Abstract:
Ein elektrisches Verbindungselement umfasst einen flächigen Leitungskörper, welcher wenigstens einen streifenförmigen Leitungsarm aufweist, auf welchem wenigstens eine sich zwischen zwei Kontaktstellen erstreckende Leiterbahn aufgebracht ist. Der Leitungskörper ist aus Blech gefertigt.
Abstract:
A stacked packaging assembly for a plurality of integrated circuit devices (76) employs a web (61) of flexible interconnect material folded into a 'layered' arrangement of parallel web fingers (61) onto which a plurality of integrated circuit devices (76) are surface-mounted. The leads (71, 73) of the integrated circuit devices (76) are attached to interconnect links (81, 83) of the flexible interconnect web (61). A plurality of heat sink plates (115) are interleaved with the folded web fingers (61) of the stack, as so to engage the integrated circuit devices (76) mounted on the web fingers (61). The heat sink plates (115) are retained by thermally conductive spacer blocks (131, 133) along their edges. The spacer blocks (131, 133) are clamped together in a compact laminate structure, so as to form a rigid support which relieves mechanical stresses at the folds of the web fingers (61).
Abstract:
L'élément de support équipé d'un circuit électronique à composants multiples, notamment pour feu de signalisation automobile, comporte des lanières (42) séparées les unes des autres par des fentes (43), une pluralité desdits composants multiples (3) étant montée sur chacune desdites lanières (42). Cet élément est réalisé par découpe de manière à constituer des lanières se raccordant à au moins une racine de l'élément de support (4). Application véhicules automobiles.
Abstract:
Methods to systematize the development of machines using inexpensive, fast, and convenient fabrication processes are disclosed. In an embodiment, a folding pattern and corresponding circuit design can provide the blueprints for fabrication. The folding pattern may be provided (e.g. laser machined) on a flat sheet of substrate material, such as a polymer. The circuit pattern may be generated by etching or applying (e.g. sputtering) a copper foil layer onto the substrate. Circuit components and actuators may then be added at specified locations. The flat substrate may then be folded along the predefined locations to form the final machine. The machine may operate autonomously to perform a task.