公开(公告)号：WO2007076014A2

公开(公告)日：2007-07-05

申请号：PCT/US2006049027

申请日：2006-12-21

Applicant: WORLD PROPERTIES INC ,  ST LAWRENCE MICHAEL E ,  SETHUMADHAVAN MURALI ,  SHERE ANI

Inventor： ST LAWRENCE MICHAEL E ,  SETHUMADHAVAN MURALI ,  SHERE ANI

CPC classification number: H05K1/0373 ,  B82Y10/00 ,  H01L23/3735 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/068 ,  Y10T428/31504 ,  H01L2924/00

Abstract: A thermal management circuit material comprises an electrically conductive layer; a dielectric layer comprising a polymer matrix and a thermally conductive, electrically non-conductive particulate filler, wherein the dielectric layer is disposed on and in at least partial contact with the electrically conductive layer, and wherein the circuit material has a thermal conductivity of greater than or equal to about 1 watt per meter-degree Kelvin.

Abstract translation: 热管理电路材料包括导电层; 介电层，其包含聚合物基体和导热的不导电微粒填充物，其中所述介电层设置在所述导电层上并至少部分接触所述导电层，并且其中所述电路材料具有大于 或等于约1瓦每米开尔文。