Abstract:
PURPOSE: A method for manufacturing a flexible display device is provided to protect organic light emitting elements from oxygen and moisture by forming a hydrophobic layer between one barrier layer and one plastic film. CONSTITUTION: A first plastic film(111) and a first barrier layer(112) are successively formed on a first substrate. A thin film transistor is formed on the first barrier layer. A display device in electric connection with the thin film transistor is formed on the thin film transistor. An encapsulating material(150), in which a second substrate, a second plastic film, and a second barrier layer are successively formed, is combined on the upper side of the display device. The first substrate is separated from the first plastic film. The second substrate is separated from the second plastic film(152).
Abstract:
PURPOSE: A method and an apparatus for manufacturing an electronic device with a plastic substrate and the electronic device manufactured by the same are provided to prevent the plastic substrate from being separated from a stage by coating a material for forming the plastic substrate on a stage and hardening the coated material. CONSTITUTION: A plurality of island shaped separation smoothing units is arranged on a stage(110). A plastic substrate(121) is arranged on the stage. A device is formed on the plastic substrate. The plastic substrate is separated from the stage.
Abstract:
A flexible substrate, fabrication method of the same and thin film transistor using the same is provided to minimize the residual stress of the buffer layer by determining the coefficient of thermal expansion of the metallic substrate according to the property of the buffer layer. The metallic substrate(100) has the constant coefficient of thermal expansion. The buffer layer(110) is positioned in the one surface of the metallic substrate and consists of the silicon oxide film or the silicon nitride film. In case the buffer layer is the silicon oxide film, the coefficient of thermal expansion of the metallic substrate is 2.86ppm / °C to 1.48ppm / °C. In case the buffer layer is the silicon nitride film, the coefficient of thermal expansion of the metallic substrate is 3.19ppm / °C to 8.01ppm / °C. The semiconductor layer is located on the buffer layer, and includes the source and drain region and the channel region.
Abstract:
420 내지 600℃의 온도에서 중량 손실률이 1% 보다 작은 고분자 기판, 상기 고분자 기판을 준비하는 단계 및 상기 고분자 기판을 350℃보다 높은 온도에서 열처리하는 단계를 포함하는 고분자 기판의 제조 방법과 상기 고분자 기판을 포함하는 표시 장치 및 그 제조 방법을 제공한다. 고분자 기판, 아웃개싱, 열팽창, 열처리
Abstract:
PURPOSE: An organic light emitting display device and a manufacturing method thereof are provided to prevent panel from bending by interposing a second film between a first film and a second film to offset the stress which is formed in the first film and a third film. CONSTITUTION: In an organic light emitting display device and a manufacturing method thereof, a first film(1) and a third film(3) are formed by an inorganic material. A second film(2) of organic compound interposed between the first film and the third film. The second film comprises a first surface(21) and a second surface(22) which are opposite to each other and also includes a side(23). A first sealing area(30) contacting the first film is arranged in the edge of the third film. An organic light emitting unit(5) is arranged on the third film to be overlapped with the second film.
Abstract:
PURPOSE: An organic light emitting display device and a manufacturing method thereof are provided to reduce a thickness and suppress the penetration of moisture or oxygen in an organic light emitting layer through a barrier film. CONSTITUTION: A substrate body(111) is divided into a display area(DA) and a neighboring area(NA). An organic light emitting device(70) is formed on the display area of the substrate body. A barrier film(200) covers the organic light emitting device. A groove pattern is formed on one side of the barrier film. An adhesive(250) is arranged between the neighboring area of the substrate body and the barrier film.
Abstract:
본 발명은 플렉서블 디스플레이 및 그의 제조방법에 관한 것으로, 본 발명의 일 실시예에 따른 플렉서블 디스플레이는 글래스 기판; 상기 글래스 기판 상에 배치된 ITO층; 상기 ITO층 상에 배치된 금속박막층; 상기 금속박막층 상에 배치된 실리콘계 또는 아크릴계로 이루어진 점착체층; 및 상기 점착체층 상에 배치된 플렉서블 기판을 포함한다. 본 발명의 일 실시예에 따른 플렉서블 디스플레이의 제조 방법은 글래스 기판 상에 ITO층을 형성하는 단계; 상기 ITO층 상에 금속박막층을 형성하는 단계; 상기 금속박막층 상에 실리콘계 또는 아크릴계로 이루어진 점착체층을 형성하는 단계; 상기 점착체층 상에 플렉서블 기판을 형성하는 단계; 및 상기 글래스 기판 및 상기 ITO층을 상기 금속박막층에서 분리하는 단계를 포함한다. 플렉서블 디스플레이, 점착제, 금속박막층
Abstract:
PURPOSE: A flexible display and method for manufacturing the same are provided to improve the lamination process between the flexible printed circuit board and the glass substrate. CONSTITUTION: The method of manufacturing the flexible display is provided. The metal thin film layer(300) is formed on the glass substrate. The adhesive layer(400) made of the silicon or the acryl group is formed in the metal thin film layer. The flexible printed circuit board(500) is formed on the adhesive layer. The glass substrate is separated from the metal thin film layer.
Abstract:
An organic electroluminescent display device and manufacturing method thereof are provided to prevent the ultraviolet irradiation to an organic electroluminescent device in a sealing film forming process including an organic film by forming an ultraviolet lay blocking film at the upper part of the organic electroluminescent device. A substrate(10) is provided. An organic electroluminescent device is formed on the substrate. The organic electroluminescent device is made of a first electrode, an organic thin film layer(16) and a second electrode. An ultraviolet lay blocking film(20) is formed on the organic electroluminescent device with a laminating structure of materials(20a,20b,20c) having different ultraviolet absorption wavelength. The absorption wavelength of low layer material of laminating structure is longer than the absorption wavelength of upper layer material. The material having different ultraviolet absorption wavelength is selected in the group consisting of resorcinol monobenzoate, benzophenone, benzotriazole, cinnamate, oxanilide and salicyate. A sealing film(30) is formed with the laminating structure of an inorganic film(30b) and an organic film(30a) in order to seal the organic electroluminescent device hermetically.