公开(公告)号：KR100200257B1

公开(公告)日：1999-06-15

申请号：KR1019950020964

申请日：1995-07-18

Applicant: 가부시끼가이샤 히다치 세이사꾸쇼

Inventor： 고바야시시로우 ,  가와구찌마사미

IPC: H05K3/00

CPC classification number: H05K3/282 ,  C23F1/18 ,  C23F11/149 ,  H05K3/0094 ,  H05K3/061 ,  H05K3/3452 ,  H05K3/383 ,  H05K2201/0175 ,  H05K2201/09581 ,  H05K2203/1394 ,  Y10T29/49165

Abstract: 소프트 에칭액에 추가된 가용성 염화물은 보호 CuCl층을 형성하기 위해 도금된 구리와 유리하게 결합되는 염화물 이온의 소스이다. 상기 보호층은 바람직하게 프린트 배선판의 비아 또는 관통 홀 내에 있는 구리막의 오버에칭을 방지하는데 사용된다.

公开(公告)号：EP3073523A4

公开(公告)日：2017-06-28

申请号：EP14864041

申请日：2014-11-19

Applicant: DAINIPPON PRINTING CO LTD

Inventor： KURAMOCHI SATORU ,  KOIWA SUMIO ,  YOSHIOKA HIDENORI

IPC: H01L23/32 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/522 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/11

CPC classification number: H01L23/49827 ,  H01L23/13 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/065 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16165 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81805 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/381 ,  H05K1/115 ,  H05K3/28 ,  H05K3/445 ,  H05K2201/09154 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09854 ,  H05K2203/0594 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0665 ,  H01L2924/07025

公开(公告)号：EP2730834B1

公开(公告)日：2016-03-09

申请号：EP13192235.3

申请日：2013-11-08

Applicant: OSRAM GmbH

Inventor： Zhong, Chuanpeng ,  Liu, Tingming ,  Ming, Yusheng ,  Yang, Jianghui

IPC: F21S2/00 ,  F21S4/00 ,  H05K1/14 ,  F21V21/005 ,  F21V23/06 ,  H01R13/514 ,  H01R25/16 ,  F21Y115/10 ,  F21Y103/00 ,  H05K1/05 ,  H05K3/36 ,  H05K3/40

CPC classification number: F21S2/005 ,  F21S4/28 ,  F21V21/005 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/05 ,  H05K1/142 ,  H05K3/36 ,  H05K3/4046 ,  H05K2201/09581 ,  H05K2201/09845 ,  H05K2201/10106

公开(公告)号：EP2018092A4

公开(公告)日：2012-11-14

申请号：EP07741447

申请日：2007-04-11

Applicant: IBIDEN CO LTD

Inventor： MANO YASUHIKO ,  KARIYA TAKASHI ,  KATO SHINOBU

IPC: H05K3/46

CPC classification number: H05K3/4046 ,  H01F17/0006 ,  H01F17/06 ,  H01F41/046 ,  H01F2017/002 ,  H01F2017/065 ,  H01L23/645 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/185 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/09581 ,  Y10T29/4902 ,  H01L2224/05599

公开(公告)号：EP1408726B1

公开(公告)日：2010-02-10

申请号：EP02749309.7

申请日：2002-07-17

Applicant: Panasonic Corporation

Inventor： NISHII, Toshihiro

IPC: H05K3/40 ,  H05K3/46 ,  H05K1/03 ,  H05K3/00 ,  C08J5/24

CPC classification number: H05K3/4626 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4632 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/09581 ,  H05K2203/0191 ,  H05K2203/065 ,  H05K2203/083 ,  H05K2203/1461 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T428/24917

Abstract: A method of manufacturing a circuit-formed substrate capable of increasing the reliability of an interlayer connection on the circuit-formed substrate and a material for manufacturing a circuit-formed substrate, the method comprising the steps of A) limiting resin flow in a hot press process, B) fusing or sticking reinforcement fibers to each other, C) reducing the thickness of substrate material after a filling process, and D) forming a low fluidized-layer with fillers mixed in the substrate material, the material comprising volatile components capable of providing physical properties to control the resin fluidity in the hot press process or efficiently reducing the thickness of the substrate material after the filling process.

公开(公告)号：EP2018092A1

公开(公告)日：2009-01-21

申请号：EP07741447.2

申请日：2007-04-11

Applicant: Ibiden Co., Ltd.

Inventor： MANO, Yasuhiko ,  KARIYA, Takashi ,  KATO, Shinobu

IPC: H05K3/46

CPC classification number: H05K3/4046 ,  H01F17/0006 ,  H01F17/06 ,  H01F41/046 ,  H01F2017/002 ,  H01F2017/065 ,  H01L23/645 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/185 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/09581 ,  Y10T29/4902 ,  H01L2224/05599

Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.

Abstract translation: 嵌入印刷电路板的电感器包括沿着印刷电路板的厚度方向延伸的导体和与导体接触而不间隙的磁体。 例如，磁体由具有圆柱形管状的铁氧体构成。 导体由在圆筒形管状铁氧体的内周面上电镀形成的铜膜构成。 电感器沿印刷电路板的厚度方向插入。

公开(公告)号：EP0914756A1

公开(公告)日：1999-05-12

申请号：EP97933088.0

申请日：1997-07-01

Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (publ)

Inventor： BERGSTEDT, Leif

IPC: H05K3 ,  H05K1

CPC classification number: H05K3/0094 ,  H05K1/0237 ,  H05K1/113 ,  H05K3/0082 ,  H05K3/3452 ,  H05K2201/09581 ,  H05K2203/0759

Abstract: The present invention relates to a solder stop in through-plated through-holes in micro strip boards (8). A solder resist lacquer (18) with a certain viscosity is applied on a micro strip board (8) wherein the solder resist lacquer (18) flows out over the micro strip board (8) and down into a number of through-holes (14) before the solder resist lacquer is dried. A mask is placed over the dried solder resist lacquer (18), whereby transparent center surfaces on the mask are centered over respective openings in the through-holes (14). The micro strip board (8) is exposed to UV-light so that certain parts of the solder resist lacquer (18) on the micro strip board (8) and in the through-holes (14) are reached by the UV-light, whereby the exposed parts of the solder resist lacquer (18) can cure a first time. The micro strip board (8) is cleaned so that the parts of the solder resist lacquer (18) which have not cured are removed from the micro strip board (8). The micro strip board (8) is then placed in a heat oven, whereby the solder resist lacquer is cured completely by the heat in the oven a last time. The remaining completely cured solder resist lacquer has in this way formed a solder stop (61) in the respective through-hole (14).

公开(公告)号：EP0702806B1

公开(公告)日：1999-03-03

申请号：EP95912388.6

申请日：1995-04-04

Applicant: Koninklijke Philips Electronics N.V. ,  PHILIPS NORDEN AB

Inventor： SPIERINGS, Gijbertus, Adrianus, Cornelus, Maria ,  HEIJBOER, Willem, Leonardus, Cornelis, Marinus ,  REMEEUS, Leo, Osman

IPC: G03F7/30 ,  G03F1/08 ,  H01J17/49 ,  H01J31/12

CPC classification number: H01J9/148 ,  G03F7/00 ,  G03F7/0007 ,  G03F7/0015 ,  G03F7/11 ,  G03F7/164 ,  H01J9/14 ,  H01J9/146 ,  H01J2209/012 ,  H01J2329/00 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/0094 ,  H05K3/064 ,  H05K3/388 ,  H05K2201/09581 ,  H05K2203/135

Abstract: A description is given of a method of metallizing an electrically insulating plate (1), for example, of glass having a large number of holes (3). Said holes are internally provided with a metal layer (21) and the plate is provided with metal tracks (23). The metal used is mainly aluminium. The aluminium is coated with a thin protective layer of chromium, cobalt, nickel, zirconium or titanium. Said protective layer makes it possible to use a photosensitive, cataphoretic lacquer for providing the metal layer with a structure. The method can very suitable be used for the manufacture of selection plates for thin electron displays.

公开(公告)号：EP0562187B1

公开(公告)日：1996-01-10

申请号：EP92302521.7

申请日：1992-03-24

Applicant: SANWA LABORATORY LTD.

Inventor： Yamaguchi, Hideaki ,  Kawai, Hideyuki ,  Tachibana, Daikichi ,  Yamaguchi, Kenichi

IPC: H05K3/06

CPC classification number: H05K3/061 ,  C23F1/02 ,  H05K3/0094 ,  H05K3/427 ,  H05K2201/09581 ,  H05K2203/0582 ,  H05K2203/0591 ,  H05K2203/0769 ,  H05K2203/0786 ,  H05K2203/124

公开(公告)号：EP0393381B1

公开(公告)日：1995-11-08

申请号：EP90105609.3

申请日：1990-03-24

Applicant: International Business Machines Corporation

Inventor： Davis, Charles Robert ,  Goldblatt, Ronald Dean

IPC: H05K3/44 ,  H05K3/00

CPC classification number: B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2201/35 ,  B23K2203/08 ,  B23K2203/10 ,  B23K2203/12 ,  B23K2203/166 ,  B23K2203/172 ,  B23K2203/18 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/52 ,  B23K2203/54 ,  B23K2203/56 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/0129 ,  H05K2201/09581 ,  H05K2203/0278 ,  H05K2203/068 ,  H05K2203/1438