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公开(公告)号：JPH0832819B2
公开(公告)日：1996-03-29
申请号：JP25840789
申请日：1989-10-02
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , KAYABA KEIJI , TANAKA MASAYUKI
IPC: C08L101/00 , C08G59/00 , C08G59/20 , C08K5/54 , C08K5/5419 , C08L63/00 , H01L23/29 , H01L23/31
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公开(公告)号：JPH0786466A
公开(公告)日：1995-03-31
申请号：JP23018393
申请日：1993-09-16
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , TSURUMI YUMIKO , TANAKA MASAYUKI
Abstract: PURPOSE:To provide a semiconductor sealing epoxy resin composition suited for a semiconductor having a high reliability and required for high integration and good in water absorption, solder heat resistance, cure shrinkage and productivity. CONSTITUTION:An epoxy resin composition contains an epoxy resin, a curing agent containing a naphthol-phenyl paraxylylene copolymer as a principal ingredient, and a filler whose content is 80-95wt.%. It is good in water absorption, solder heat resistance, cure shrinkage and productivity.
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公开(公告)号：JPH0637212A
公开(公告)日：1994-02-10
申请号：JP19039692
申请日：1992-07-17
Applicant: TORAY INDUSTRIES
Inventor： TSUTSUMI YASUAKI , KAYABA KEIJI , TANAKA MASAYUKI
Abstract: PURPOSE:To obtain improved reliability by suppressing the generation of interfa cial separation of resin and a chip in the soldering process of a semiconductor device, and to provide a semiconductor sealing epoxy resin composition having excellent moldability and outstanding reliability under high temperature environ ment such as semiconductor, having large heating power, and around a motorcar engine. CONSTITUTION:The title epoxy composition is the resin composition containing a denatured styrene block copolymer, containing epoxy resin, a hardener and a filling agent and a hydrosulfite compound as ingredient composition, and the denatured styrene block copolymer. The modified styrene block copolymer is copolymerized or graft-reacted to a styrene block copolymer using unsaturated calborylic acid or its derivative, and it contains a hydrosulfite compound of 0.01 to 10wt.%. Accordingly, the composition is excellent in moldability, soldering temperature resistance, high temperature resistance and dampproof property, and it is useful in industrial production.
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公开(公告)号：JPH0517935B2
公开(公告)日：1993-03-10
申请号：JP5888984
申请日：1984-03-27
Applicant: TORAY INDUSTRIES
Inventor： TANAKA MASAYUKI , KISHIMOTO AKIHIKO
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公开(公告)号：JPH04325515A
公开(公告)日：1992-11-13
申请号：JP9743091
申请日：1991-04-26
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , SAWAMURA TAIJI , TANAKA MASAYUKI
Abstract: PURPOSE:To obtain the title composition excellent in soldering heat resistance and reliability of humidity resistance by mixing a specified epoxy resin with a curing agent, a specified amount of a filler and an unsaturated carboxylic acid-modified styrene block copolymer. CONSTITUTION:An epoxy resin essentially consisting of an epoxy resin of the formula (wherein two of R to R are each 2,3-epoxypropoxy and the others are H, halogen or 1-4C alkyl) [e.g. 1,5-di(2,3-epoxypropoxy)-naphthalene] is prepared. A modified styrene block copolymer is produced by copolymerizing or grafting a styrene block copolymer with an unsaturated carboxylic acid or its derivative (e.g. methyl acrylate). The title composition is produced by mixing the above epoxy resin with a curing agent (e.g. m-phenylenediamine) and 60-90wt.%, based on the total composition, filler (e.g. fused silica) as essential components.
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Patent Agency Ranking
公开(公告)号：JPH04270725A
公开(公告)日：1992-09-28
申请号：JP3260891
申请日：1991-02-27
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , TESHIBA TOSHIHIRO , TANAKA MASAYUKI
Abstract: PURPOSE:To obtain an epoxy resin composition, excellent in solder heat resistance and reliability of moisture resistance without any problem of cracks caused in soldering steps and useful for sealing semiconductors. CONSTITUTION:An epoxy resin composition for sealing semiconductors is obtained by blending (A) 4-20wt.% epoxy resin expressed by formula I (two of R to R represent 2,3-epoxypropoxy and the rest represent H, halogen or 1-4C alkyl) with (B) 1-20wt.% curing agent consisting essentially of a biphenyl compound expressed by formula II and, as necessary, a phenolic compound expressed by formula III (R is H, aryl or alkyl), and further, (C) 75-90wt.% filler (e.g. fused silica or crystalline silica).
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公开(公告)号：JPH04218523A
公开(公告)日：1992-08-10
申请号：JP7088791
申请日：1991-04-03
Applicant: TORAY INDUSTRIES
Inventor： HONDA SHIRO , KAYABA KEIJI , TANAKA MASAYUKI
Abstract: PURPOSE:To prevent package cracks from occurring in a surface mounting process of semiconductor devices. CONSTITUTION:A semiconductor sealing epoxy resin composition which is a resin composition, containing an epoxy resin, a curing agent and fused silica as essential components. The epoxy resin contains a bifunctional epoxy resin having a biphenyl skeleton as an essential component and the fused silica is simultaneously composed of 97-60wt.% fused silica in a crushed form having
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公开(公告)号：JPH04202519A
公开(公告)日：1992-07-23
申请号：JP33972090
申请日：1990-11-30
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , TESHIBA TOSHIHIRO , TANAKA MASAYUKI
IPC: C08K3/00 , C08G59/00 , C08G59/20 , C08G59/24 , C08K3/36 , C08K5/544 , C08L63/00 , H01L23/29 , H01L23/31 , H05K1/03
Abstract: PURPOSE:To provide the subject composition containing a specified epoxy resin, a curing agent, a filler and a specified silane coupling agent and excellent in soldering heat resistance, moldability and moisture resistance reliability. CONSTITUTION:An objective composition containing (A) epoxy resins essentially composed of an epoxy resin (e.g. 1,5-diglycidylnaphthalene) of the formula (R to R are H, halogen or 1-4C alkyl), (B) a curing agent (e.g. phenolic novolak resin) preferably in an amount of 2-15wt.%, (C) a filler (preferably fused silica composed of 90-40wt.% crushed fused silica having
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公开(公告)号：JPH0459861A
公开(公告)日：1992-02-26
申请号：JP17351290
申请日：1990-06-29
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , KAYABA KEIJI , TANAKA MASAYUKI
Abstract: PURPOSE:To provide a resin composition having excellent high temperature reliability and moisture resistant reliability and used for sealing semiconductors by compounding an epoxy resin, a curing agent and a filler as essential components and further a sodium antimonate compound. CONSTITUTION:(A) 5-25wt.% of an epoxy resin, (B) 2-15wt.% of a curing agent (preferably a novolak resin) in an A:B chemical equivalent ratio of preferably 1:0.6-1.5, especially 0.8-1,3, (C) 70-90wt.% of a filler (preferably molten silica), (D) 0.02-30wt.%, preferably 0.02-10wt.%, of a sodium antimonate of the formula (X is 0.1-0.5, especially 0.4-1.0). preferably treated at a high temperature to remove water of crystallization, if necessary, a curing agent in an amount of 0.1-10wt.% per 100wt.% of the component A and further other additives are compounded with each other and melt-kneaded to provide the objective composition.
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公开(公告)号：JPH0450257A
公开(公告)日：1992-02-19
申请号：JP15923490
申请日：1990-06-18
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , SAWAMURA TAIJI , TANAKA MASAYUKI
IPC: C08K3/16 , C08G59/00 , C08G59/20 , C08K3/22 , C08K3/26 , C08K3/36 , C08K5/02 , C08L63/00 , H01L23/29 , H01L23/31
Abstract: PURPOSE:To obtain an epoxy resin composition having excellent soldering heat-resistance, flame-retardancy and high-temperature reliability and useful for the sealing of semiconductor by compounding a specific epoxy resin, a curing agent, fused silica, a hydrotalcite compound, etc. CONSTITUTION:The objective composition is produced by compounding (A) 4-20wt.% of an epoxy resin having a skeleton expressed by formula (R to R are H, 1-4C lower alkyl or halogen), (B) 2-15wt.% of a curing agent (e.g. phenolic novolak resin), (C) 75-90wt.% of fused silica composed of 99-50wt.% of crushed fused silica having an average particle diameter of
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