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公开(公告)号：KR101353149B1
公开(公告)日：2014-01-27
申请号：KR1020110143416
申请日：2011-12-27
Applicant: 삼성전기주식회사
CPC classification number: H01B1/026 , H01B13/00 , Y10T428/12181
Abstract: 본 발명은 구리분말, 구리 페이스트 및 구리분말 제조방법에 관한 것으로, 구리입자의 표면에 아산화구리막이 성긴 구조로 형성되어 이루어지는 구리분말을 제공하여 구리입자의 자연산화를 방지하고, 저온소성이 가능하며, 도전성이 향상될 수 있도록 한다는 유용한 효과를 제공한다.
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公开(公告)号：KR1020120011980A
公开(公告)日：2012-02-09
申请号：KR1020100073639
申请日：2010-07-29
Applicant: 삼성전기주식회사
CPC classification number: H05K3/107 , H05K2201/09909
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to cover a resist material on a dummy part corresponded to an inactive region of a substrate, thereby preventing unnecessary plating on the dummy part in a plating process. CONSTITUTION: A substrate is prepared by arranging a first resist on a region excluding a pad in order to perform a plating process only on a pad region(S10). A second resist is formed on a dummy region of the substrate using an inkjet printing method(S20). An imaging process is performed in order to determine the dummy part. The second resist arranged on the substrate is solidified(S30). The second resist is a photo-hardening resist or a thermosetting resist. The substrate which includes the first resist and the second resist is arranged for a plating process(S40).
Abstract translation: 目的：提供一种印刷电路板及其制造方法，以覆盖对应于基板的无效区域的虚拟部件上的抗蚀剂材料，从而防止在电镀工艺中对虚设部件的不必要的电镀。 构成：通过在除了焊盘之外的区域上布置第一抗蚀剂以仅在焊盘区域上执行电镀处理来制备衬底（S10）。 使用喷墨打印方法在基板的虚拟区域上形成第二抗蚀剂（S20）。 执行成像处理以确定虚拟部分。 布置在基板上的第二抗蚀剂固化（S30）。 第二抗蚀剂是光硬化抗蚀剂或热固性抗蚀剂。 布置包括第一抗蚀剂和第二抗蚀剂的基板进行电镀处理（S40）。
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公开(公告)号：KR1020110020626A
公开(公告)日：2011-03-03
申请号：KR1020090078346
申请日：2009-08-24
Applicant: 삼성전기주식회사
CPC classification number: B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1626 , B41J2202/08 , Y10T29/49401
Abstract: PURPOSE: An inkjet head and a manufacturing method thereof are provided to improve printing quality by securing the stable state of ink using a temperature controller for controlling the temperature of discharged ink. CONSTITUTION: An inkjet head(100) comprises a fluid path plate(110), a nozzle plate(130), and a temperature controller(150). Multiple ink chambers are formed in the fluid path plate. The Nozzle plate discharges the ink of the ink chamber to outside. Multiple nozzles, connected to the ink chambers, are formed in the nozzle plate and discharge ink to outside. Heat exchanging paths(152a,152b) are formed in the temperature controller and control the temperature of the ink. Liquid refrigerants are circulated through the heat exchanging paths.
Abstract translation: 目的：提供一种喷墨头及其制造方法，以通过使用用于控制排出的油墨的温度的温度控制器来确保油墨的稳定状态来提高打印质量。 构成：喷墨头（100）包括流体通道板（110），喷嘴板（130）和温度控制器（150）。 多个墨室形成在流体通路板中。 喷嘴板将墨水室的墨水排出到外部。 连接到墨室的多个喷嘴形成在喷嘴板中并将油墨排出到外部。 热交换路径（152a，152b）形成在温度控制器中并控制油墨的温度。 液体制冷剂通过热交换路径循环。
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公开(公告)号：KR101532138B1
公开(公告)日：2015-06-26
申请号：KR1020130102966
申请日：2013-08-29
Applicant: 삼성전기주식회사
Abstract: 본발명의일 실시형태는금속전구체및 수계용매를포함하는제1 용액을준비하는단계; 질소(N)를포함하는계면활성제, 환원제및 수계용매를포함하는제2 용액을준비하는단계; 상기제2 용액을가열하는단계; 가열된상기제2 용액과상기제1 용액을혼합하여제3 용액을마련하는단계; 및상기제3 용액을교반하여표면에서질소(N)가검출되는금속입자를얻는단계; 를포함하는금속분말의제조방법을제공할수 있다.
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公开(公告)号：KR1020130115507A
公开(公告)日：2013-10-22
申请号：KR1020120037849
申请日：2012-04-12
Applicant: 삼성전기주식회사
IPC: G01N9/08
Abstract: PURPOSE: A method and a device for measuring the density of a conductive thin film are provided to prevent the conductive thin film from being broken into small pieces by the weight caused by gravity. CONSTITUTION: A method for measuring the density of a conductive thin film (20) includes the following steps of: printing the conductive thin film on a substrate (10); plasticizing the substrate in which the conductive thin film is printed; measuring the weight of the plasticized substrate and the conductive thin film when both are in the air and dipped in solution respectively; removing the conductive thin film from the substrate; measuring the weight of the substrate in which the conductive thin film is removed when the substrate is in the air and dipped in solution respectively; subtracting the weight of the substrate in which the conductive thin film is removed from the weight of the substrate in which the conductive thin film is printed and calculating the conductive thin film when the conductive thin film is in the air or dipped in solution; and calculating the density of the conductive thin film based on the calculated weight.
Abstract translation: 目的：提供一种用于测量导电薄膜密度的方法和装置，以防止由于重力引起的导电薄膜破碎成小块。 构成：用于测量导电薄膜（20）的密度的方法包括以下步骤：将导电薄膜印刷在基底（10）上; 塑化印刷导电薄膜的基板; 当两者都在空气中并分别浸入溶液中时，测量塑化基材和导电薄膜的重量; 从基板去除导电薄膜; 当衬底在空气中并分别浸入溶液中时，测量其中去除导电薄膜的衬底的重量; 从印刷有导电薄膜的基板的重量减去去除了导电薄膜的基板的重量，并且当导电薄膜在空气中或浸入溶液中时计算导电薄膜; 以及基于所计算的重量计算导电薄膜的密度。
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Patent Agency Ranking
公开(公告)号：KR1020130031414A
公开(公告)日：2013-03-29
申请号：KR1020110094964
申请日：2011-09-21
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A conductive paste composition is provided to form a conductive wire with high aspect ratio together with excellent printability and to obtain excellent electric performance and adhesion even by a low temperature sintering under 200°C. CONSTITUTION: A conductive paste composition low temperature sintering comprises a copper powder which consists of a platelike powder, spherical powder, nano-sized powder; a melamine-based binder; and an organic solvent. The conductive paste composition for low temperature sintering comprises 50-95 weight% of the conductive copper powder, 0.01-5 weight% of the melamine-based binder, and residual organic solvent. The conductive copper powder consists of a platelike powder of 1-20 micron, a conductive copper powder of 0.1-5 micron, and a nanopowder of 1-10 nm. [Reference numerals] (AA) Platelike shape; (BB) Spherical shape; (CC) Nano
Abstract translation: 目的：提供导电糊组合物以形成具有高纵横比的导电丝以及优异的可印刷性，并且即使通过在200℃下的低温烧结也可获得优异的电性能和粘附性。 构成：导电糊组合物低温烧结包括由粉状粉末，球形粉末，纳米尺寸粉末组成的铜粉末; 三聚氰胺基粘合剂; 和有机溶剂。 用于低温烧结的导电糊组合物包含50-95重量％的导电铜粉，0.01-5重量％的三聚氰胺基粘合剂和残留的有机溶剂。 导电铜粉由1-20微米的片状粉末，0.1-5微米的导电铜粉末和1-10nm的纳米粉末组成。 （附图标记）（AA）扁平形状; （BB）球形; （CC）纳米
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公开(公告)号：KR1020110058115A
公开(公告)日：2011-06-01
申请号：KR1020090114790
申请日：2009-11-25
Applicant: 삼성전기주식회사
CPC classification number: B41J2/14233 , B41J2002/14475
Abstract: PURPOSE: An ink-jet head and an ink-jet printer including the same are provided to quickly charge ink to a nozzle after discharging large droplets and improve the directivity of discharged ink by forming uniform interfaces of ink droplets. CONSTITUTION: An ink-jet head comprises a chamber accommodating ink and a nozzle(50) which discharges ink from the chamber. A plurality of inner wall grooves(54) are formed lengthwise on an inner wall(52) of the nozzle as being arranged in the radial direction. The inner wall grooves are bored from the interior to the exterior of the chamber.
Abstract translation: 目的：提供一种喷墨头和包括该喷墨头的喷墨打印机，用于在喷出大液滴后迅速向喷嘴充电，并且通过形成墨滴的均匀界面来提高排墨的方向性。 构成：喷墨头包括容纳墨水的腔室和从腔室排出墨水的喷嘴（50）。 在喷嘴的内壁（52）上沿径向布置多个内壁槽（54）。 内壁凹槽从腔室的内部到外部钻孔。
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公开(公告)号：KR101525651B1
公开(公告)日：2015-06-03
申请号：KR1020120041519
申请日：2012-04-20
Applicant: 삼성전기주식회사
IPC: C01G3/00
CPC classification number: C01G3/00 , B22F1/0018 , B22F9/30 , C01P2004/03 , C01P2006/80
Abstract: 본발명은구리전구체의제조방법및 이에의하여제조된구리전구체에관한것으로, 본발명에따른구리전구체의제조방법은구리염또는그 수화물을포함하는수용액을마련하는단계; 상기수용액에요소(CO(NH))를혼합하여혼합물을마련하는단계; 및상기혼합물을 100 내지 120℃의온도로가열하여구리전구체를합성하는단계;를포함한다.
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公开(公告)号：KR101376913B1
公开(公告)日：2014-03-20
申请号：KR1020110143417
申请日：2011-12-27
Applicant: 삼성전기주식회사
Abstract: 본발명은구리유기금속, 구리유기금속제조방법및 구리페이스트에관한것으로, 본발명의구리유기금속은구리원자와 [R-CO] 및아민계리간드(L)가결합되어이루어지며, 종래보다저온에서소결이가능하고, 도전패턴형성시도전성이향상되는유용한효과를제공한다.
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公开(公告)号：KR1020130075164A
公开(公告)日：2013-07-05
申请号：KR1020110143416
申请日：2011-12-27
Applicant: 삼성전기주식회사
CPC classification number: H01B1/026 , H01B13/00 , Y10T428/12181
Abstract: PURPOSE: A copper powder, a copper paste, and a copper powder manufacturing method are provided to prevent an additional natural oxidation of a copper particle by forming a cuprous oxide film in which a reduction is large on a surface of a copper powder, and to improve conductivity after sintering since plasticity is available with a temperature less than 300°C in a reducing atmosphere. CONSTITUTION: A copper powder (100) comprises a copper particle (110), and a cuprous oxide film (120) formed on a surface of the copper particle. The diameter of the copper powder is 0.1 to 10 um. A weight of the cuprous oxide film is 5 to 20wt% based on a weight of the copper powder.
Abstract translation: 目的：提供铜粉，铜膏和铜粉制造方法，以通过在铜粉的表面上形成还原量大的氧化亚铜膜来防止铜颗粒的额外的自然氧化，并且 提高烧结后的导电性，因为在还原气氛中，在温度低于300℃时可以获得可塑性。 构成：铜粉（100）包括铜颗粒（110）和形成在铜颗粒表面上的氧化亚铜膜（120）。 铜粉的直径为0.1〜10μm。 氧化亚铜膜的重量相对于铜粉的重量为5〜20重量％。
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