도포·현상처리방법 및 도포·현상처리장치
    2.
    发明公开
    도포·현상처리방법 및 도포·현상처리장치 失效
    用于涂层和开发半导体器件的方法和装置

    公开(公告)号:KR1020000017112A

    公开(公告)日:2000-03-25

    申请号:KR1019990032185

    申请日:1999-08-05

    Abstract: PURPOSE: A coating and developing method is provided to miniaturize of an apparatus and reduce cost of the products by using a singular coating and development system. CONSTITUTION: The coating and development method comprises the steps of: coating of a selective resist among the plural color resist on a wafer; cleaning of a nozzle with cleaning solution; loading to the exposure apparatus to coated wafer with photoresist; developing of the wafer, repeat sequentially after; depositing of a cassette; and drying using a reduce pressure of the wafer. Thereby it is possible to reduce cost of the products and miniaturize of the apparatus by using a singular unit system instead of using in the each process, individually.

    Abstract translation: 目的:提供涂料和显影方法以使装置小型化并且通过使用单一涂布和显影系统降低产品成本。 构成:涂布和显影方法包括以下步骤:在晶片上的多个着色抗蚀剂之间涂覆选择性抗蚀剂; 用清洗液清洗喷嘴; 将曝光装置加载到具有光致抗蚀剂的涂覆晶片; 开发晶圆后,依次重复; 存放盒子; 并使用晶片的减压进行干燥。 因此,可以通过使用单个单元系统来代替在每个处理中单独使用来降低产品的成本并使装置小型化。

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