ASSEMBLY INCLUDING VERTICAL AND HORIZONTAL JOINED CIRCUIT PANELS
    2.
    发明申请
    ASSEMBLY INCLUDING VERTICAL AND HORIZONTAL JOINED CIRCUIT PANELS 审中-公开
    组装包括垂直和水平接合电路板

    公开(公告)号:WO2005119765A2

    公开(公告)日:2005-12-15

    申请号:PCT/US2005/019319

    申请日:2005-06-02

    Abstract: An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

    Abstract translation: 提供了一种组件,其包括具有顶表面的第一电路板,设置在第一介电元件上的第一介电元件和第一导电迹线。 此外,第二电路板具有底表面,第二电介质元件和设置在第二电介质元件上的第二导电迹线,其中第二电路板的至少一部分覆盖在第一电路板的至少一部分上。 该组件还包括具有第三电介质元件的互连电路板,第三电介质元件具有前表面,与前表面相对的后表面,在前表面和后表面之间延伸的顶端,在前表面和后表面之间延伸的底端,以及 布置在电介质元件上的多个互连迹线。 互连元件的底端邻接第一电路板的顶表面,并且顶端邻接第二电路板的底表面,其中至少一些第一导电迹线通过第二导电迹线与第二导电迹线导通连通 互连线。

    ASSEMBLY INCLUDING VERTICAL AND HORIZONTAL JOINED CIRCUIT PANELS
    4.
    发明申请
    ASSEMBLY INCLUDING VERTICAL AND HORIZONTAL JOINED CIRCUIT PANELS 审中-公开
    组装包括垂直和水平接合电路板

    公开(公告)号:WO2005119765A3

    公开(公告)日:2006-03-09

    申请号:PCT/US2005019319

    申请日:2005-06-02

    Abstract: An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

    Abstract translation: 提供了一种组件,其包括具有顶表面的第一电路板,设置在第一介电元件上的第一介电元件和第一导电迹线。 此外,第二电路板具有底表面,第二电介质元件和设置在第二电介质元件上的第二导电迹线,其中第二电路板的至少一部分覆盖在第一电路板的至少一部分上。 该组件还包括具有第三电介质元件的互连电路板,第三电介质元件具有前表面,与前表面相对的后表面,在前表面和后表面之间延伸的顶端,在前表面和后表面之间延伸的底端,以及 布置在电介质元件上的多个互连迹线。 互连元件的底端邻接第一电路板的顶表面,并且顶端邻接第二电路板的底表面,其中至少一些第一导电迹线通过第二导电迹线与第二导电迹线导通连通 互连线。

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