Abstract:
A method and system are provided for prototyping a circuit design using a secure server connected to a network. A customer's client computer transfers an encrypted circuit design to a secure server. An consulting engineer's client computer then connects to the server, accesses the design, and prototypes the design. The prototype is sent to the customer, either as programming files which the customer uses to program a hardware prototype, as a programmed hardware prototype, or as programming files stored in flash memory which the customer uses to program a configurable hardware prototype. In one embodiment, the server is connected to the public network through a firewall and the circuit design file is encrypted. The customer's client computer transfers the circuit design to the server using a password to create through the firewall a virtual public network authorized by the server.
Abstract:
A universal interconnect matrix area array (605) comprised of a first set of conductive leads (608-1 through 608-J) formed in a first direction, a second set of conductive leads (609-1 through 609-K) formed in a second direction, the second direction being not parallel to the first direction, and structure for electrically interconnecting selected ones of the conductive leads in the first set of conductive leads (608-1 through 608-J) to one or more of the conductive leads in the second set of conductive leads (609-1 through 609-K). Input/output pads (607-1,1 through 607-M,N) are formed and connected to selected ones of the first set of conductive leads (608-1 through 608-J) and second set of conductive leads (609-1 through 609-K). Selected ones of the conductive leads are segmented thereby to allow any input/output pad to be connected to one or more of the other input/output pads (607-1,1 through 607-M,N) without removing from use any input/output pads (607-1,1 through 607-M,N), not intended to be so connected.
Abstract:
A programmable interconnect system includes a two-level hierarchical structure of programmable interconnect chips (120.1-120.6 and 130.1-130.2) on a circuit board (110). The first-level, or "local", interconnect chips are connected to user components (150.1-150.5). A plurality of second-level, or "global", interconnect chips interconnect the local interconnect chips so that every local chip is connected to every global chip. Such a system allows connecting any pin of any user component to any other pin of any user component by a conductive path passing through at most three interconnect chips. A large number of such paths are provided even in embodiments with a large number of interconnect chips.
Abstract:
A field programmable printed circuit board is provided which includes a multiplicity of component contacts for making electrical contact to the leads of electronic components to be mounted on the printed circuit board, a corresponding multiplicity of interconnect contacts for receipt of the leads on the package or packages of a programmable integrated circuit or circuits for interconnecting as desired the electronic components, and one or more layers of conductive traces formed on the printed circuit board, each conductive trace uniquely connecting electrically one component contact to one interconnect contact.
Abstract:
A first user re-programmable interconnect architecture is provided wherein N switching elements are connected between selected interconnect conductors. The switching elements are controlled by M active storage elements, where M
Abstract:
The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customised pattern of bonding pads is then formed over the one or both surface of the substrate which correspond to the terminal footprints of specific surface mounted packages intended to be mounted on the substrate. A generalised pattern of bonding pads may also be formed on the surface of the substrate for electrically connecting terminals of bare dice thereto by means of thin wire. All bonding pads are electrically connected to one or more vias by direct electrical contact or by a conductive trace extending from the bonding pad to a nearly via.
Abstract:
A pullup circuit for use with plurality of N-Channel pulldown transistors (14a,..., 14n) connected to a bit line (12) includes a P-channel MOS pullup transistor (10) connected between the bit line (12) and a voltage rail (V DD ). An inverter (32) is connected between the bit line (12) and the drain of an N-Channel MOS transistor (34) having its gate connected to the voltage rail (V DD ) and its source connected to the gate of the P-Channel MOS pullup transistor (10). A first P-Channel MOS transistor (36) is connected between the voltage rail (V DD ) and the gate of the P-Channel MOS pullup transistor (10). A second P-Channel MOS transistor (38) having its gate connected to ground is connected between the bit line (12) and the gate of the first P-Channel MOS transistor (10). Four P-Channel MOS divider transistors (40,42,44,46) are connected between the drain of the first P-Channel MOS transistor (10) and ground. The gates of the P-Channel MOS divider transistors (40,42,44,46) are connected together to ground. The P-Channel MOS pullup transistor (10) and the N-Channel MOS pulldown transistors (14a,...,14n) are large. The first and second P-Channel MOS transistors (36,38), the first N-Channel MOS transistor (34), and the P-Channel MOS divider transistors (40,42,44,46) are close to minimum size. The P-Channel and N-Channel devices comprising the inverter devices are larger than minimum size.
Abstract:
A first user re-programmable interconnect architecture is provided wherein N switching elements are connected between selected interconnect conductors. The switching elements are controlled by M active storage elements, where M
Abstract:
Apparatus for forcing a memory cell to a known state upon power-up includes circuitry for providing two signals PWRUP and PWRUPB which are used during chip power-up. At power-up, as V cc rises from 0 volt to 3.5 volts, the PWRUP signal follows V cc and the PWRUPB signal maintains 0 volts. The PWRUP and PWRUPB signals are used to drive the gates of P-Channel and N-Channel MOS transistors, respectively, including pass gates connected between word line driver circuits and bit line driver circuits driving the word lines and bit lines associated with the memory cells. In addition, the PWRUPB signal is used to drive P-Channel MOS pullup transistors connected between the word lines and V cc and the bit lines and V cc . During power-up, the pass gates are disabled, disconnecting the word lines and bit lines from their drivers. The word lines and bit lines are forced to follow the rise of V cc by the P-Channel pullup transistors. When V cc reaches its desired value, the PWRUP signal goes to 0 volts and the PWRUPB signal goes to V cc , thus turning on the pass gates to connect the word line and bit line driver circuits to the word lines and bit lines. The V cc final PWRUPB signal turns off the P-Channel MOS pullup transistors connected between the word lines and V cc and the bit lines and Vcc.