公开(公告)号：KR1020080077329A

公开(公告)日：2008-08-22

申请号：KR1020080014291

申请日：2008-02-18

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 다께꾸마다까시 ,  데라다다까시

IPC: H01L21/027

CPC classification number: H01L21/67115

Abstract: A substrate processing apparatus is provided to process evenly temperature distribution of substrates by removing reflective heats generated from a plate which is implemented at a higher portion of substrate carrying rollers. A substrate processing apparatus includes substrate carrying rollers(32), a ceiling unit(17), infrared lamps(1), and a light guide plate(4). The substrate carrying rollers carry substrates(G) to a horizontal direction. The ceiling unit is implemented in parallel with the substrate carrying rollers. The infrared lamps heat the substrates by radiating heats toward a bottom of the substrates. The light guide plate guides constantly direction of the heats radiated from the infrared lamps. The heats generated from the infrared lamps are radiated on the substrates by inducing vertically through the light guide plate.

Abstract translation: 提供了一种基板处理装置，用于通过去除由在基板承载辊的较高部分处实现的板产生的反射热来均匀地温度分布基板。 基板处理装置包括基板承载辊（32），天花板单元（17），红外灯（1）和导光板（4）。 基板承载辊将基板（G）沿水平方向承载。 天花板单元与基板承载辊平行地实现。 红外线灯通过向基板的底部辐射热量来加热基板。 导光板不断引导从红外灯辐射的热量的方向。 由红外线灯产生的热量通过导光板垂直地照射在基板上。

公开(公告)号：KR1020080060165A

公开(公告)日：2008-07-01

申请号：KR1020070136193

申请日：2007-12-24

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 사까이미쯔히로 ,  데라다다까시 ,  소오마야스따까

IPC: H01L21/677 ,  H01L21/027

CPC classification number: H01L21/677 ,  H01L21/67098 ,  H01L21/67248

Abstract: A substrate processing apparatus is provided to improve throughput and reduce foot print of a dehydration bake processing section by performing the dehydration bake processing in a shorter transfer path than the conventional hydration bake unit using a heat plate heater. A substrate processing apparatus, which performs a hydrophobic process to a processed substrate(G), comprises a transfer unit(80), a dehydration bake unit(38) and an adhesion processing unit(98). The dehydration bake unit dehydrates the surface of the substrate, and heats the substrate by irradiating infrared rays from a heating element(84). The adhesion processing unit hydrates the substrate as hydrophobic by exposing the processed surface of the processed substrate.

Abstract translation: 提供了一种基板处理装置，通过在比使用热板加热器的传统水化烘烤单元更短的传送路径中进行脱水烘烤处理来提高脱水烘烤处理部的生产量和减少脚印。 对处理过的基板（G）进行疏水处理的基板处理装置具有转印单元（80），脱水烘焙单元（38）和粘合处理单元（98）。 脱水烘烤单元使基板的表面脱水，并且通过从加热元件（84）照射红外线来加热基板。 粘合处理单元通过使经处理的基板的经处理的表面曝光而将基板水解成疏水性。