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公开(公告)号:KR101714737B1
公开(公告)日:2017-03-23
申请号:KR1020150169729
申请日:2015-12-01
Applicant: 한국기계연구원
Abstract: 본발명은범프형스탬프를이용한선택적전사방법에관한것으로서, 스탬프형성단계와, 제1성형단계와, 제1전사단계와, 제2성형단계와, 제2전사단계를포함한다. 스탬프형성단계는기판의원하는위치에폴리머액적을디스펜싱하면서기판에액체상태의다수의범프가구비되는범프형스탬프를형성한다. 제1성형단계는범프에열 또는자외선빔을조사하여, 범프의외측에는일정두께의경화층이형성되고경화층내부의범프는액체상태가유지되도록범프를성형한다. 제1전사단계는소자가배치된소스기판과범프형스탬프를접촉시켜, 소스기판의소자를범프에전사한다. 제2성형단계는범프에열 또는자외선빔을조사하여, 경화층내부의범프까지경화되도록범프를성형한다. 제2전사단계는수신기판과범프형스탬프를접촉시켜, 범프에부착된소자를수신기판에전사한다.
Abstract translation: 本发明包括一种印章形成工序和第一成型步骤,在该第一传送步骤中,在第二成型步骤中,一第二转印步骤涉及利用凸块形印模的选择性转移方法。 印模形成步骤在基底上形成具有多个液体凸块的凸块印模,同时将聚合物液滴分配到基底的期望位置。 第一成型步骤照射热或紫外束的凸块,外部,在所述凸块的凸块的固化层的内部形成具有预定厚度的硬化层被形成,使得液体状态被保持在凸块。 第一转印步骤,将接触元件设置在源基板和凸块形印模,以源基板的元件转移到凸块。 第二模制步骤用热或紫外光照射凸块以模制凸块以固化至固化层内的凸块。 在第二转印步骤中,使接收衬底与凸块型印模接触,并且将附接到凸块的器件转移到接收衬底。
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公开(公告)号:KR1020160044336A
公开(公告)日:2016-04-25
申请号:KR1020140139245
申请日:2014-10-15
IPC: G01Q60/24
Abstract: 본발명의원자분해능변형분포측정장치는 AFM 시스템을이용하여분해능을높여저비용으로원자스케일의변형률을측정할수 있도록한 것으로서, 레이저빔을발생시키는레이저광원; 원자간력에의해변형이발생되도록측정시편또는기준시편에근접하게배치되는제1캔틸레버및 제2캔틸레버; 레이저빔이상기제1캔틸레버및 상기제2캔틸레버에순차적으로반사되도록하며, 상기제1캔틸레버및 상기제2캔틸레버가상점위치에배치되도록레이저빔의광경로를조절하는광학계; 상기제2캔틸레버에서반사된레이저빔을관측하는관측부; 그위에측정시편또는기준시편이놓여지며, X, Y, Z 3축방향으로이동가능하게형성되는스테이지; 를포함하여이루어진다.
Abstract translation: 本发明涉及使用原子力测量变形分布的装置,以低成本测量高分辨率的原子尺度的变形率。 该装置包括:产生激光束的激光光源; 靠近测量样品或参考样品的第一悬臂和第二悬臂,以产生由于原子力引起的变形; 连续地将激光束反射在第一悬臂和第二悬臂上的光学系统,控制激光束的光路以将第一悬臂和第二悬臂布置在存储器的位置; 观察部分,其观察反射在第二悬臂上的激光束; 以及放置在测量样品或参考样品上的阶段,移动到X,Y和Z的三个轴向。
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公开(公告)号:KR101605819B1
公开(公告)日:2016-03-24
申请号:KR1020140135527
申请日:2014-10-08
Applicant: 한국기계연구원
CPC classification number: Y02E60/13 , H01G11/26 , C01B32/182 , H01G11/36 , H01G11/86
Abstract: 본발명의원자층적층슈퍼커패시터는서로마주보도록배치된한 쌍의집전체; 및상기한 쌍의집전체사이에배치되며전기이중층이형성되는표면적을넓히기위해주름구조를갖는전극구조물;을포함하여이루어짐으로써, 에너지밀도및 출력밀도를극대화시킨원자층적층슈퍼커패시터및 이의제조방법에관한것이다.
Abstract translation: 本发明涉及原子层叠式超级电容器及其制造方法。 原子层叠型超级电容器包括彼此面对的一对集电体; 以及电极结构,其布置在集电体之间并具有用于加宽形成双电层的表面积的皱纹结构。 能量密度和输出密度最大化。
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公开(公告)号:KR101521205B1
公开(公告)日:2015-05-18
申请号:KR1020130142112
申请日:2013-11-21
Applicant: 한국기계연구원
Abstract: 본발명은접촉제어를통한선택적연속전사장치에관한것으로, 본발명의목적은유연기판디바이스제조공정과같이롤을사용하여전사를수행하는연속전사공정에있어서, 원하는위치에만소자가전사되도록하는선택적전사를원활하고용이하게실현할수 있는, 접촉제어를통한선택적연속전사장치를제공함에있다.
Abstract translation: 本发明涉及使用接触控制的选择性连续传送装置。 连续转印处理使用诸如柔性基板装置制造工艺的卷进行转印作业。 本发明的目的是提供使用接触控制的选择性连续传送装置,其平滑且容易地实现选择性传送工作,以使装置能够仅传送到期望的位置。
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公开(公告)号:KR1020140137874A
公开(公告)日:2014-12-03
申请号:KR1020130059053
申请日:2013-05-24
Applicant: 한국기계연구원
CPC classification number: B41F3/58 , B65H20/02 , B65H2513/106 , B65H2515/312 , B65H2553/212 , B65H2601/2532 , B65H2220/01 , B65H2220/02
Abstract: 본 발명은 나노 박막의 연속적인 이송을 위한 롤투롤 전사 장비의 동기화 장치 및 방법에 관한 것으로 더욱 상세하게는 동기화 장치를 통해 나노 박막을 롤투롤 방식으로 이송 시 나노 박막의 변형이나 파손을 방지하는 롤투롤 전사 장비의 동기화 장치 및 방법에 관한 것이다.
Abstract translation: 本发明涉及一种用于连续传送纳米薄膜的卷对卷转印设备的同步装置和方法,更具体地涉及一种用于卷对卷转印设备的同步装置和方法,其防止变形和损坏 当同步装置通过卷对卷方法传递纳米薄膜时,纳米薄膜。
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公开(公告)号:KR101227180B1
公开(公告)日:2013-01-28
申请号:KR1020110078811
申请日:2011-08-08
Applicant: 한국기계연구원
IPC: H01L21/027 , H01L21/677
CPC classification number: H01L21/0274 , G03F7/70716 , G03F7/70975 , H01L21/67721
Abstract: PURPOSE: A synchronizer between a roll stamp and a transfer stage is provided to improve a transfer speed by transferring a large nano device and a nano thin film device to a desirable substrate. CONSTITUTION: A roll stamp(1) rotates to transfer a nano thin film. A transfer stage(2) supports a planar substrate with the nano thin film and continuously transfers the nano thin film. A sensing unit measures a shear force generated by contact with the transfer stage. A control unit(5) controls one of the roll stamp and the transfer stage. [Reference numerals] (1) Roll stamp; (12) Load cell; (2) Transfer stage; (3) Torque sensor; (4) Shear force sensor; (5) Control unit
Abstract translation: 目的:通过将大型纳米器件和纳米薄膜器件转移到所希望的衬底上,提供辊压印版和转印台之间的同步器,以提高转印速度。 构成:辊印(1)旋转以转移纳米薄膜。 转印阶段(2)支撑具有纳米薄膜的平面基板并连续转印纳米薄膜。 感测单元测量与转印台接触产生的剪切力。 控制单元(5)控制卷标和转印台之一。 [附图标记](1)卷标; (12)称重传感器; (2)转让阶段; (3)转矩传感器; (4)剪力传感器; (5)控制单元
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公开(公告)号:KR101093133B1
公开(公告)日:2011-12-12
申请号:KR1020110044690
申请日:2011-05-12
Applicant: 한국기계연구원
IPC: H01L29/786 , H01L31/04
CPC classification number: Y02E10/50 , H01L27/1266
Abstract: PURPOSE: A flexible apparatus and a manufacturing method capable of omitting a photo lithography process are provided to reduce time and costs for manufacturing the flexible apparatus by manufacturing the flexible apparatus with inline in a state in which an inorganic solid layer is supported in a motherboard. CONSTITUTION: A sacrificial layer is formed on a motherboard(S100). An inorganic solid layer is formed on the sacrificial layer(S200). One and more sacrifice supporting parts are formed by eliminating a part of the sacrificial layer(S300). The inorganic solid layer is separated from the sacrifice supporting part(S400). The inorganic solid layer is attached to a flexible printed circuit board(S500). The flexible printed circuit board includes resin. The motherboard comprises one and more penetration holes which pass through the motherboard. Etching solution is touched to the sacrificial layer through the penetration hole.
Abstract translation: 目的:提供一种能够省略光刻工艺的柔性装置和制造方法,以通过在无机固体层被支撑在母板中的状态下以线内制造柔性装置来减少制造柔性装置的时间和成本。 构成:在母板上形成牺牲层(S100)。 在牺牲层上形成无机固体层(S200)。 通过消除牺牲层的一部分来形成牺牲支撑部分的一个以上(S300)。 无机固体层与牺牲支撑部分分离(S400)。 无机固体层附着在柔性印刷电路板上(S500)。 柔性印刷电路板包括树脂。 主板包括穿过主板的一个和多个穿透孔。 蚀刻溶液通过穿透孔与牺牲层接触。
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公开(公告)号:KR101027752B1
公开(公告)日:2011-04-07
申请号:KR1020100085031
申请日:2010-08-31
Applicant: 한국기계연구원
IPC: H05K13/04 , H01L21/677 , B65G49/07 , C08L83/04
CPC classification number: H05K13/046 , C08L83/04 , H01L21/6835 , H01L21/68714 , H05K13/0469
Abstract: PURPOSE: An active removable chuck is provided to actively control an adhesive force, thereby shortening transfer time and process time. CONSTITUTION: A device(30) is formed and transferred on and by a transfer substrate(20a). A chuck(10) is positioned on the device. Power is applied to the chuck. If power is applied in the direction in which the fiber of the chuck is aligned, the adhesive force between the chuck and the device increases. The device is transferred to a target substrate(20b) while the device is attached to the chuck. The device is attached/detached by changing the direction of power applied to the chuck.
Abstract translation: 目的:提供主动的可拆卸卡盘来主动控制粘合力,从而缩短传输时间和处理时间。 构成:在转印基板(20a)上形成转印装置(30)。 卡盘(10)位于设备上。 电源施加在卡盘上。 如果在卡盘的光纤对准的方向上施加电力,则卡盘和装置之间的粘合力增加。 当装置附接到卡盘时,将装置传送到目标基板(20b)。 通过改变施加在卡盘上的动力方向来将装置分离。
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公开(公告)号:KR1020100103079A
公开(公告)日:2010-09-27
申请号:KR1020090021510
申请日:2009-03-13
Applicant: 한국기계연구원
Abstract: PURPOSE: A thermoelectric conversion module is provided to increase a thermoelectric element by the thermoelectric element into a spring form. CONSTITUTION: A connecting electrode(13) of a thermoelectric conversion module(20) is formed in order to have a spring structure on a central part. The connecting electrode includes a junction part(13a) where a p-type semiconductor(1) and a n-type semiconductor(2) are contacted and a connection part(13b) which connects the junction parts to each other. The connection part has a spring structure into a zigzag shape.
Abstract translation: 目的:提供一种热电转换模块,用于通过热电元件将热电元件增加到弹簧形式。 构成:为了在中心部分具有弹簧结构,形成热电转换模块(20)的连接电极(13)。 连接电极包括p型半导体(1)和n型半导体(2)接触的接合部(13a)和将接合部彼此连接的连接部(13b)。 连接部分具有以Z字形形状的弹簧结构。
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