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公开(公告)号：WO2014137002A1
公开(公告)日：2014-09-12
申请号：PCT/KR2013/001831
申请日：2013-03-07
Applicant: (주)드림텍
CPC classification number: H05K3/363 , H05K1/11 , H05K2201/09063 , H05K2201/09409 , H05K2201/09481 , H05K2201/0969 , H05K2201/09709
Abstract: 본 발명에 따른 인쇄회로기판의 솔더링 접합 구조는 하드 PCB 몸체와, 상기 하드 PCB 몸체의 일측 단부에 배치되는 제1 외부접속단자를 구비하는 하드 PCB; 상기 하드 PCB 몸체와 마주보도록 배치되는 FPCB 몸체와, 상기 제1 외부접속단자와 상호 중첩되도록 배치되는 제2 외부접속단자와, 상기 제2 외부접속단자를 관통하는 솔더 배출 홀을 구비하는 FPCB; 및 상기 하드 PCB의 제1 외부접속단자와 FPCB의 제2 외부접속단자를 전기적으로 직접 접합시키는 솔더;를 포함하며, 상기 솔더 배출 홀은 0.3 ~ 0.5mm의 폭 및 0.7 ~ 0.9mm의 길이를 갖는 것을 특징으로 한다.
Abstract translation: 根据本发明的印刷电路板的焊接结构包括：由硬PCB体构成的硬质PCB和布置在硬PCB体的一侧的第一外部连接端子; FPCB主体，其布置成面向所述硬PCB; FPC，第二外部连接端子，与所述第一外部连接端子重叠;以及焊料排出孔，穿过所述第二外部连接端子; 以及用于电连接硬PCB的第一外部连接端子和FPCB的第二外部连接端子的焊料，其特征在于，所述焊料排出孔具有0.3-0.5mm的宽度和0.7-0.9mm的长度。
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Patent Agency Ranking
公开(公告)号：KR101313684B1
公开(公告)日：2013-10-02
申请号：KR1020130023525
申请日：2013-03-05
Applicant: (주)드림텍
CPC classification number: H05K3/363 , H05K1/11 , H05K2201/09063 , H05K2201/09409 , H05K2201/09481 , H05K2201/0969 , H05K2201/09709
Abstract: PURPOSE: A soldering joint structure of a printed circuit board with high solder discharging properties is provided to improve the utilization of a space by arranging an external connection terminal in zigzags. CONSTITUTION: A hard printed circuit board (120) includes a first external connection terminal. The first external connection terminal is arranged on one end of a hard printed circuit board body. A flexible printed circuit board (140) includes a second external connection terminal (145) and a solder discharge hole. The solder discharge hole passes through the second external connection terminal. The first external connection terminal is directly bonded to the second external connection terminal with solder to be electrically connected.
Abstract translation: 目的：提供具有高焊料排放性能的印刷电路板的焊接结构，以通过以Z字形布置外部连接端子来改善空间的利用。 构成：硬印刷电路板（120）包括第一外部连接端子。 第一外部连接端子布置在硬印刷电路板主体的一端。 柔性印刷电路板（140）包括第二外部连接端子（145）和焊料排出孔。 焊料排出孔穿过第二外部连接端子。 第一外部连接端子与焊料直接接合到第二外部连接端子以电连接。
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公开(公告)号：KR101620490B1
公开(公告)日：2016-05-13
申请号：KR1020140102135
申请日：2014-08-08
Applicant: (주)드림텍
Abstract: 스테디적층방식이후에평탄한표면상에나노돌기를형성하는공정을추가하여제품의표면장력을낮추는방식으로수분유입을최소화할 수있는침수방지기능강화를위한나노코팅방법및 나노코팅제품에관하여개시한다. 본발명의일 측면에따르면, RF 구동기를이용하며, 플라즈마에모노머를주입하여중합(polymerization)을통해나노코팅을형성하는나노코팅방법으로서, 제1설정시간동안상기 RF 구동기를연속적으로동작시켜제품표면에평탄한나노코팅층을적층하는스테디적층단계와, 제2설정시간동안펄스파형을발생시키고, 펄스값이설정된듀티레이트(duty rate)를상회할때에만상기 RF 구동기를동작시켜제품표면에나노돌기를형성하는나노돌기형성단계를포함하는침수방지기능강화를위한나노코팅방법을제공한다.
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公开(公告)号：KR1020160018957A
公开(公告)日：2016-02-18
申请号：KR1020140102135
申请日：2014-08-08
Applicant: (주)드림텍
Abstract: 스테디적층방식이후에평탄한표면상에나노돌기를형성하는공정을추가하여제품의표면장력을낮추는방식으로수분유입을최소화할 수있는침수방지기능강화를위한나노코팅방법및 나노코팅제품에관하여개시한다. 본발명의일 측면에따르면, RF 구동기를이용하며, 플라즈마에모노머를주입하여중합(polymerization)을통해나노코팅을형성하는나노코팅방법으로서, 제1설정시간동안상기 RF 구동기를연속적으로동작시켜제품표면에평탄한나노코팅층을적층하는스테디적층단계와, 제2설정시간동안펄스파형을발생시키고, 펄스값이설정된듀티레이트(duty rate)를상회할때에만상기 RF 구동기를동작시켜제품표면에나노돌기를형성하는나노돌기형성단계를포함하는침수방지기능강화를위한나노코팅방법을제공한다.
Abstract translation: 公开了一种纳米涂层方法和纳米涂层产品，用于通过在稳定层压方法之后通过在平坦表面上添加形成纳米突起的过程，通过降低产品的表面张力来增强防止水渗透的最小化水渗透。 根据本发明的一个方面，提供了一种通过使用RF操作器将单体注入等离子体通过聚合强化形成水渗透形成纳米涂层的纳米涂层方法，其包括层压平面纳米颗粒的稳定层压步骤 通过连续操作RF操作器第一设定时间在产品表面上涂覆涂层; 以及在第二设定时间产生脉冲波的纳米侵入形成步骤，并且仅当脉冲值超过占空比时，通过操作RF操作器在产品的表面上形成纳米侵入。
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公开(公告)号：KR101365991B1
公开(公告)日：2014-02-24
申请号：KR1020130079507
申请日：2013-07-08
Applicant: (주)드림텍
Abstract: Disclosed is a printed circuit board (PCB) joint structure having an excellent effect of preventing thermal deformation, which is capable of preventing flexible printed circuit boards (FPCB) from warping due to thermal deformation in advance, by arranging connection terminals in two or three directions, thereby preventing deterioration of electrical connection resulting from misalignment. The joint structure according to the present invention includes a first PCB having a first connection terminal arranged at one end; a second PCB having a second connection terminal arranged to correspond to the first connection terminal of the first PCB; and solders for connecting the first connection terminal of the first PCB and the second connection terminal of the second PCB, wherein the first and second connection terminals each contains at least six terminals being distributed into at least two terminals in two or three directions, with a maximum of five terminals in one direction.
Abstract translation: 公开了一种印刷电路板（PCB）接头结构，其具有防止热变形的优异效果，其能够通过将连接端子布置在两个或三个方向上来防止柔性印刷电路板（FPCB）由于预先的热变形而翘曲 ，从而防止由于未对准而导致的电连接的劣化。 根据本发明的接头结构包括：第一PCB，其具有布置在一端的第一连接端子; 第二PCB，具有被布置为对应于第一PCB的第一连接端子的第二连接端子; 以及用于连接第一PCB的第一连接端子和第二PCB的第二连接端子的焊料，其中第一和第二连接端子各自包含至少六个端子，其分布在两个或三个方向上的至少两个端子中，其中 一个方向最多五个终端。
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公开(公告)号：KR101345207B1
公开(公告)日：2013-12-26
申请号：KR1020130077897
申请日：2013-07-03
Applicant: (주)드림텍
IPC: H05K1/14
Abstract: Disclosed is a joint structure of a slim type printed circuit board capable of realizing slimness by minimizing the thickness of a joint part by having a difference in the joint part between a first PCB and a second PCB. The joint structure of the slim type printed circuit board according to the present invention includes: a first PCB which has a first side and a second side which is the opposite side of the first side and includes a driving circuit part arranged on the first side, a first connection terminal part arranged in the one edge of the first side, and a first connection terminal formed in the first connection terminal part; a second PCB which has a third side facing the first side and a fourth side which is the opposite side of the third side and includes a second connection terminal part arranged in the one edge of the third side and a second connection terminal arranged to be mutually overlapped with the first connection terminal by being formed in the second connection terminal part; and a connection member which connects the first and second connection terminal parts by being interposed between the first and second connection terminal parts. The driving circuit part has a first thickness and the first connection terminal part has a second thickness which is thinner than the first thickness by being equipped with a raised part in the boundary part between the driving circuit part and the first connection terminal part.
Abstract translation: 公开了一种薄型印刷电路板的接合结构，其能够通过在第一PCB和第二PCB之间的接合部分的差异来最小化接合部的厚度来实现纤薄。 根据本发明的薄型印刷电路板的接合结构包括：第一PCB，其具有第一侧和与第一侧相反的一侧的第二侧，并且包括布置在第一侧上的驱动电路部分， 布置在第一侧的一个边缘中的第一连接端子部分和形成在第一连接端子部分中的第一连接端子; 第二PCB，其具有面向第一侧的第三侧和与第三侧相反的一侧的第四侧，并且包括布置在第三侧的一个边缘中的第二连接端子部和布置成相互相对的第二连接端子 通过形成在第二连接端子部分中与第一连接端子重叠; 以及连接构件，其通过插入在第一和第二连接端子部之间来连接第一和第二连接端子部。 所述驱动电路部分具有第一厚度，并且所述第一连接端子部分具有比所述第一厚度薄的第二厚度，所述第二厚度在所述驱动电路部分和所述第一连接端子部分之间的边界部分中设置有凸起部分。
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