公开(公告)号：WO1996019912A1

公开(公告)日：1996-06-27

申请号：PCT/US1995015809

申请日：1995-12-07

Applicant: RESEARCH ORGANIZATION FOR CIRCUIT KNOWLEDGE

Inventor： RESEARCH ORGANIZATION FOR CIRCUIT KNOWLEDGE ,  ROBERTS, Joseph, A.

IPC: H05K01/00

CPC classification number: H01R31/00 ,  H05K1/036 ,  H05K3/045 ,  H05K3/281 ,  H05K3/328 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4647 ,  H05K7/1451 ,  H05K9/0039 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0715 ,  H05K2203/025 ,  H05K2203/063 ,  Y10T29/49155

Abstract: A process and apparatus for producing supported conductive networks (1) which can be flexible or rigid, having densely packed circuits (3). The process and apparatus for making the conductive network (1) involves forming a conductive material (8) supported on a "dynamic pressure cushion" into a non-planar pattern defining the desired conductive circuits (3) in relation to a fixed reference plane (32). The "dynamic pressure cushion" is a material having suitable viscosity and flow characteristics to flow out from under the conductive material (8) as it is being formed and fill up any voids. To ensure that the "dynamic pressure cushion" properly flows without deforming the desired circuits (3), the die (6) used to form the conductive material (8) is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane (32) leaving the desired conductive circuits (3).

Abstract translation: 一种用于生产能够柔性或刚性的支撑导电网络（1）的制造和装置，具有密集堆积的电路（3）。 用于制造导电网络（1）的方法和装置包括将支撑在“动态压力缓冲层”上的导电材料（8）形成为限定所需导电电路（3）相对于固定参考平面的非平面图案（ 32）。 “动态压力缓冲垫”是具有适当的粘度和流动特性的材料，当导电材料（8）形成时，其从下面流出并填充任何空隙。 为了确保“动态压力衬垫”适当地流动而不使期望的电路（3）变形，用于形成导电材料（8）的模具（6）设置有材料流动控制栅格和材料膨胀槽。 在形成不需要的材料之后，以与参考平面（32）的尺寸关系机械地去除留下所需的导电电路（3）。

公开(公告)号：EP0806127B1

公开(公告)日：2002-06-05

申请号：EP95943682.5

申请日：1995-12-07

Applicant: RESEARCH ORGANIZATION FOR CIRCUIT KNOWLEDGE

Inventor： ROBERTS, Joseph, A.

IPC: H05K3/04

CPC classification number: H01R31/00 ,  H05K1/036 ,  H05K3/045 ,  H05K3/281 ,  H05K3/328 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4647 ,  H05K7/1451 ,  H05K9/0039 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0715 ,  H05K2203/025 ,  H05K2203/063 ,  Y10T29/49155

Abstract: A process and apparatus for producing supported conductive networks (1) which can be flexible or rigid, having densely packed circuits (3). The process and apparatus for making the conductive network (1) involves forming a conductive material (8) supported on a 'dynamic pressure cushion' into a non-planar pattern defining the desired conductive circuits (3) in relation to a fixed reference plane (32). The 'dynamic pressure cushion' is a material having suitable viscosity and flow characteristics to flow out from under the conductive material (8) as it is being formed and fill up any voids. To ensure that the 'dynamic pressure cushion' properly flows without deforming the desired circuits (3), the die (6) used to form the conductive material (8) is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane (32) leaving the desired conductive circuits (3).

公开(公告)号：EP0806127A1

公开(公告)日：1997-11-12

申请号：EP95943682.0

申请日：1995-12-07

Applicant: RESEARCH ORGANIZATION FOR CIRCUIT KNOWLEDGE

Inventor： ROBERTS, Joseph, A.

IPC: B21D22 ,  B21D31 ,  H01R31 ,  H05K3 ,  H05K7 ,  H05K9 ,  H05K1

CPC classification number: H01R31/00 ,  H05K1/036 ,  H05K3/045 ,  H05K3/281 ,  H05K3/328 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4647 ,  H05K7/1451 ,  H05K9/0039 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0715 ,  H05K2203/025 ,  H05K2203/063 ,  Y10T29/49155

Abstract: A process and apparatus for producing supported conductive networks (1) which can be flexible or rigid, having densely packed circuits (3). The process and apparatus for making the conductive network (1) involves forming a conductive material (8) supported on a 'dynamic pressure cushion' into a non-planar pattern defining the desired conductive circuits (3) in relation to a fixed reference plane (32). The 'dynamic pressure cushion' is a material having suitable viscosity and flow characteristics to flow out from under the conductive material (8) as it is being formed and fill up any voids. To ensure that the 'dynamic pressure cushion' properly flows without deforming the desired circuits (3), the die (6) used to form the conductive material (8) is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane (32) leaving the desired conductive circuits (3).

公开(公告)号：EP1155601A1

公开(公告)日：2001-11-21

申请号：EP98964029.7

申请日：1998-12-17

Applicant: RESEARCH ORGANIZATION FOR CIRCUIT KNOWLEDGE

Inventor： ROBERTS, Joseph A.

IPC: H05K3/02

Abstract: Methods of facilitating commercial production of supported conductive networks without the use of hazardous chemicals including using heat flowable adhesive in the formation of the networks (2), providing contact pads (8) exposed through a dielectric substrate (6) which supports a conductive network (2), using the thickness of a conductor (4) supporting dielectric layer (6) to space the conductors (2) and providing conductor and waste material (18) cross-sections trapezoidal in shape in a non-planar pattern during manufacture of the networks.