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    線路基板
    2.
    发明专利
    線路基板 审中-公开
    线路基板

    公开(公告)号：TW201919446A

    公开(公告)日：2019-05-16

    申请号：TW107117075

    申请日：2018-05-18

    Applicant: 財團法人工業技術研究院 ,  INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE ,  高技企業股份有限公司 ,  FIRST HI-TEC ENTERPRISE CO.,LTD. ,  新漢股份有限公司 ,  NEXCOM INTERNATIONAL CO., LTD.

    Inventor： 洪勝哲 ,  HUNG, SHENG-CHE ,  李明林 ,  LEE, MIN-LIN ,  張景山 ,  CHANG, CHING-SHAN ,  劉宏益 ,  LIU, HUNG-I

    IPC: H05K1/11 ,  H05K1/02

    Abstract: 一種線路基板，包括介電層、第一導電結構及第二導電結構。第一導電結構包括第一導電線路及第一導電通孔。第一導電線路配置於介電層上。第一導電通孔配置於介電層內，第一導電線路連接第一導電通孔。第二導電結構包括第二導電線路及第二導電通孔。第二導電線路配置於介電層內且與第一導電結構之第一導電線路間隔地配置，第二導電通孔間隔地圍繞第一導電通孔。第二導電結構具有延伸部。延伸部突伸向第一導電通孔且不接觸第一導電通孔。

    Abstract in simplified Chinese: 一种线路基板，包括介电层、第一导电结构及第二导电结构。第一导电结构包括第一导电线路及第一导电通孔。第一导电线路配置于介电层上。第一导电通孔配置于介电层内，第一导电线路连接第一导电通孔。第二导电结构包括第二导电线路及第二导电通孔。第二导电线路配置于介电层内且与第一导电结构之第一导电线路间隔地配置，第二导电通孔间隔地围绕第一导电通孔。第二导电结构具有延伸部。延伸部突伸向第一导电通孔且不接触第一导电通孔。

    CIRCUIT SUBSTRATE
    6.
    发明申请
    CIRCUIT SUBSTRATE 审中-公开

    公开(公告)号：US20190148300A1

    公开(公告)日：2019-05-16

    申请号：US16052641

    申请日：2018-08-02

    Applicant: Industrial Technology Research Institute ,  First Hi-tec Enterprise Co.,Ltd. ,  NEXCOM International Co., Ltd.

    Inventor： Sheng-Che Hung ,  Min-Lin Lee ,  Ching-Shan Chang ,  Hung-I Liu

    IPC: H01L23/538 ,  H01L23/00 ,  H01L23/522

    Abstract: A circuit substrate includes a dielectric layer, a first conductive structure and a second conductive structure. The first conductive structure includes a first conductive circuit and a first conductive via. The first conductive circuit is disposed on the dielectric layer. The first conductive via is disposed in the dielectric layer, and the first conductive circuit is connected to the first conductive via. The second conductive structure includes a second conductive circuit and a second conductive via. The second conductive circuit is disposed in the dielectric layer, the second conductive circuit and the first conductive circuit of the first conductive structure are arranged with an interval, and the second conductive via surrounds the first conductive via with an interval. The second conductive structure has an extending portion. The extending portion protrudes toward the first conductive via and does not contact the first conductive via.

    Circuit substrate
    10.
    发明授权
    Circuit substrate 有权

    公开(公告)号：US10559534B2

    公开(公告)日：2020-02-11

    申请号：US16052641

    申请日：2018-08-02

    Applicant: Industrial Technology Research Institute ,  First Hi-tec Enterprise Co., Ltd. ,  NEXCOM International Co., Ltd.

    Inventor： Sheng-Che Hung ,  Min-Lin Lee ,  Ching-Shan Chang ,  Hung-I Liu

    IPC: H05K1/18 ,  H01L23/538 ,  H01L23/522 ,  H01L23/00 ,  H05K1/02 ,  H01L23/498 ,  H05K1/11

    Abstract: A circuit substrate includes a dielectric layer, a first conductive structure and a second conductive structure. The first conductive structure includes a first conductive circuit and a first conductive via. The first conductive circuit is disposed on the dielectric layer. The first conductive via is disposed in the dielectric layer, and the first conductive circuit is connected to the first conductive via. The second conductive structure includes a second conductive circuit and a second conductive via. The second conductive circuit is disposed in the dielectric layer, the second conductive circuit and the first conductive circuit of the first conductive structure are arranged with an interval, and the second conductive via surrounds the first conductive via with an interval. The second conductive structure has an extending portion. The extending portion protrudes toward the first conductive via and does not contact the first conductive via.

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