公开(公告)号：KR100881707B1

公开(公告)日：2009-02-06

申请号：KR1020010045079

申请日：2001-07-26

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 니시지마유이치 ,  오카무라코우지

IPC: H01L21/66

CPC classification number: G01N25/18

Abstract: 본 발명은 판별방법 및 처리장치에 관한 것으로서 플레이트상의 소정의 위치에 기판을 재치하여 가열처리 또는 냉각처리할 때 기판이 소정위치에 정확하게 재치되어 있는가의 여부를 판별하는 방법에 있어서 플렉이트에 기판을 재치한 후에 적어도 플레이트온도가 변화하는 제 1 시간으로부터 제 2시간까지의 플레이트의 온도를 측정하는 공정과 그 측정된 계시열적으로 변화하는 온도곡선과 플레이트의 설정온도로 둘러싸인 범위에서 정해지는 온도적산면적(I)을 산출하는 공정과 상기 산출된 온도적산면적(I)과 미리 정해둔 온도적산면적의 한계치를 비교하는 공정을 제공하는 기술이 제시된다.

公开(公告)号：KR1020070084145A

公开(公告)日：2007-08-24

申请号：KR1020077010609

申请日：2005-11-08

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 오카무라코우지 ,  토미타히로시 ,  이와나가슈지 ,  아라키신이치로

IPC: H01L21/027

CPC classification number: H01L21/67248 ,  H01L22/12

Abstract: A thermal plate is divided into a plurality of sections. An accumulated values of temperature change of each section when a substrate is placed on the thermal plate in a normal state not having an extraneous matter is collected. According to the accumulated value during normal state, a Malanobis reference space in the judgment analysis method is created. During actual thermal treatment, an accumulated value of temperature change of each section when a substrate is placed on the thermal plate is detected. According to the accumulated value during the treatment and the Mahalanobis reference space obtained in advance, the Mahalanobis distance for the accumulated value during treatment is calculated. By comparing the calculated Mahalanobis distance to a predetermined threshold value, it is judged whether the thermal plate has any extraneous matter.

Abstract translation: 热板被分成多个部分。 当基板被放置在不具有外来物质的正常状态下的热板上时，每个部分的温度变化的累积值被收集。 根据正常状态下的累积值，建立了判断分析方法中的马诺比斯参考空间。 在实际的热处理中，检测在将基板置于热板上时各部分的温度变化的累计值。 根据治疗期间的累积值和预先获得的马氏距离参考空间，计算治疗期间累积值的马氏距离。 通过将计算的马氏距离与预定阈值进行比较，判断热板是否具有任何外来物质。

公开(公告)号：KR1020020011084A

公开(公告)日：2002-02-07

申请号：KR1020010045079

申请日：2001-07-26

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 니시지마유이치 ,  오카무라코우지

IPC: H01L21/66

CPC classification number: G01N25/18

Abstract: PURPOSE: To rapidly and accurately judge whether a wafer is accurately mounted on a heat plate, for suppressing the occurrence of faults in the wafer to a minimum limit. CONSTITUTION: The phenomenon, in which the temperature of the heat plate 63 drops when the wafer W is mounted on the plate 63, is utilized. A temperature sensor 73 for monitoring the temperature drop of the plate 63 is provided at the plate 63. A fault detector 77 for receiving a measured result from the sensor 73 is given as functions of calculating the area of a range surrounded by a temperature curve and a set temperature, when representing the time change of the temperature of the plate by a graph, that is, a temperature integrating area and comparing the integrated area with a preset threshold. As the threshold, a standard deviation obtained from the integrated area, when the wafer W is mounted correctly, is used. The detector 77 judges that the wafer W is not accurately mounted, when the temperature of the plate is low and when the integrated area exceeds the threshold.

Abstract translation: 目的：快速准确地判断晶片是否准确地安装在加热板上，以便将晶​​片中的故障发生抑制到最小限度。 构成：利用当晶片W安装在板63上时加热板63的温度下降的现象。 用于监测板63的温度降的温度传感器73设置在板63处。作为计算由温度曲线包围的范围的面积的函数的函数，给出了用于从传感器73接收测量结果的故障检测器77， 当通过曲线图表示板的温度的时间变化即温度积分区域并将积分区域与预设阈值进行比较时的设定温度。 作为阈值，使用当晶片W正确安装时从积分区域获得的标准偏差。 当板的温度低时，并且当积分面积超过阈值时，检测器77判断晶片W没有被精确地安装。