公开(公告)号：US07199309B2

公开(公告)日：2007-04-03

申请号：US11167662

申请日：2005-06-27

Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US06576013B1

公开(公告)日：2003-06-10

申请号：US10041342

申请日：2002-01-08

Applicant: Mark Budman ,  James R. Stack

Inventor： Mark Budman ,  James R. Stack

IPC: A61F214

CPC classification number: A61F2/141

Abstract: An ocular prosthesis displays an iris and pupil image on a color liquid crystal array display device. A plurality of iris images are stored as data in a memory. Ambient light level is detected by a light sensor device. An image is selected based on light level and sent to the array display device.

Abstract translation: 眼睛假体在彩色液晶阵列显示装置上显示虹膜和瞳孔图像。 多个虹膜图像作为数据存储在存储器中。 环境光级由光传感器装置检测。 基于光级选择图像并发送到阵列显示设备。

公开(公告)号：US06912780B2

公开(公告)日：2005-07-05

申请号：US10860427

申请日：2004-06-03

Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H01R12/00 ,  H05K1/11 ,  H05K3/22 ,  H05K3/40 ,  H05K3/42 ,  H01K3/10

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US06407341B1

公开(公告)日：2002-06-18

申请号：US09557802

申请日：2000-04-25

Applicant: Donald O. Anstrom ,  Bruce J. Chamberlin ,  James W. Fuller, Jr. ,  John M. Lauffer ,  Voya R. Markovich ,  Douglas O. Powell ,  Joseph P. Resavy ,  James R. Stack

Inventor： Donald O. Anstrom ,  Bruce J. Chamberlin ,  James W. Fuller, Jr. ,  John M. Lauffer ,  Voya R. Markovich ,  Douglas O. Powell ,  Joseph P. Resavy ,  James R. Stack

IPC: H05K114

CPC classification number: H01L23/50 ,  H01L23/5383 ,  H01L23/5385 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/09309 ,  H05K2201/09536 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: Conductive substructures of a multilayered laminate and associated methods of fabrication. The conductive substructures include a 0S1P substructure, a 0S3P substructure, and a 2S1P substructure, in accordance with the notation nSmP, wherein n and m are non-negative integers, wherein S stands for “signal plane,” and wherein P stands for “power plane.” A signal plane is characterized by its inclusion of a layer comprising conductive circuitry. A power plane is characterized by its inclusion of a continuously conductive layer. Thus, a 0S1P substructure includes 0 signal planes and 1 power plane (n=0, m=1). A 0S3P substructure includes 0 signal planes and 3 power plane (n=0, m=3) with a dielectric layer between each pair of power planes. A 2S1P substructure includes 2 signal planes and 1 power plane (n=2, m=1) with a dielectric layer between the power plane and each signal plane. A multilayered laminate includes a stacked substructure configuration having any combination of 0S1P, 0S3P, and 2S1P substructures with dielectric material insulatively separating the substructures from one another.

Abstract translation: 多层层压板的导电子结构和相关的制造方法。 根据符号nSmP，导电子结构包括0S1P子结构，0S3P子结构和2S1P子结构，其中n和m是非负整数，其中S代表“信号面”，其中P代表“功率 飞机“。 信号平面的特征在于其包括包括导电电路的层。 功率平面的特征在于其包括连续导电层。 因此，0S1P子结构包括0个信号平面和1个功率平面（n = 0，m = 1）。 0S3P子结构包括0个信号平面和3个电源平面（n = 0，m = 3），每对电源层之间具有介电层。 2S1P子结构包括2个信号面和1个功率平面（n = 2，m = 1），电源层与每个信号平面之间具有介电层。 多层层压板包括具有0S1P，0S3P和2S1P子结构的任何组合的堆叠的子结构配置，其中介电材料将子结构彼此绝缘地分离。

公开(公告)号：US06426466B1

公开(公告)日：2002-07-30

申请号：US09501480

申请日：2000-02-09

Applicant: Bruce J. Chamberlin ,  John M. Lauffer ,  James R. Stack

Inventor： Bruce J. Chamberlin ,  John M. Lauffer ,  James R. Stack

IPC: H05K102

CPC classification number: H05K1/0263 ,  H01R12/7088 ,  H05K3/325 ,  H05K3/403 ,  H05K3/4641 ,  H05K2201/0919 ,  H05K2201/10272 ,  H05K2201/2018

Abstract: A printed wiring board structure having peripheral power input. A printed wiring board having internal conductive layers, wherein each internal conductive layer contains a plurality of tabs extending therefrom. Tabs of similar voltage are vertically aligned within the printed wiring board. A frame within which the printed wiring board is mounted is also provided. The frame, having connections mounted within an inner surface of the frame, electrically contacts the tabs along the periphery of the printed wiring board.

Abstract translation: 具有外围电源输入的印刷电路板结构。 一种具有内部导电层的印刷线路板，其中每个内部导电层包含从其延伸的多个翼片。 类似电压的标签在印刷电路板内垂直对齐。 还提供了安装印刷电路板的框架。 具有安装在框架的内表面内的连接的框架沿着印刷线路板的周边与接片电接触。

公开(公告)号：US06784377B2

公开(公告)日：2004-08-31

申请号：US10205102

申请日：2002-07-25

Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H01R1204

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US07173193B2

公开(公告)日：2007-02-06

申请号：US10403148

申请日：2003-03-31

Applicant: William Louis Brodsky ,  Mark Kenneth Hoffmeyer ,  James R. Stack

Inventor： William Louis Brodsky ,  Mark Kenneth Hoffmeyer ,  James R. Stack

IPC: H05K3/02 ,  H05K1/11 ,  H01R12/04

CPC classification number: H05K1/0271 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/112 ,  H05K2201/0191 ,  H05K2201/093 ,  H05K2201/09609 ,  H05K2201/09681 ,  H05K2201/09718 ,  H05K2201/10719 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method and structure are provided for implementing enhanced interconnection performance of an electrical connector, such as a land grid array (LGA) module, and a printed wiring board. A multi-layer printed wiring board includes a plurality of predefined ground and power layers. At least one of the predefined ground and power layers includes a thickness variation minimizing structure for minimizing thickness variation. The thickness variation minimizing structure includes a perforated pattern within a selected area of the at least one of the predefined ground and power layers. The selected area is proximate to predefined module sites, such as land grid array (LGA) module sites, in the ground and power layers. The selected area can include regions surrounding each predefined module site, and also can include a region within the module site.

Abstract translation: 提供了一种用于实现电连接器（例如，平面栅格阵列（LGA）模块）和印刷电路板的增强的互连性能的方法和结构。 多层印刷线路板包括多个预定义的接地层和功率层。 预定义的接地层和功率层中的至少一个包括用于最小化厚度变化的厚度变化最小化结构。 厚度变化最小化结构包括在预定义的接地层和功率层中的至少一个的选定区域内的穿孔图案。 所选择的区域靠近预定义的模块站点，例如地面和电力层中的陆地网格阵列（LGA）模块站点。 所选择的区域可以包括围绕每个预定义模块站点的区域，并且还可以包括模块站点内的区域。

公开(公告)号：US06832436B2

公开(公告)日：2004-12-21

申请号：US10094025

申请日：2002-03-07

Applicant: Donald O. Anstrom ,  Bruce J. Chamberlin ,  James W. Fuller, Jr. ,  John M. Lauffer ,  Voya R. Markovich ,  Douglas O. Powell ,  Joseph P. Resavy ,  James R. Stack

Inventor： Donald O. Anstrom ,  Bruce J. Chamberlin ,  James W. Fuller, Jr. ,  John M. Lauffer ,  Voya R. Markovich ,  Douglas O. Powell ,  Joseph P. Resavy ,  James R. Stack

IPC: H01K310

CPC classification number: H01L23/50 ,  H01L23/5383 ,  H01L23/5385 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/09309 ,  H05K2201/09536 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A method for forming a substructure or an electrical structure. To form the substructure, a sheet of conductive material having exposed first and second surfaces is provided. A hole is formed through the sheet of conductive material. A first layer of dielectric material is applied to the exposed first surface, after the forming the hole. No material was inserted into the hole before applying the first layer of dielectric material to the exposed first surface. To form the electrical structure, a multilayered laminate that includes a plurality of substructures is formed such that a dielectric layer insulatively separates each pair of successive substructures.

Abstract translation: 一种形成子结构或电结构的方法。 为了形成子结构，提供具有暴露的第一和第二表面的导电材料片。 通过导电材料片形成孔。 在形成孔之后，将第一层介电材料施加到暴露的第一表面。 在将第一层介电材料施加到暴露的第一表面之前，没有将材料插入孔中。 为了形成电气结构，形成包括多个子结构的多层层压体，使得介电层绝对地分离每对连续的子结构。

公开(公告)号：US06593534B2

公开(公告)日：2003-07-15

申请号：US09812261

申请日：2001-03-19

Applicant: Gerald W. Jones ,  John M. Lauffer ,  Voya R. Markovich ,  Thomas R. Miller ,  James P. Paoletti ,  Konstantinos I. Papathomas ,  James R. Stack

Inventor： Gerald W. Jones ,  John M. Lauffer ,  Voya R. Markovich ,  Thomas R. Miller ,  James P. Paoletti ,  Konstantinos I. Papathomas ,  James R. Stack

IPC: H01R909

CPC classification number: H05K3/462 ,  H05K1/115 ,  H05K3/4069 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0554

Abstract: A structure of and method for producing a multilayer printed or wiring circuit board, and more particularly a method producing so-called z-axis or multilayer electrical interconnections in a hierarchial wiring structure in order to be able to provide for an increase in the number of inputs and outputs (I/O) in comparison with a standard printed wiring board (PWB) arrangement, and a printed wiring board produced by the method.