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公开(公告)号：KR101654631B1
公开(公告)日：2016-09-06
申请号：KR1020130002791
申请日：2013-01-10
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/205 , C23C16/46 , C23C16/52
CPC classification number: G05B19/418 , H01L21/67109 , H01L21/67115 , H01L21/67248
Abstract: (과제) 소망하는열처리조건에따라서, 최적의온도특성을실현가능한, 열처리장치를제공하는것이다. (해결수단) 피(被)처리체를승온하거나또는정온(定溫)에서열처리하는열처리장치로서, 상기피처리체를수납하는처리실과, 상기처리실에수납된상기피처리체를가열하기위한가열부와, 미리작성된 2개또는그 이상의온도제어모델을기억하는기억부와, 상기가열부의온도를제어하는온도제어부와, 상기온도제어부및 상기기억부를제어하는장치제어부를갖고, 상기장치제어부는, 소망하는열처리조건에따라서, 상기 2개또는그 이상의온도제어모델로부터온도제어모델을선정하고, 상기온도제어부는, 상기의선정된온도제어모델을상기기억부로부터판독하여, 상기가열부를제어하는열처리장치.
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公开(公告)号：KR1020130089586A
公开(公告)日：2013-08-12
申请号：KR1020130002791
申请日：2013-01-10
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/205 , C23C16/46 , C23C16/52
CPC classification number: G05B19/418 , H01L21/67109 , H01L21/67115 , H01L21/67248
Abstract: PURPOSE: A heat processing apparatus and a controlling method thereof are provided to prevent the overshoot of a temperature by including a step of selecting a temperature control model. CONSTITUTION: A processing chamber receives an object. A heating unit heats the object. A memory unit memorizes two or more temperature control models. A temperature control unit (36) controls the temperature of the heating unit. A device control unit (100) controls the temperature control unit and the memory unit. [Reference numerals] (111,121) Model memory unit; (112) Recipe memory unit; (115,125) I/O port; (118) Operating panel; (28) Pressure control unit; (AA) Mass flow controller
Abstract translation: 目的：提供一种热处理装置及其控制方法，用于通过包括选择温度控制模型的步骤来防止温度过冲。 构成：处理室接收物体。 加热单元加热物体。 存储单元记忆两个或多个温度控制模型。 温度控制单元（36）控制加热单元的温度。 设备控制单元（100）控制温度控制单元和存储器单元。 （附图标记）（111,121）型号存储单元; （112）配方存储单元; （115,125）I / O口; （118）操作面板; （28）压力控制单元; （AA）质量流量控制器
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