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公开(公告)号：WO2014126286A1
公开(公告)日：2014-08-21
申请号：PCT/KR2013/001437
申请日：2013-02-22
Applicant: (주)드림텍
CPC classification number: H05K3/361 , H05K3/323 , H05K2203/0278
Abstract: 상호 분리되는 하드 PCB(printed circuit board)와 FPCB(flexible printed circuit board)의 각 접속 단자를 이방성 도전필름을 이용한 열 압착 방식으로 접합시킴으로써, 생산 수율을 향상시킬 수 있는 이방성 도전필름을 이용한 분리형 인쇄회로기판의 접합 구조 및 그 접합 방법에 대하여 개시한다.
Abstract translation: 公开了使用各向异性导电膜的可分离印刷电路板的接合结构，以及具有接合结构的接合方法，将相互分离的硬质印刷电路板（PCB）的连接端子与柔性印刷电路板（FPCB）接合的方法由 使用各向异性导电膜的热压接方法的手段，从而提高了生产率。
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公开(公告)号：WO2014126287A1
公开(公告)日：2014-08-21
申请号：PCT/KR2013/001439
申请日：2013-02-22
Applicant: (주)드림텍
CPC classification number: H05K3/363 , H05K1/113 , H05K2201/09481 , H05K2201/09709 , H05K2201/0979
Abstract: 상호 분리되는 하드 PCB(printed circuit board)와 FPCB(flexible printed circuit board) 또는 FPCB와 FPCB의 각 접속 단자를 솔더링 방식으로 접합시킴으로써, PCB들 간의 접합 구조를 간소화시킬 수 있는 분리형 인쇄회로기판의 솔더링 접합 구조에 대하여 개시한다.
Abstract translation: 公开了一种可分离印刷电路板的焊接接头结构，其中可分离的硬印刷电路板（PCB）和柔性印刷电路板（FPCB）或PCB和FPCB的连接端子通过焊接 方法，从而简化了PCB之间的接合结构。
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公开(公告)号：KR101324586B1
公开(公告)日：2013-11-01
申请号：KR1020130088154
申请日：2013-07-25
Applicant: (주)드림텍
IPC: H01H11/00
Abstract: PURPOSE: A method for manufacturing the home key of a portable terminal using a dome key pressuring mold is provided to fixedly and closely attach the attachment surface of a dome sheet and the rear surface, thereby improving the convenience at the time of the operation of pressing. CONSTITUTION: A thermo-hardening adhesive band (130) is provided on a dome sheet (110). The dome sheet is seated on the rear surface of a home key. The thermo-hardening adhesive band is thermally bonded by using a dome key pressing mold. The gap between the rear side of the home key and the dome sheet is sealed up. An adhesive band pressuring portion and a dome key pressuring portion are included in the dome key pressuring mold.
Abstract translation: 目的：提供一种使用圆顶按压模具制造便携式终端的家用键的方法，以固定和紧密地连接圆顶片的安装面和后表面，从而提高了按压操作时的便利性 。 构成：在圆顶片（110）上设置热硬化粘合带（130）。 圆顶片位于主键的后表面。 热硬化粘合带通过使用圆顶按键模具进行热粘合。 家用键的后侧和圆顶片之间的间隙被密封。 顶盖加压模具包括粘合带加压部分和圆顶按压部分。
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公开(公告)号：KR101324137B1
公开(公告)日：2013-11-01
申请号：KR1020130088152
申请日：2013-07-25
Applicant: (주)드림텍
IPC: H01H11/00
Abstract: PURPOSE: A method for manufacturing the home key of a portable terminal controlling the air in the dome key is provided to prevent water from permeating into the inside, thereby improving the service life. CONSTITUTION: A dome sheet is prepared (S100). A thermo-hardening adhesive band is provided on the dome sheet. The dome sheet is seated on the rear side of a home key (S200). The adhesive band is thermally bonded (S300). The dome sheet is sealed on the rear side of the home key by controlling the amount of air. [Reference numerals] (AA) Start; (BB) End; (S100) Dome sheet with a thermohardening adhesive band is prepared; (S200) Dome sheet is seated on the rear side of a home key; (S300) Dome sheet is sealed on the rear side of the home key by adding pressure to it within a predetermined pressing range using a heating mold
Abstract translation: 目的：提供一种用于制造控制圆顶盖中的空气的便携式终端的家用钥匙的方法，以防止水渗透到内部，从而提高使用寿命。 构成：制备圆顶片（S100）。 在圆顶片上设置热硬化粘合带。 圆顶片位于主键的后侧（S200）。 粘合带热粘合（S300）。 通过控制空气量，将圆顶片密封在家用键的后侧。 （附图标记）（AA）开始; （BB）结束; （S100）制备具有热硬化胶带的圆顶片; （S200）顶盖位于主键的后侧; （S300）通过使用加热模具在预定的按压范围内对其进行加压而将密封在家用键的背面上
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Patent Agency Ranking
公开(公告)号：KR101314218B1
公开(公告)日：2013-10-02
申请号：KR1020130015136
申请日：2013-02-13
Applicant: (주)드림텍
CPC classification number: H05K3/363 , H05K1/113 , H05K2201/09481 , H05K2201/09709 , H05K2201/0979
Abstract: PURPOSE: A soldering joint structure of a separable printed circuit board is provided to simplify the soldering joint structure by directly connecting a first connection terminal to a second connection terminal. CONSTITUTION: A hard printed circuit board (PCB) (120) includes a first connection terminal (125) and a first solder outlet. The first solder outlet passes through the first connection terminal. A flexible PCB includes a second connection terminal and a second solder outlet. The second solder outlet passes through the second connection terminal. The first connection terminal is electrically connected to the second connection terminal with solder.
Abstract translation: 目的：提供可分离印刷电路板的焊接结构，通过将第一连接端子直接连接到第二连接端子来简化焊接结构。 构成：硬印刷电路板（PCB）（120）包括第一连接端子（125）和第一焊料出口。 第一焊料出口通过第一连接端子。 柔性PCB包括第二连接端子和第二焊料出口。 第二焊料出口穿过第二连接端子。 第一连接端子与焊料电连接到第二连接端子。
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公开(公告)号：KR101549585B1
公开(公告)日：2015-09-03
申请号：KR1020140068091
申请日：2014-06-05
Applicant: (주)드림텍
Abstract: 모듈용 기판 홀더 및 이를 이용한 모바일 기기의 전자부품 제조방법에 관하여 개시한다.
본 발명의 일 실시예에 따른 모듈용 기판 홀더는, 복수 개의 모듈용 기판이 수용되기 위한 장방형의 격자 홀을 구비하며, 격자 홀 사이와 테두리가 일체로 형성되는 홀더 프레임과, 홀더 프레임의 이면에 구비되며, 격자 홀을 관통하여 상면으로 모듈용 기판을 위치 고정시키기 위한 고정면을 제공하며, 위치 고정된 모듈용 기판의 상부로 모듈이 표면실장 될 때 소재 자체의 열적 변형 및 손상을 방지할 수 있는 재질로 이루어진 이면부착부재를 포함한다.Abstract translation: 本发明公开了一种用于模块基板的保持器和用于制造使用其的移动设备的电子部件的方法。 根据本发明实施例的用于模块基板的支架具有：容纳多个模块基板的矩形格子孔; 形成为与其间的间隙一体化的保持框架，以及在保持框架的背面准备的背面侧粘接构件，提供固定模块的位置的固定面 通过穿过格子孔在支架框架的上侧的基板，并且当模块表面安装在模块的上部时由能够防止材料自身的热变形和材料本身的损坏的材料制成 基板的位置固定。
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公开(公告)号：KR1020150067626A
公开(公告)日：2015-06-18
申请号：KR1020130153316
申请日：2013-12-10
Applicant: (주)드림텍
Abstract: 알루미늄클래드층을이용한양면 FPCB 및그 제조방법에대하여개시한다. 본발명에따른양면 FPCB는양면에회로패턴이형성되는양면연성인쇄회로기판(Flexible Printed Circuit Board)으로서, 고분자기판의양면에알루미늄클래드층이형성되어있고, 상기알루미늄클래드층상에구리도금층이형성되어있으며, 상기양면의구리도금층을관통하는비아홀이형성되어있되, 상기비아홀 내벽에구리도금층이형성되어, 상기양면의구리도금층이통전되는것을특징으로한다. 본발명에의하면, 종래양면 FPCB 제조공정에비하여구리사용량을감소시킬수 있어, 양면 FPCB 제조비용을낮출수 있으면서도, 표면에구리도금층이존재함으로써전기적특성저하문제가없는효과가있다.
Abstract translation: 公开了使用铝包层的双面柔性印刷电路板（FPCB）及其制造方法。 根据本发明的双面FPCB是在两侧具有电路图案的双面柔性印刷电路板。 在聚合物基板的两侧形成Al覆盖层。 在Al覆盖层上形成Cu镀层。 通孔穿透Cu镀层。 Cu电镀层形成在通孔的内壁上。 Cu电镀层可以电连接。 根据本发明，与传统的双面FPCB制造工艺相比，通过减少CU的使用量，可以降低制造双面FPCB的成本。 由于表面上存在Cu镀层，可以防止电性能的劣化。
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公开(公告)号：KR101345207B1
公开(公告)日：2013-12-26
申请号：KR1020130077897
申请日：2013-07-03
Applicant: (주)드림텍
IPC: H05K1/14
Abstract: Disclosed is a joint structure of a slim type printed circuit board capable of realizing slimness by minimizing the thickness of a joint part by having a difference in the joint part between a first PCB and a second PCB. The joint structure of the slim type printed circuit board according to the present invention includes: a first PCB which has a first side and a second side which is the opposite side of the first side and includes a driving circuit part arranged on the first side, a first connection terminal part arranged in the one edge of the first side, and a first connection terminal formed in the first connection terminal part; a second PCB which has a third side facing the first side and a fourth side which is the opposite side of the third side and includes a second connection terminal part arranged in the one edge of the third side and a second connection terminal arranged to be mutually overlapped with the first connection terminal by being formed in the second connection terminal part; and a connection member which connects the first and second connection terminal parts by being interposed between the first and second connection terminal parts. The driving circuit part has a first thickness and the first connection terminal part has a second thickness which is thinner than the first thickness by being equipped with a raised part in the boundary part between the driving circuit part and the first connection terminal part.
Abstract translation: 公开了一种薄型印刷电路板的接合结构，其能够通过在第一PCB和第二PCB之间的接合部分的差异来最小化接合部的厚度来实现纤薄。 根据本发明的薄型印刷电路板的接合结构包括：第一PCB，其具有第一侧和与第一侧相反的一侧的第二侧，并且包括布置在第一侧上的驱动电路部分， 布置在第一侧的一个边缘中的第一连接端子部分和形成在第一连接端子部分中的第一连接端子; 第二PCB，其具有面向第一侧的第三侧和与第三侧相反的一侧的第四侧，并且包括布置在第三侧的一个边缘中的第二连接端子部和布置成相互相对的第二连接端子 通过形成在第二连接端子部分中与第一连接端子重叠; 以及连接构件，其通过插入在第一和第二连接端子部之间来连接第一和第二连接端子部。 所述驱动电路部分具有第一厚度，并且所述第一连接端子部分具有比所述第一厚度薄的第二厚度，所述第二厚度在所述驱动电路部分和所述第一连接端子部分之间的边界部分中设置有凸起部分。
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公开(公告)号：KR101324591B1
公开(公告)日：2013-11-01
申请号：KR1020130088149
申请日：2013-07-25
Applicant: (주)드림텍
IPC: H01H11/00
Abstract: PURPOSE: A method for manufacturing the home key of a portable terminal is provided to remove the water permeating into the inside of the terminal, thereby preventing corrosion. CONSTITUTION: A thermo-hardening adhesive band is provided on a dome sheet (S100). The dome sheet is attached to the rear side of a home key (S200). The adhesive band is thermally bonded (S300). The gap between the rear side of the home key and the attachment surface of the dome sheet is sealed up. The mold is protruded along the edge of the dome sheet. [Reference numerals] (AA) Start; (BB) End; (S100) Step of preparing a dome sheet with a thermo-hardening adhesive band; (S200) Step of bonding the dome sheet on the rear side of a home key; (S300) Step of thermally bonding the adhesive band
Abstract translation: 目的：提供一种用于制造便携式终端的家用钥匙的方法，以去除渗透到终端内部的水，从而防止腐蚀。 构成：在圆顶片上设置热硬化粘合带（S100）。 圆顶片安装在主键的后侧（S200）。 粘合带热粘合（S300）。 家用键的后侧和圆顶片的安装面之间的间隙被密封。 模具沿着圆顶片的边缘突出。 （附图标记）（AA）开始; （BB）结束; （S100）制备具有热硬化粘合带的圆顶片的步骤; （S200）将所述圆顶片接合在主键的后侧的步骤; （S300）粘合胶带的热粘合工序
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