SEMICONDUCTOR INTEGRATED CIRCUIT CONNECTING SUBSTRATE, ITS COMPONENT PART AND SEMICONDUCTOR DEVICE

    公开(公告)号:JPH10178034A

    公开(公告)日:1998-06-30

    申请号:JP21511397

    申请日:1997-08-08

    Abstract: PROBLEM TO BE SOLVED: To improve workability, adhesive property, insulation reliability and durability by a method wherein one or more kinds of resin and thermosetting resin, having an amide group and/or an imide group, are contained as the essential component of an adhesive material composition. SOLUTION: A bonding agent solution is formed by dimer acid polyamide, epoxy resin, 4,4'-diaminodiphenylsulfone, phenol resin and triphenylphosphine, in the prescribed mixing ratio, and ethanol/toluene mixed solution. This bonding agent solution is applied to a polyethylene terephthalate film and the applied solution is dried up. On the other hand, an adhesive layer is formed in the same manner as above excepting the use of polyethylene terephthalate and silicone mold releasing agent having low stripping force. Then, an adhesive sheet for semiconductor device is formed by laminating two sheets of the above- mentioned film, formed by putting adhesive surfaces together, and a pure copper plate, having an adhesive layer, is obtained by laminating the pure copper plates.

    TAPE WITH ADHESIVE FOR TAB AND SEMICONDUCTOR CONNECTING SUBSTRATE AS WELL AS SEMICONDUCTOR DEVICE

    公开(公告)号:JPH1084018A

    公开(公告)日:1998-03-31

    申请号:JP12214297

    申请日:1997-05-13

    Abstract: PROBLEM TO BE SOLVED: To improve the adhesive property, the chemical resistance and the insulating characteristics at a high temperature by a method wherein a thermoplastic resin, an epoxy resin, silica particles and a silane coupling agent are contained as essential components in an adhesive layer of the tape with adhesive for TAB. SOLUTION: A thermoplastic resin, an epoxy resin, silica particles and silane coupling are contained as essential components in an adhesive layer 2 of the tape with adhesive for TAB composed of a laminated body having a plastic organic insulating film 1, an adhesive layer 2 and a protective film layer. The silica particles are in the mean particle diameter not exceeding about 10μm and the maximum particle diameter not exceeding about 20μm while the blending ratio thereof about 5-70wt.% of the whole adhesive layer. Furthermore, the surface of the silica particles is to be previously processed with the silane coupling agent whose additive amount is to be about 0.5-10wt.% to the 100wt.% of the silica particles. Through these procedures, the adhesive property, the chemical resistance and the insulating characteristics at a high temperature can be improved.

    TAPE WITH ADHESIVE FOR TAB, SEMICONDUCTOR CONNECTING BOARD AND SEMICONDUCTOR DEVICE

    公开(公告)号:JPH09289231A

    公开(公告)日:1997-11-04

    申请号:JP3594197

    申请日:1997-02-20

    Abstract: PROBLEM TO BE SOLVED: To obtain a product superior in adhesion, chemicals resistance and insulation by using an adhesive layer contg. a thermoplastic resin A and an epoxy resin B which contains an epoxy resin shown by specified formula as a necessary component. SOLUTION: A tape with adhesive for TAB is composed of a laminate of an adhesive layer and protective film layer on a flexible org. insulation film. The adhesive layer contains a thermoplastic resin A and an epoxy resin B which contains an epoxy resinshown by the formula as a necessary component, wherein two of R1-R8 are H atoms and C1-C4 are lower alkyl groups or halogen atoms. The thermoplastic resin A uses e.g. a polyamide resin contg. 36C dicarboxylic acid. and the epoxy resin B uses a dicyclopentadiene type epoxy resin.

    TAPE WITH ADHESIVE FOR TAB, SEMICONDUCTOR CONNECTING BOARD AND SEMICONDUCTOR DEVICE

    公开(公告)号:JPH09289229A

    公开(公告)日:1997-11-04

    申请号:JP3479597

    申请日:1997-02-19

    Abstract: PROBLEM TO BE SOLVED: To obtain a product superior in adhesion, chemicals resistance and insulation, by using an adhesive layer contg, a thermoplastic resin A and epoxy resin B contg. an epoxy resin b shown by specified formula as a necessary component. SOLUTION: A tape with adhesive for TAB is composed of a laminate of an adhesive layer and protective film layer on a flexible org. insulation film. The adhesive layer contains a thermoplastic resin A and an epoxy resin B which contains an epoxy resin shown by the formula as a necessary component, wherein R1-R8 are H atoms and c1-c4 are lower alkyl groups or halogen atoms. The thermoplastic resin uses e.g. a polyamide resin and the epoxy resin used 4,4'-bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl.

    ADHESIVE-COATED TAPE FOR TAB, SEMICONDUCTOR CONNECTION BOARD AND SEMICONDUCTOR DEVICE

    公开(公告)号:JPH09237809A

    公开(公告)日:1997-09-09

    申请号:JP34849396

    申请日:1996-12-26

    Abstract: PROBLEM TO BE SOLVED: To improve the adhesion property and insulation reliability by stacking an adhesive layer and protective film layer on an org. flexible insulative film; the adhesive layer contg. a polyamide resin and at least one heterocyclic aromatic compd. meeting specified conditions. SOLUTION: An adhesive agent layer 2 and protective film layer are stacked on an org. flexible insulative film 1 to form a laminate, the adhesive layer 2 of which layer contains a polyamide resin and at least one heterocyclic aromatic compd. meeting the condition that it has a 5- or 6-component ring in the molecule contg. three or more N atoms in a heterocyclic structure, a 5- or 6-component ring in the molecule contg. one or more N atoms one or more O atoms in a heterocyclic structure. Thus, the adhesive property and insulation reliability are improved.

    TAPE WITH ADHESIVE FOR TAB AND SEMICONDUCTOR DEVICE

    公开(公告)号:JPH0964111A

    公开(公告)日:1997-03-07

    申请号:JP21205595

    申请日:1995-08-21

    Abstract: PROBLEM TO BE SOLVED: To enable a novel tape for a TAB having excellent adhesive properties and insulating properties by investigating the relationship of the chemical structure of the adhesive component of the tape for the TAB and the adhesive properties and insulating properties to a metal and skillfully combining an organometallic compound and a polyamide resin. SOLUTION: A layer, particularly, an adhesive layer composed of a laminate with an adhesive layer and a protective film layer on an organic insulating film having flexibility contains at least one kind or more of organometallic compounds selected from a polyamid resin and an organometallic compound shown by the formula of M(O-R')n(O-CO-R )m or a metallic chelate compound constituted of the organometallic compound and a chelate aegent as essential ingredients. Where M in formula represents a metallic element, (n) and (m) naural numbers and R and R substitutional or non-substitutional monovalent hydrocarbon groups. Accordingly, a novel tape for a TAB having excellent adhesive properties and insulating properties is acquired.

    COVERLAY FILM
    87.
    发明专利

    公开(公告)号:JPH08181418A

    公开(公告)日:1996-07-12

    申请号:JP32007894

    申请日:1994-12-22

    Abstract: PURPOSE: To improve reliability on resistance to wet heat, soldering heat resistance and adhesion property by making an adhesive composition and resin of a coverlay film a specified element. CONSTITUTION: A coverlay film is constituted of a lamination body of thermosetting type adhesive and a release film. An essential element is 100 pts.wt. of epoxy resin, 20 to 100 pts.wt. of carboxyl group-containing acrylonitrile-butadiene rubber, 0.01 to 50 pts.wt. of setting agent, a block having a functional group which enables chemical bond with one or both of epoxy group and carboxyl group, or 2 to 60 pts.wt. of graft copolymer. Thereby, it is possible to acquire a coverlay film of good wet heat resistant reliability, soldering heat resistance and adhesion property and to improve reliability and economy of a flexible printed substrate.

    TAPE FOR TAB WHICH HAS ADHESIVE AGENT, AND SEMICONDUCTOR DEVICE

    公开(公告)号:JPH08181174A

    公开(公告)日:1996-07-12

    申请号:JP32451294

    申请日:1994-12-27

    Abstract: PURPOSE: To obtain a tape for TAB excellent in adhesion and resistance to chemicals, by making an adhesive agent layer contain xylene resin and polyamide resin as inevitable components which layer forms a laminate together with a protective film layer, on an organic insulating film having flexibility. CONSTITUTION: A tape for TAB which has adhesive agent is constituted of a laminate having an adhesive agent layer 2 and a protective film layer on an insulating film 1 having flexibility. The adhesive agent layer 2 contains xylene resin and polyamide resin as inevitable components. The xylene resin has reactive groups which are obtained by reacting formaldehyde with ortho or meta or para xylene derivatives or mixture of them, under acid catalyst. It is preferable for the polyamid resin to contain dimer acid. As to the compound ratio of xylene resin and polyamide resin, 30-80wt.% of xylene resin to 100wt.% of polyamide resin is preferable.

    PHASE DIFFERENCE FILM INTEGRATED POLARIZING FILM

    公开(公告)号:JPH06109922A

    公开(公告)日:1994-04-22

    申请号:JP26180992

    申请日:1992-09-30

    Inventor: KIGOSHI SHOJI

    Abstract: PURPOSE:To improve durability against changes in retardation of a phase difference film integrated polarizing film by controlling the dimensional change rate of the polarizing film to a specified range. CONSTITUTION:This phase difference film integrated polarizing film is obtd. by laminating a polarizing film and a phase difference film. The polarizing film consists of a polarizer and a protective layer. This polarizer consists of a polyvinylalcohol substrate film to which dichroic dyes are absorbed, and the protective layer is a cellulose ester film. The dimensional change rates of the polarizing film, polarizer and protective layer are controlled to -2.0

    90.
    发明专利
    失效

    公开(公告)号:JPH05288933A

    公开(公告)日:1993-11-05

    申请号:JP9077792

    申请日:1992-04-10

    Abstract: PURPOSE:To improve the durability of the sticking surface on the glass side of the liquid crystal cell of the phase difference film and/or the sticking surface on the polarizing film side of the phase difference film and to improve the reliability of a word processor, personal computer, portable television, on-vehicle display, etc. CONSTITUTION:This phase difference film is constituted by subjecting at least one surface of the phase difference film constituted of a polycarbonate polymer to a hydrolysis treatment in such a manner that a treatment index HL defined by HL=A500/N from the absorbance A500 of total rays and the number N of the treated surface attains >=0.030. This polarizing film integrated polarizing film is constituted by sticking the polarizing film to the hydrolyzed surface of this phase difference film.

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