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81.发明申请公开(公告)号：US20050239347A1
公开(公告)日：2005-10-27
申请号：US11167662
申请日：2005-06-27
Applicant: Bruce Chamberlin , Mark Hoffmeyer , Wai Ma , Arch Nuttall , James Stack
Inventor： Bruce Chamberlin , Mark Hoffmeyer , Wai Ma , Arch Nuttall , James Stack
CPC classification number: H05K3/4046 , H05K1/112 , H05K3/225 , H05K3/429 , H05K2201/1025 , H05K2201/10287 , H05K2201/10871 , H05K2203/0242 , H05K2203/175 , Y10T29/49165 , Y10T29/49167
Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。
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82.发明申请Method and structure for repairing or modifying surface connections on circuit boards 失效修理或修改电路板表面连接的方法和结构公开(公告)号：US20040216919A1
公开(公告)日：2004-11-04
申请号：US10860427
申请日：2004-06-03
Applicant: International Business Machines Corporation
Inventor： Bruce John Chamberlin , Mark Kenneth Hoffmeyer , Wai Mon Ma , Arch Nuttall , James R. Stack
IPC: H05K007/06
CPC classification number: H05K3/4046 , H05K1/112 , H05K3/225 , H05K3/429 , H05K2201/1025 , H05K2201/10287 , H05K2201/10871 , H05K2203/0242 , H05K2203/175 , Y10T29/49165 , Y10T29/49167
Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
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83.发明授权Method and structure for repairing or modifying surface connections on circuit boards 有权修理或修改电路板表面连接的方法和结构公开(公告)号：US06784377B2
公开(公告)日：2004-08-31
申请号：US10205102
申请日：2002-07-25
Applicant: Bruce John Chamberlin , Mark Kenneth Hoffmeyer , Wai Mon Ma , Arch Nuttall , James R. Stack
Inventor： Bruce John Chamberlin , Mark Kenneth Hoffmeyer , Wai Mon Ma , Arch Nuttall , James R. Stack
IPC: H01R1204
CPC classification number: H05K3/4046 , H05K1/112 , H05K3/225 , H05K3/429 , H05K2201/1025 , H05K2201/10287 , H05K2201/10871 , H05K2203/0242 , H05K2203/175 , Y10T29/49165 , Y10T29/49167
Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。
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84.发明申请Method and structure for repairing or modifying surface connections on circuit boards 有权修理或修改电路板表面连接的方法和结构公开(公告)号：US20020179324A1
公开(公告)日：2002-12-05
申请号：US10205102
申请日：2002-07-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce John Chamberlin , Mark Kenneth Hoffmeyer , Wai Mon Ma , Arch Nuttall , James R. Stack
IPC: H05K001/03
CPC classification number: H05K3/4046 , H05K1/112 , H05K3/225 , H05K3/429 , H05K2201/1025 , H05K2201/10287 , H05K2201/10871 , H05K2203/0242 , H05K2203/175 , Y10T29/49165 , Y10T29/49167
Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。
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85.发明申请Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball 失效通过在高铅焊球的顶部放置共晶焊球来制作高焊锡球的工艺公开(公告)号：US20020025599A1
公开(公告)日：2002-02-28
申请号：US09941384
申请日：2001-08-28
Applicant: Aptos Corporation
Inventor： Chung W. Ho , Tsing-Chow Wang
IPC: H01L021/48
CPC classification number: H01L24/12 , H01L21/4853 , H01L23/49816 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/13583 , H01L2224/136 , H01L2224/13647 , H01L2224/13671 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01054 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/3436 , H05K2201/0379 , H05K2201/1025 , H05K2201/2081 , H05K2203/0315 , Y02P70/613 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099 , H01L2924/00
Abstract: Within a method for forming a solder interconnection structure for use within a microelectronic fabrication, there is first provided a substrate having formed thereover a bond pad. There is then formed upon the bond pad a first solder interconnection layer. There is then formed over the first solder interconnection layer an annular solder non-wettable copper oxide layer which does not cover an upper dome portion of the first solder interconnection layer. There is then formed over the upper dome portion of the first solder interconnection layer and not upon the annular solder non-wettable copper oxide layer a second solder interconnection layer.
Abstract translation: 在用于形成在微电子制造中使用的焊料互连结构的方法中，首先提供了在接合焊盘之上形成的衬底。 然后在接合焊盘上形成第一焊料互连层。 然后在第一焊料互连层上形成不覆盖第一焊料互连层的上部圆顶部分的环形焊料不可湿性氧化铜层。 然后形成在第一焊料互连层的上部圆顶部分上方，而不是在环形焊料不可湿性氧化铜层上形成第二焊料互连层。
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Patent Agency Ranking86.发明授权Method for forming metallized patterns on the top surface of a printed circuit board 失效在印刷电路板的顶表面上形成金属化图案的方法
公开(公告)号：US5829124A
公开(公告)日：1998-11-03
申请号：US580678
申请日：1995-12-29
Applicant: John Steven Kresge , David Noel Light
Inventor： John Steven Kresge , David Noel Light
CPC classification number: H05K3/4015 , H05K1/113 , H05K2201/0376 , H05K2201/096 , H05K2201/1025 , H05K2203/0278 , H05K2203/1394 , H05K3/0094 , H05K3/4007 , H05K3/4614 , Y10T29/4913 , Y10T29/49144
Abstract: A method for attaching pads to a high density printed circuit board (PCB) having a plurality of through-holes opening on the top surface. The method includes forming a plurality of pads on a carrier sheet so that each of said pads have a copper layer proximate to said carrier sheet and a joining metal layer formed on top of said copper layer, positioning the plurality of pads on the carrier sheet so that they are aligned with the through-hole pattern on the top surface of the PCB, laminating the pads to the through-holes on the top surface using the joining metal, and separating the carrier sheet from the plurality of pads that are joined to the through-holes so that the copper layer is exposed. The pads may comprise a variety of shapes such as disk-shaped, elongated, or rectangular, and can cover one or multiple through-holes. An electrical component may be soldered to the pad. The method advantageously prevents wicking of the solderball volume into the through-hole, thereby increasing yield and part reliability. In one embodiment, the pad and through-hole may be compressed so that the top surface of the pad is even (flush) with the top surface of the external dielectric surface.
Abstract translation: 一种用于将焊盘附接到具有在顶表面上开口的多个通孔的高密度印刷电路板（PCB）的方法。 该方法包括在载体片上形成多个焊盘，使得每个焊盘具有靠近所述载体片的铜层和形成在所述铜层顶部的接合金属层，将多个焊盘定位在载体片上 它们与PCB的顶表面上的通孔图案对准，使用接合金属将焊盘层压到顶表面上的通孔，并将载体片从与多个焊盘接合的多个焊盘分离 通孔使铜层露出。 垫可以包括各种形状，例如盘形，细长或矩形，并且可以覆盖一个或多个通孔。 电气部件可以焊接到焊盘。 该方法有利地防止了焊球体积进入通孔，从而提高了产量和部件的可靠性。 在一个实施例中，垫和通孔可以被压缩，使得垫的顶表面与外部电介质表面的顶表面均匀（齐平）。
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公开(公告)号：US4692843A
公开(公告)日：1987-09-08
申请号：US929819
申请日：1986-11-13
Applicant: Masaru Matsumoto , Mikio Nishihara , Kiyoshi Kuwabara
Inventor： Masaru Matsumoto , Mikio Nishihara , Kiyoshi Kuwabara
CPC classification number: H05K3/462 , H05K1/0272 , H05K2201/09536 , H05K2201/096 , H05K2201/1025 , H05K2201/2036 , H05K3/4623 , H05K3/4647
Abstract: A multilayer printed wiring board having an air gap between neighboring printed wiring boards of the multilayer printed wiring board by inserting plated spacers to both end faces of through-hole pads which are provided to each printed wiring board so that each through-hole pad opposes to another through-hole pad on the neighboring printed wiring board. The spacers opposed to each other are joined together by solder, and each spacer has an end surface having a size being smaller than a size of the end surface of each through-hole pad to provide a drop part at the joint part of the spacers, so that melted solder stays at the drop part not flowing toward the board through the side surface of the through-hole pad when the printed wiring boards are integrated to the multilayer printed wiring board under pressure and high temperature.
Abstract translation: 一种多层印刷线路板，其通过将设置在每个印刷线路板上的通孔焊盘的两个端面插入电镀间隔件，使得每个通孔焊盘与所述多层印刷线路板的相邻的印刷线路板之间具有气隙， 相邻印刷电路板上的另一个通孔焊盘。 彼此相对的间隔件通过焊料接合在一起，并且每个间隔件具有尺寸小于每个通孔焊盘的端面的尺寸的端面，以在间隔件的接合部分处提供液滴部分， 使得当印刷线路板在压力和高温下与多层印刷线路板集成在一起时，熔融的焊料停留在通过通孔焊盘的侧表面而不流向板的液滴部分。
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公开(公告)号：US4610908A
公开(公告)日：1986-09-09
申请号：US730256
申请日：1985-05-06
Applicant: Robert S. Reylek , James G. Berg
Inventor： Robert S. Reylek , James G. Berg
CPC classification number: H05K3/323 , H01R4/04 , H05K2201/09945 , H05K2201/1025 , H05K2203/1189 , H05K3/361 , Y10T428/24355 , Y10T428/24372 , Y10T428/24479 , Y10T428/24521 , Y10T428/24579 , Y10T428/24612 , Y10T428/24802 , Y10T428/24851 , Y10T428/24893 , Y10T428/24959 , Y10T428/25 , Y10T428/28 , Y10T428/2813 , Y10T428/2887 , Y10T428/2891
Abstract: Insulated sheet material useful for making bonded electrical connections, especially to sets of small side-by-side terminal pads. In one typical form, the sheet material is an elongated tape comprising an elongated insulating web; a plurality of narrow spaced parallel elongated electrically conductive stripes on the web; electrically conductive adhesive disposed over the stripes comprising a layer of adhesive material in which are dispersed a monolayer of rather thick electrically conductive particles; and a thin electrically insulating layer disposed over the conductive adhesive and which is nontacky or poorly tacky at room temperature, provides high electrical resistance throughout the layer to the conductive particles, softens to an adhesive and flowable condition upon heating to an elevated temperature, and upon cooling to room temperature assumes a firm and substantially nonflowable condition. Such a connector tape is readily handleable and free from conductive bonding at room temperature but when laid over a set of adjacent spaced terminal pads with the electrically conductive stripes in registry with the pads, and pressed and heated, the conductive particles penetrate through the insulating layer to make electrical connection to the pads.
Abstract translation: 用于制造粘结电连接的绝缘片材料，特别是小型并排端子焊盘的组合。 在一种典型形式中，片材是包括细长绝缘网的细长带; 在幅材上的多个窄间隔的平行细长的导电条纹; 布置在条纹之上的导电粘合剂包括一层粘合剂材料，其中分散有相当厚的导电颗粒的单层; 以及设置在导电粘合剂上并且在室温下不粘或不良粘性的薄的电绝缘层，在整个层向导电颗粒提供高电阻，在加热到高温时软化到粘合剂和可流动状态，并且在 冷却至室温呈现稳固且基本上不可流动的状态。 这种连接器带易于处理并且在室温下没有导电接合，但是当放置在一组相邻间隔的端子焊盘上，导电条与焊盘对准并被加压和加热时，导电颗粒穿过绝缘层 以使电连接到焊盘。
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公开(公告)号：JP5641775B2
公开(公告)日：2014-12-17
申请号：JP2010108152
申请日：2010-05-10
CPC classification number: H05K3/4015 , H01L23/48 , H01L2924/0002 , H05K3/325 , H05K2201/0311 , H05K2201/09745 , H05K2201/1025 , H01L2924/00
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公开(公告)号：JP2010278429A
公开(公告)日：2010-12-09
申请号：JP2010108152
申请日：2010-05-10
Inventor： MAUER PETER
CPC classification number: H05K3/4015 , H01L23/48 , H01L2924/0002 , H05K3/325 , H05K2201/0311 , H05K2201/09745 , H05K2201/1025 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a contact device which is constituted in a simple manner and guarantees the same characteristics over the whole service life of a power semiconductor module. SOLUTION: The contact device for the power semiconductor module has a resilient contact element with a contacting end (18) provided for contacting with a terminal element (14) of a planar circuit carrier (12) of the power semiconductor module. The contacting end (18) is constituted in a simple manner in a rectilinear pin-shape fashion and the terminal element (14) has a chip component (10) which is formed with a center recess (16) for the contacting end (18) of the resilient contact element. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：提供一种以简单的方式构成并在功率半导体模块的整个使用寿命内保证相同特性的接触装置。 解决方案：用于功率半导体模块的接触装置具有弹性接触元件，其具有设置用于与功率半导体模块的平面电路载体（12）的端子元件（14）接触的接触端（18）。 接触端（18）以直线形销状方式简单地构成，并且端子元件（14）具有形成有用于接触端（18）的中心凹部（16）的芯片部件（10） 的弹性接触元件。 版权所有（C）2011，JPO＆INPIT
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