公开(公告)号：KR1020140052850A

公开(公告)日：2014-05-07

申请号：KR1020130125123

申请日：2013-10-21

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 히가시지마지로 ,  아마노요시후미 ,  오카모토에이치로 ,  이토유키

IPC: H01L21/302

CPC classification number: H01L21/67051

Abstract: The purpose of the present invention is to reduce a burden of an exhaust system which absorbs a cup body and to prevent effectively a processing liquid from being attached to a substrate after the processing liquid supplied to the substrate is scattered from the substrate. When a substrate (W) is processed, a protective wall (52) of a ring shape is located on the substrate which is maintained on a substrate maintaining unit (3). The protective wall (52) of the ring shape is extended along a circumference direction of the substrate. A radius direction position of a circumference edge unit of the protective wall lower side is same as a radius direction position of an inner circumference edge of the circumference edge unit of the upper side of the substrate which is maintained on the substrate maintaining unit or is located on the outside of the radius direction. A first air gap (G1) is formed between the protective wall and the upper side of the substrate. A second air gap (G2) is formed between the protective wall and a wall body (262) which defines an upper opening of the cup body. Gas located in the upper side of the substrate is inserted into an internal space of the cup body through the first and second air gaps if the internal space of the cup body (2) is absorbed.

Abstract translation: 本发明的目的是减少吸收杯体的排气系统的负担，并且在从基板散射供给到基板的处理液散布后，有效地防止处理液附着于基板。 当处理基板（W）时，环状的保护壁（52）位于保持在基板保持单元（3）上的基板上。 环状的保护壁（52）沿着基板的圆周方向延伸。 保护壁下侧的周缘部的半径方向位置与保持在基板保持部上的基板的上侧的周缘部的内周缘的位置的半径方向位置相同 在半径方向的外侧。 在保护壁和基板的上侧之间形成第一气隙（G1）。 第二气隙（G2）形成在保护壁和限定杯体的上部开口的壁体（262）之间。 如果杯体（2）的内部空间被吸收，则位于基板上侧的气体通过第一和第二气隙被插入杯体的内部空间。

公开(公告)号：KR101974663B1

公开(公告)日：2019-09-05

申请号：KR1020130125123

申请日：2013-10-21

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 히가시지마지로 ,  아마노요시후미 ,  오카모토에이치로 ,  이토유키

IPC: H01L21/302

公开(公告)号：KR1020140052849A

公开(公告)日：2014-05-07

申请号：KR1020130125120

申请日：2013-10-21

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 히가시지마지로 ,  아마노요시후미 ,  오카모토에이치로 ,  이토유키

IPC: H01L21/302

CPC classification number: H01L21/67051

Abstract: The present invention is to effectively suppress a processing liquid supplied to a substrate from being scattered and adhered again onto the substrate, while reducing a load on an exhaust apparatus that exhaust a cup. When a substrate W is processed, a ring-shaped cover member (5) covers a peripheral portion of the upper surface of the substrate (W) held by the substrate holding unit (3), and a central portion of the substrate located at an inner position than the peripheral portion in a radial direction is exposed without being covered by the cover member. The bottom surface (52) of the cover member forms a gap (G) between the lower surface of the cover member and the peripheral portion of the substrate held by the substrate holding member. When the interior surface of the cup (2) is exhausted through an exhaust pipe (245), a gas present above the cover member is introduced into the interior space of the cup through a space enclosed by the internal peripheral surface (51) and the gap (G).

Abstract translation: 本发明是为了有效地抑制供给到基板的处理液在再次排出并附着在基板上的同时减少排出杯的排气装置的负荷。 当处理衬底W时，环形覆盖构件（5）覆盖由衬底保持单元（3）保持的衬底（W）的上表面的周边部分，并且衬底的中心部分位于 在径向方向上的周边部分的内部位置暴露而不被盖构件覆盖。 盖构件的底面（52）在盖构件的下表面和由基板保持构件保持的基板的周边部分之间形成间隙（G）。 当杯（2）的内表面通过排气管（245）排出时，存在于盖构件上方的气体通过由内周面（51）包围的空间引入杯的内部空间，并且 间隙（G）。

公开(公告)号：KR101899169B1

公开(公告)日：2018-09-14

申请号：KR1020130125120

申请日：2013-10-21

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 히가시지마지로 ,  아마노요시후미 ,  오카모토에이치로 ,  이토유키

IPC: H01L21/302

CPC classification number: H01L21/67051

Abstract: 본발명은컵체를흡인하는배기장치의부담을저감하면서, 기판에공급된처리액이기판으로부터비산한후에재차기판에부착하는것을효과적으로방지하는것을목적으로한다. 기판(W)의처리중, 링형의커버부재(5)는기판유지부(3)에유지된기판(W) 상면의둘레가장자리부를덮고, 이둘레가장자리부보다반경방향내측에있는기판의중앙부는커버부재에덮이지않고노출되어있다. 커버부재의하면(52)은, 기판유지부에유지된기판의상면의둘레가장자리부와의사이에간극(G)을형성한다. 컵체(2)의내부공간이배기구(245)를통해흡인되면, 커버부재의위쪽에있는기체가, 커버부재의내주면(51)에둘러싸인공간및 간극(G)을통해, 컵체의내부공간에도입된다.

公开(公告)号：KR1020160063273A

公开(公告)日：2016-06-03

申请号：KR1020150165617

申请日：2015-11-25

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 아마노요시후미 ,  이토유키 ,  오카모토에이치로 ,  이와나가가즈야 ,  이케베료지

IPC: H01L21/66

CPC classification number: G06T7/0008 ,  G06T7/62 ,  G06T2207/30148

Abstract: 본발명은시스템의대형화를초래하지않고단시간에기판의막 제거의상태와포위부재의유지상태를확인할수 있도록하는것을목적으로한다. 포위부재(302)의상방에설치되며, 둘레가장자리부의처리막이제거된웨이퍼(W) 및포위부재(302)를제1∼제3 카메라(601∼603)에의해촬상하고, 측정처리장치(800)에있어서, 이들카메라에의해얻어진촬상화상을처리함으로써, 웨이퍼(W)의둘레가장자리부에있어서상기처리막이존재하지않는커트폭및 웨이퍼(W)의둘레가장자리단과포위부재(302) 사이의간극폭을측정한다.

Abstract translation: 本发明的目的是在不引起系统扩大的情况下在短时间内检查基板的膜去除状态和周围部件的维持状态。 根据安装在周围部件（302）的上部的测量处理装置（800），对周围部件（302）和周边部分的处理膜进行照射的周边部件（302）和 首先，第二和第三相机（601-603），测量处理装置测量周围部件（302）和晶片（W）的周缘部分之间的间隙宽度和处理膜不切割的切割宽度 存在于晶片（W）的圆周边缘部分，通过处理由照相机获得的拍摄图像。