 집적회로 칩내에 설치된 전원 패드에는 연결함이 없이 상기 옵션 패드에 독립적으로 연결하여 두고, 상기 옵션 패드와 연결된 상기 전원인가용 핀을 통해 외부에서 제어신호를 인가하는 것을 특징으로 한다.
Abstract:
PURPOSE: A memory device having a write driver to screen defect of a SRAM cell is provided to reduce test time and to screen a defective cell. CONSTITUTION: A SRAM cell is connected to a bit line and a complementary bit line. And a write driver(300) writes data to the bit line and the complementary bit line of the memory cell with the first and the second level in response to a write signal and a weak write signal. The write driver comprises the first and the second decoding part responding to the write signal and the data and the inverted data, and the first and the second load part(310,320) providing the first and the second level in response to the weak write signal, and the first and the second driver part(214,224) transferring the first and the second level to the bit line and the complementary bit line of the memory cell in response to the output of the first and the second decoding part respectively.
Abstract:
An internal clock generating circuit and method for generating an internal clock phase-synchronized to an input clock with minimum delay and at high speed is disclosed. An internal clock generating circuit comprises a first delay control circuit for generating a first clock having the time delay of up to T/2 (where T is a cycle of an input clock) from the input clock and for generating a first variable delay control signal; and a second delay control circuit for generating a second clock in response to the first variable delay control signal, the second clock having the time delay of greater than T/2 from the input clock at an initial state and having the time delay of about T from the input clock in a phase-locked state.
Abstract:
PURPOSE: A circuit for screening the failure cells of a semiconductor memory device, a method for screening the same and a method for arranging the screen are provided to remove the time required for the stabilization after the voltage is changed so as to supply the power dropped at a predetermined voltage at a conventional tester. CONSTITUTION: A circuit for screening the failure cells of a semiconductor memory device includes a power voltage, a memory cell(400), a first driver(430) and a second driver(440). The first driver(430) is formed between the power voltage and the memory cell(400) for supplying the power voltage to the memory cell in response to the cell power control signal. And, the second driver(440) formed between the power voltage and the memory cell for supplying the voltage dropped by the predetermined voltage at the power voltage to the memory cell(400) in response to the cell power down signal.
Abstract:
PURPOSE: A level converter is provided to be capable of minimizing performance lowering of a semiconductor chip and of increasing a level conversion speed. CONSTITUTION: A level converting part(110) outputs a level conversion signal(OUT) having a different level from a level of an input signal in response to a rising edge of the input signal(IN). A delay part(120) delays the level conversion signal(OUT) of the level converting part(110). A self reset part(130) generates a reset signal in response to the delayed level conversion signal. A pulse width of the level conversion signal(OUT) is established by a sum of the established delay and an internal operation delay, based on the reset signal.
Abstract:
PURPOSE: An internal clock generating circuit is provided to generate an internal clock signal synchronized with an external clock signal and enabling data to be sampled when skew arises between an input cock signal and data. CONSTITUTION: A digital-controlled DLL(Delay Locked Loop) consists of the first delay adjusting circuit(100) and the second delay adjusting circuit(200). The first delay adjusting circuit(100) generates the first clock signal having time delay of T/2(T is a period of an input clock signal) to the input clock, and generates a variable delay signal. The second delay adjusting circuit(200) operates responsive to the variable delay control signal, and generates the second clock signal as an internal clock signal. The second clock signal has time delay over T/2 to the input clock at an initial state and time delay of T to the input clock.
Abstract:
데이터의 송신이나 수신시 전송라인의 특성 임피던스(Z0)가 수시로 변화되는 경우에 임피던스 매칭을 제대로 수행하기 어려운 문제를 해결하기 위하여 원하는 값만큼의 송수신 임피던스를 프로그래머블하게 세팅할 수 있는 반도체 장치가 개시되어 있다. 그러한 반도체 장치는, 입출력 패드에 병렬로 배치되며 대응되는 제어신호에 응답하는 복수의 임피던스 소자들을 갖는 입력 터미네이션 회로 겸용의 복수의 출력드라이버와; 양방향 데이터 통신시에 상기 패드에 연결된 전송라인의 특성임피던스 변화에 따라 프로그래머블하게 세팅되는 디지털 코딩신호를 상기 제어신호로서 출력함에 의해, 상기 각 출력드라이버내의 임피던스 소자들이 선택적으로 제어되도록 하여 임피던스 매칭을 적응적으로 행하는 제어부를 구비한다.
Abstract:
PURPOSE: An impedance control circuit is provided to reduce an error of a circuit when internal impedance generated according to an external resistance. CONSTITUTION: The impedance control circuit includes a comparator(111) and a reference voltage source(1/2VDDQ). A constant current source is connected with an impedance detector(113) which is grounded. An output generated from the constant current source is inputted to the comparator(111). The output of the comparator is feedback through a counter(112) and the impedance detector(113). When a current generated from the constant current source is inputted to the impedance detector(113), the comparator(111) compares the current with the reference voltage generated from reference voltage source(1/2VDDQ), such that the counter(112) generates an impedance code according to the comparison result.