公开(公告)号：CN1259802C

公开(公告)日：2006-06-14

申请号：CN02803328.0

申请日：2002-10-23

Applicant: 诺拉托硅技术股份公司

Inventor： 麦格纳斯·马特森 ,  麦克尔·加克波森

IPC: H04Q7/32 ,  H05K9/00 ,  H01B1/22 ,  B29C70/88

CPC classification number: H05K3/284 ,  B29C70/62 ,  B29C70/882 ,  B29L2031/3061 ,  H01B1/22 ,  H05K1/0233 ,  H05K9/0015 ,  H05K2201/0215 ,  H05K2201/083 ,  Y10T29/49067

Abstract: 一种制造用于电磁屏蔽的元件(5)的方法，该方法特征在于步骤：沿着和要完成的元件(5)的范围对应的曲线以条(6)的形式设置粘性材料(7)，以及通过对所述条(6)施加磁场(10)定向材料(7)中的颗粒(9)。该材料(7)带有实质上为导电性的并且还具有铁磁和/或亚铁磁特性的颗粒(9)。本发明还涉及一种对应的用于电磁屏蔽的元件，一种用于电磁屏蔽的包含这种元件的部件，在移动电话中及基站中使用这种元件，以及包含这种元件的移动电话及基站。

公开(公告)号：CN1481661A

公开(公告)日：2004-03-10

申请号：CN02803328.0

申请日：2002-10-23

Applicant: 诺拉托硅技术股份公司

Inventor： 麦格纳斯·马特森 ,  麦克尔·加克波森

IPC: H05K9/00 ,  H01B1/22 ,  B29C70/88

CPC classification number: H05K3/284 ,  B29C70/62 ,  B29C70/882 ,  B29L2031/3061 ,  H01B1/22 ,  H05K1/0233 ,  H05K9/0015 ,  H05K2201/0215 ,  H05K2201/083 ,  Y10T29/49067

Abstract: 一种制造用于电磁屏蔽的元件(5)的方法，该方法特征在于步骤：沿着和要完成的元件(5)的范围对应的曲线以珠(6)的形式设置粘性材料(7)，以及通过对所述珠(6)施加磁场(10)定向材料(7)中的颗粒(9)。该材料(7)带有实质上为导电性的并且还具有铁磁和/或亚铁磁特性的颗粒(9)。本发明还涉及一种对应的用于电磁屏蔽的元件，一种用于电磁屏蔽的包含这种元件的部件，在移动电话中及基站中使用这种元件，以及包含这种元件的移动电话及基站。

公开(公告)号：NO963200A

公开(公告)日：1997-02-03

申请号：NO963200

申请日：1996-07-31

Applicant: LOCTITE IRELAND LTD

Inventor： MCARDLE CIARAN BERNARD ,  BURKE JOSEPH

IPC: H01F1/44 ,  H01F1/34 ,  H01F41/16 ,  H01R4/04 ,  H05K3/32

CPC classification number: H05K3/323 ,  H01F41/16 ,  H01R4/04 ,  H05K2201/083 ,  H05K2203/104 ,  Y10S428/90 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/257

公开(公告)号：NO953809A

公开(公告)日：1995-09-26

申请号：NO953809

申请日：1995-09-26

Applicant: LOCTITE IRELAND LTD

Inventor： MCARDLE CIARAN BERNARD ,  BURKE JOSEPH

IPC: H05K1/09 ,  C09J5/06 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01B1/00 ,  H01B1/20 ,  H01B5/00 ,  H01B5/16 ,  H01F1/44 ,  H01F41/16 ,  H01L21/60 ,  H01R4/04 ,  H05K3/32

CPC classification number: H05K3/323 ,  H01F1/44 ,  H01F41/16 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01R4/04 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/12069 ,  Y10T428/12347 ,  H01L2924/00

公开(公告)号：EP3104671B1

公开(公告)日：2018-07-18

申请号：EP16167926.1

申请日：2016-05-02

Applicant: Joylabz LLC

Inventor： WILCOX, Bryan Randall ,  EDDIE, Todd ,  SILVER, Jay Saul

IPC: H05K1/11 ,  H01R11/30 ,  H01R12/72 ,  H01R13/62 ,  H01R13/66 ,  G06F1/16 ,  H05K5/02 ,  H05K5/00 ,  H01R11/24

CPC classification number: H01R13/6205 ,  G06F1/16 ,  H01R11/24 ,  H01R13/6658 ,  H01R2201/06 ,  H05K1/11 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K5/0278 ,  H05K2201/083 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/09481 ,  H05K2201/10386

Abstract: Systems and methods for magnetic coupling. One system includes an external computing device and a connector having a conductive end. The system also includes a printed circuit board. The printed circuit board includes a connector side opposite a back side. The connector side has a contact pad with an aperture. The printed circuit board also includes a magnet positioned on the back side of the printed circuit board. The magnet provides a magnetic field configured to provide magnetic attraction forces to a connector contacting the contact pad. The printed circuit board also includes a communication terminal. The system also includes a circuit in communication with the printed circuit board through the connector and contact pad.

公开(公告)号：EP3300527A1

公开(公告)日：2018-04-04

申请号：EP16756621.5

申请日：2016-08-08

Applicant: Siemens Aktiengesellschaft

Inventor： MAIER, Martin ,  WEISS, Uwe ,  FEIL, Wolfgang

IPC: H01F38/28 ,  H01F27/28 ,  H01F27/245 ,  H01F27/25 ,  H01F27/26

CPC classification number: H01F27/2804 ,  H01F27/245 ,  H01F27/25 ,  H01F27/266 ,  H01F38/30 ,  H01F2027/2809 ,  H01F2027/2819 ,  H05K2201/083

Abstract: The invention relates to a power converter module comprising a circuit board (7) in which an iron core (1) is integrated in recesses (6) of the circuit board (7), a winding with windings, forming a secondary circuit (8) of the power converter module, is arranged in or on the circuit board (7).

公开(公告)号：EP2572560A4

公开(公告)日：2018-03-28

申请号：EP11803221

申请日：2011-07-06

Applicant: NOKIA TECHNOLOGIES OY

Inventor： JOKINEN TEPPO TAPANI ,  SAUNAMAKI JARKKO TAPIO

IPC: H05K1/18 ,  G02F1/1333 ,  G06F1/16 ,  G09F9/30 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/189 ,  G02F1/13336 ,  G06F1/1652 ,  G09G2380/02 ,  H05K1/028 ,  H05K1/0283 ,  H05K2201/051 ,  H05K2201/056 ,  H05K2201/083 ,  H05K2201/10189 ,  H05K2203/104 ,  H05K2203/166

Abstract: An apparatus including an elongate structure including integrated electronic circuitry providing at least an electronic user interface wherein the elongate structure is flexible and is configured to be flexed lengthwise by a user to form a looped configuration in which the elongate structure forms at least one lengthwise loop about an axis and in which at least one electrical connection for the electronic circuitry is formed where a first portion of the elongate structure and a second portion of the elongate structure contact.

公开(公告)号：EP2461426B1

公开(公告)日：2016-11-23

申请号：EP10813641.7

申请日：2010-08-25

Applicant: Polymatech Japan Co., Ltd.

Inventor： NAKAONE Yutaka

IPC: H01L23/498 ,  H01L21/48 ,  H01B5/16 ,  H05K3/32

CPC classification number: H05K3/32 ,  H01L21/486 ,  H01L23/145 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H01R43/007 ,  H05K2201/0133 ,  H05K2201/083 ,  H05K2201/10378 ,  H05K2201/10962 ,  H05K2203/104 ,  H01L2924/00

公开(公告)号：EP2122243B1

公开(公告)日：2016-04-20

申请号：EP08702594.6

申请日：2008-02-07

Applicant: Philips Intellectual Property & Standards GmbH ,  Koninklijke Philips N.V.

Inventor： JACOBS, Joseph, H., A., M. ,  HENTE, Dirk ,  WAFFENSCHMIDT, Eberhardt

IPC: F21V21/096 ,  F21V21/34

CPC classification number: F21V21/096 ,  F21V21/34 ,  F21V23/02 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  F21Y2115/15 ,  H01L25/048 ,  H01L27/3293 ,  H01L51/5203 ,  H01L2251/5361 ,  H01L2924/0002 ,  H01R13/6205 ,  H01R25/147 ,  H05B33/0896 ,  H05B37/0254 ,  H05B39/00 ,  H05K3/303 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/10106 ,  H05K2203/168 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP2665954A2

公开(公告)日：2013-11-27

申请号：EP12707244.5

申请日：2012-01-23

Applicant: MGB Endoskopische Geräte GmbH Berlin

Inventor： PAGEL, Lienhard ,  GASSMANN, Stefan

IPC: F16K31/08 ,  F16K99/00 ,  H05K1/02 ,  A61M13/00 ,  A61M16/20

CPC classification number: F16K17/00 ,  A61M13/003 ,  A61M16/20 ,  A61M16/202 ,  A61M16/209 ,  A61M2205/3331 ,  B01J2219/0027 ,  H05K1/0272 ,  H05K2201/083 ,  Y10T137/7793

Abstract: The present invention concerns a circuit board (100) having at least one fluid passage (110) arranged in the interior of a circuit board (100), having a fluid passage opening (120) which is arranged on a surface of the circuit board (100) and which leads to the fluid passage (110, and a multi-part pressure-relief valve arrangement (200) for reducing an excess pressure in the fluid passage (110), which includes a first magnet (210), a second magnet (220) and a sealing closure (230), wherein the first magnet (210) and the second magnet (220) are so arranged that they press the sealing closure (230) on to the fluid passage opening (2120) by a magnetic force (250) afforded by the first magnet (210) and by the second magnet (220).