公开(公告)号：US09332628B2

公开(公告)日：2016-05-03

申请号：US14739703

申请日：2015-06-15

Applicant: GLOBALFOUNDRIES INC.

Inventor： Daniel C. Edelstein ,  David V. Horak ,  Elbert E. Huang ,  Satyanarayana V. Nitta ,  Takeshi Nogami ,  Shom Ponoth ,  Terry A. Spooner

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/02 ,  H01L21/768 ,  H05K1/03

CPC classification number: H05K1/0216 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/76849 ,  H01L21/76852 ,  H05K1/0298 ,  H05K1/03 ,  H05K2201/0707 ,  H05K2201/09063

Abstract: A microelectronic structure and a method for fabricating the microelectronic structure provide a plurality of voids interposed between a plurality of conductor layers. The plurality of voids is also located between a liner layer and an inter-level dielectric layer. The voids provide for enhanced electrical performance of the microelectronic structure.

公开(公告)号：US20150245544A1

公开(公告)日：2015-08-27

申请号：US14627177

申请日：2015-02-20

Applicant: Cinch Connectivity Solutions, Inc.

Inventor： Robert Joseph Baumler ,  Mark Daniel Dvorak ,  James Richard Kerekes

IPC: H05K9/00

CPC classification number: H05K9/0064 ,  H01R13/03 ,  H01R13/6594 ,  H01R13/6598 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/18 ,  H05K9/00 ,  H05K9/0066 ,  H05K9/0086 ,  H05K2201/0707

Abstract: The device includes a body and a plurality of contact portions. The body is substantially planar. The plurality of contact portions are associated with the body so as to form ports. The plurality of contact portions are in electrical communication with the body. The port of each contact portion having an inside diameter substantially equal to ID1. The body and the contact portions are constructed of a conductive metallic material.

Abstract translation: 该装置包括主体和多个接触部分。 身体基本上是平面的。 多个接触部分与主体相关联以形成端口。 多个接触部分与身体电连通。 每个接触部分的端口具有基本上等于ID1的内径。 主体和接触部分由导电金属材料构成。

公开(公告)号：US09059251B2

公开(公告)日：2015-06-16

申请号：US13614524

申请日：2012-09-13

Applicant: Daniel C. Edelstein ,  David V. Horak ,  Elbert E. Huang ,  Satyanarayana V. Nitta ,  Takeshi Nogami ,  Shom Ponoth ,  Terry A. Spooner

Inventor： Daniel C. Edelstein ,  David V. Horak ,  Elbert E. Huang ,  Satyanarayana V. Nitta ,  Takeshi Nogami ,  Shom Ponoth ,  Terry A. Spooner

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/768

CPC classification number: H05K1/0216 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/76849 ,  H01L21/76852 ,  H05K1/0298 ,  H05K1/03 ,  H05K2201/0707 ,  H05K2201/09063

Abstract: A microelectronic structure and a method for fabricating the microelectronic structure provide a plurality of voids interposed between a plurality of conductor layers. The plurality of voids is also located between a liner layer and an inter-level dielectric layer. The voids provide for enhanced electrical performance of the microelectronic structure.

公开(公告)号：US20140361142A1

公开(公告)日：2014-12-11

申请号：US14460086

申请日：2014-08-14

Applicant: Apple Inc.

Inventor： Matthew D. ROHRBACH

IPC: F16M11/04 ,  G06F1/16

CPC classification number: H05K5/0204 ,  B60R11/0252 ,  B60R2011/0028 ,  F16M11/041 ,  F16M11/22 ,  F16M11/242 ,  F16M13/00 ,  F16M13/022 ,  G06F1/1633 ,  H01F7/0252 ,  H04B1/3877 ,  H04M1/04 ,  H05K1/0216 ,  H05K1/0298 ,  H05K9/002 ,  H05K2201/0707

Abstract: A magnetic stand for a tablet device is disclosed. The magnetic stand is configured to rigidly hold a portion of the tablet device in place and to shield the magnetic field from adversely affecting nearby devices susceptible to strong magnetic fields. The shielding portion of the magnetic stand allows for significant increases in magnetic field strength when compared to similarly configured, unshielded products.

Abstract translation: 公开了一种用于平板电脑的磁性支架。 磁性支架构造成将片剂装置的一部分刚性地保持在适当的位置并且屏蔽磁场不会对附近易受强磁场影响的装置产生不利影响。 与类似配置的非屏蔽产品相比，磁性支架的屏蔽部分允许磁场强度显着增加。

公开(公告)号：US08710376B2

公开(公告)日：2014-04-29

申请号：US13370881

申请日：2012-02-10

Applicant: Shayan Malek ,  Benjamin John Pope ,  Daniel William Jarvis ,  Tang Tan ,  Richard Hung Minh Dinh ,  Robert Steinfeld ,  Ramachandran Chundru

Inventor： Shayan Malek ,  Benjamin John Pope ,  Daniel William Jarvis ,  Tang Tan ,  Richard Hung Minh Dinh ,  Robert Steinfeld ,  Ramachandran Chundru

IPC: H05K9/00

CPC classification number: H05K9/0064 ,  H04M1/0274 ,  H04M1/0277 ,  H04N5/2254 ,  H05K1/0215 ,  H05K1/0216 ,  H05K2201/0707

Abstract: Various systems of an electronic device and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield an electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.

Abstract translation: 提供电子设备的各种系统及其制造方法。 在一些实施例中，提供了路线组件，其可以不仅沿着电路板路由电缆，而且还可以屏蔽电子部件或将电子部件固定到电路板。 在一些其他实施例中，提供了一种用于电耦合电子设备的两个部件的机构，其在电子设备的其它部分的上下文中也可以是视觉上吸引人的。

公开(公告)号：US08558116B2

公开(公告)日：2013-10-15

申请号：US12923994

申请日：2010-10-19

Applicant: Yang Je Lee ,  Dek Gin Yang ,  Dong Gi An ,  Jae Ho Shin

Inventor： Yang Je Lee ,  Dek Gin Yang ,  Dong Gi An ,  Jae Ho Shin

IPC: H05K1/00

CPC classification number: H05K3/06 ,  H05K1/0218 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/09 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0707 ,  H05K2203/0554 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Abstract translation: 本发明提供了一种多层刚性柔性印刷电路板，包括：柔性区域，包括柔性膜，其具有形成在其一个或两个表面上的电路图案和形成在电路图案上的激光阻挡层; 以及刚性区域，其形成在柔性区域附近，并且在延伸到柔性区域的柔性膜的两侧的延伸部分的一个或两个表面上包括多个图案层及其制造方法。

公开(公告)号：US12009311B2

公开(公告)日：2024-06-11

申请号：US17106907

申请日：2020-11-30

Applicant: Snap Inc.

Inventor： Stephen Andrew Steger ,  Emily Lauren Clopp

IPC: H05K1/02 ,  H01L23/552 ,  H05K9/00

CPC classification number: H01L23/552 ,  H05K1/0216 ,  H05K9/0081 ,  H05K9/0024 ,  H05K9/0052 ,  H05K9/0071 ,  H05K2201/0707 ,  H05K2201/10371

Abstract: Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.

公开(公告)号：US20240023226A1

公开(公告)日：2024-01-18

申请号：US18362742

申请日：2023-07-31

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yo Kobayashi ,  Koji Hirai

IPC: H05K1/02

CPC classification number: H05K1/0219 ,  H05K1/0215 ,  H05K2201/0707 ,  H05K2201/10409

Abstract: A printed circuit board includes a front layer including frame ground regions on which connectors to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region which is separated from the frame ground regions at the front layer, on which electronic devices configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region separated from the frame ground regions and the signal ground region at the front layer, situated outside the frame ground regions, and connected with a ground.

公开(公告)号：US20190208620A1

公开(公告)日：2019-07-04

申请号：US16328535

申请日：2017-08-29

Applicant: Intel Corporation

Inventor： Jackson Chung Peng KONG ,  Bok Eng CHEAH ,  Khang Choong YONG ,  Ramaswamy PARTHASARATHY

IPC: H05K1/02

CPC classification number: H05K1/0222 ,  H05K1/0219 ,  H05K1/0224 ,  H05K2201/0707 ,  H05K2201/09672

Abstract: Embodiments are generally directed to 3D high-inductive ground plane for crosstalk reduction. An embodiment of a printed circuit board includes a first signal trace and a second signal trace on a first layer, wherein the first signal trace and second signal trace are non-intersecting; a second layer below the first layer; a third layer below the second layer; and a three-dimensional (3D) ground plane, the 3D ground plane including a first plurality of segments on the third layer, a second plurality of segments on the second layer, and a plurality of metal vias to connect the first plurality of segments and the second plurality of segments in the ground plane.

公开(公告)号：US10079417B2

公开(公告)日：2018-09-18

申请号：US15614640

申请日：2017-06-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru Kato ,  Satoshi Ishino ,  Jun Sasaki ,  Kuniaki Yosui ,  Takahiro Baba ,  Nobuo Ikemoto

IPC: H05K7/00 ,  H01P3/08 ,  H01P3/02 ,  H05K1/02 ,  H05K1/14 ,  H01P5/00 ,  H05K5/00 ,  H05K1/18 ,  H01P5/12 ,  H01P5/02 ,  H05K3/36 ,  H01P3/00

CPC classification number: H01P3/02 ,  H01P3/003 ,  H01P3/026 ,  H01P3/08 ,  H01P3/082 ,  H01P3/085 ,  H01P5/00 ,  H01P5/028 ,  H05K1/0218 ,  H05K1/0221 ,  H05K1/0237 ,  H05K1/0242 ,  H05K1/025 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/14 ,  H05K1/148 ,  H05K1/186 ,  H05K3/361 ,  H05K2201/0707 ,  H05K2201/09218

Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.