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公开(公告)号:KR1020080014671A
公开(公告)日:2008-02-14
申请号:KR1020070080295
申请日:2007-08-09
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/3065
CPC classification number: H01L21/6833 , H01J37/32082 , H01J37/32715
Abstract: A loading table and a plasma processing apparatus having the same are provided to improve the uniformity of electric field strength in a plasma and to enhance an in-plane uniformity of a plasma process to a substrate. A conductive member is connected to a high-frequency power source, and serves as an ion supply electrode. Dielectric layers(32,34) are formed to cover a center portion of an upper surface of the conductive member to make a high-frequency electric field, which is applied to plasma via a substrate, uniform. An electrostatic chuck(33) is laminated on the dielectric layer, and has an electrode film(35) satisfying specific conditions. The dielectric layer is formed in a columnar shape, and a thickness of a circumferential part of the dielectric layer is smaller than a thickness of a central part of the dielectric layer.
Abstract translation: 提供一种装载台和具有该装载台的等离子体处理装置,以提高等离子体中的电场强度的均匀性并提高等离子体处理对基板的面内均匀性。 导电部件与高频电源连接,作为离子供给电极。 形成电介质层(32,34)以覆盖导电构件的上表面的中心部分,以使得经由衬底施加到等离子体的高频电场是均匀的。 静电卡盘(33)层压在电介质层上,具有满足特定条件的电极膜(35)。 电介质层形成为柱状,并且电介质层的周向部分的厚度小于电介质层的中心部分的厚度。
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公开(公告)号:KR1020140000169A
公开(公告)日:2014-01-02
申请号:KR1020130071639
申请日:2013-06-21
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/3065 , H01L21/205 , H01L21/02
CPC classification number: H01J37/32642 , H01J37/32715 , H01L21/6831
Abstract: A time-based change of plasma distribution is suppressed, and an object to be processed is evenly processed. An electrostatic chuck (11) which mounts a wafer, and a mounting table (2) including a focus ring (10) on an outer circumference surface of the electrostatic chuck (11) comprises a pressing member (12) which pressurizes the focus ring (10) for the electrostatic chuck (11), and a screw (52) which fixates the pressing member (12) on the electrostatic chuck (11). A coupling groove (10a) which is recessed toward a center direction of the focus ring (10) is formed all over the whole circumference of the outer side of the focus ring (10). A contact part (12a) of the pressing member (12) is coupled with the coupling groove (10a). A shading part (10b) which covers the contact part (12a) which does not see in a plane view is formed on the upper side of the outer circumference end of the focus ring (10).
Abstract translation: 抑制等离子体分布的基于时间的变化,并且待处理的对象被均匀地处理。 安装晶片的静电卡盘(11)和在静电卡盘(11)的外周面上具有聚焦环(10)的安装台(2)具有对聚焦环进行加压的按压部件(12) 10),以及将按压部件(12)固定在静电卡盘(11)上的螺钉(52)。 在聚焦环(10)的外侧的整个圆周上形成有朝向聚焦环(10)的中心方向凹陷的联结槽(10a)。 按压构件(12)的接触部分(12a)与联接槽(10a)联接。 在聚焦环(10)的外周端的上侧形成有遮盖未平面观察的接触部(12a)的遮光部(10b)。
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公开(公告)号:KR102069773B1
公开(公告)日:2020-01-23
申请号:KR1020130071639
申请日:2013-06-21
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01J37/32 , H01L21/683
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公开(公告)号:KR100924845B1
公开(公告)日:2009-11-02
申请号:KR1020070080295
申请日:2007-08-09
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/3065
Abstract: 피처리 기판의 중앙부에서의 플라즈마의 전계 강도를 낮추고, 이에 따라 플라즈마 처리의 면내 균일성을 향상시키는 것이 가능한 플라즈마 처리 장치용 탑재대 및, 이 탑재대를 구비한 플라즈마 처리 장치를 제공한다.
플라즈마 처리 장치(2)용 탑재대(3)는, 플라즈마 생성용 등의 하부 전극(31)을 겸하는 도전체 부재와, 이 도전체 부재의 상면 중앙부를 덮도록 마련되고, 피처리 기판(웨이퍼 W)을 통하여 플라즈마에 인가하는 고주파 전계를 균일하게 하기 위한 유전체층(32)과, 이 유전체층(32)에 적층되고, 정전 척용 전극막(35)이 매설된 정전 척(33)을 구비하고 있다. 여기서, 전극막(35)은 δ/z≥1,000(z ; 전극막(35)의 두께, δ ; 고주파 전원(61a)으로부터 공급되는 고주파 전력에 대한 전극막(35)의 표피 깊이(skin depth))의 조건을 만족하고 있다.
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