플라즈마 처리 장치
    1.
    发明公开
    플라즈마 처리 장치 有权
    等离子体加工设备

    公开(公告)号:KR1020100086947A

    公开(公告)日:2010-08-02

    申请号:KR1020100005232

    申请日:2010-01-20

    Abstract: PURPOSE: A plasma processing device is provided to reduce particles by preventing the inner side of a cover from being etched due to the sputter of ions. CONSTITUTION: A gas activating device(60) converts a process gas into plasma and includes a vertical plasma generating box(64), an ICP(Inductively Coupled Plasma) electrode(66), and a frequency power source connected to the electrode. The plasma generation box is attached to the process container to correspond to the process region and shuts down the plasma generation region connected to the processing region. The ICP electrode is arranged outside the plasma generation box along the length direction of the plasma generation box and includes a space separated from the wall of the plasma generation box.

    Abstract translation: 目的:提供等离子体处理装置以通过防止由于离子溅射而使盖的内侧被蚀刻而减少颗粒。 构成:气体激活装置(60)将处理气体转换成等离子体,并且包括垂直等离子体产生箱(64),ICP(感应耦合等离子体)电极(66)和连接到电极的频率电源。 将等离子体生成盒连接到处理容器以对应于处理区域并且关闭连接到处理区域的等离子体产生区域。 ICP电极沿着等离子体生成箱的长度方向配置在等离子体发生箱的外侧,具有与等离子体发生箱壁隔开的空间。

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