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公开(公告)号：KR100930648B1
公开(公告)日：2009-12-09
申请号：KR1020080009135
申请日：2008-01-29
Applicant: 삼성전기주식회사
IPC: H05K3/00
Abstract: 인쇄회로기판의 제조방법이 개시된다. 절연층에 발포제를 도포하는 단계, 발포제를 발포시키는 단계 및 발포제가 발포된 절연층에 회로패턴을 형성하는 단계를 포함하는 인쇄회로기판의 제조방법은, 절연층 표면에 균일한 조도를 형성할 수 있어 미세회로를 구현할 수 있고, 필 접착력(peel strength)의 편차를 작게 할 수 있다.
발포제, 용해, 발포, 표면조도Abstract translation: 提供一种印刷电路板的制造方法，以通过在绝缘层中形成内聚力和均匀亮度来实现微图案化电路。 第一电路图案（102）形成在核心基板（100）中。 绝缘层（104）层叠在核心基板上。 发泡剂（106）被涂覆在绝缘层上。 绝缘层表面的亮度由发泡剂均匀地形成。 镀层形成在绝缘层表面上。 发泡剂由偶氮类化合物，磺酰肼类化合物和无机化合物组成。 第二电路图案（114）形成在绝缘层中。 种子层（110）插入在绝缘层和第二电路图案之间。
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公开(公告)号：KR100771314B1
公开(公告)日：2007-10-29
申请号：KR1020060113377
申请日：2006-11-16
Applicant: 삼성전기주식회사
IPC: H01L21/306 , H01L21/304 , B82Y99/00
Abstract: An etching solution for forming a circuit and a method of forming the circuit using the same are provided to increase a vertical orientation of wet etching by increasing spraying force of a mixed etching solution. An etching solution contains ceramic nano powder with anionic surfactant. Contents of the ceramic nano powder are in the range of 0.1 to 20wt%, and the ceramic nano powder has a mean grain size of 0.005 to 1.0 micrometer. The ceramic powder is selected from the group consisting of Al2O3, SiO2, ZrO2, TiO2, ZnO, AlN, Si3N4, SiC, WC and a compound thereof. The anionic surfactant is selected from the group consisting of sulfonate, sulfate, carboxylate, phosphate and a compound thereof.
Abstract translation: 提供了用于形成电路的蚀刻溶液和使用其的形成电路的方法，以通过增加混合蚀刻溶液的喷涂力来增加湿蚀刻的垂直取向。 蚀刻溶液含有具有阴离子表面活性剂的陶瓷纳米粉末。 陶瓷纳米粉末的含量为0.1〜20重量％，陶瓷纳米粉末的平均粒径为0.005〜1.0微米。 陶瓷粉末选自Al2O3，SiO2，ZrO2，TiO2，ZnO，AlN，Si3N4，SiC，WC及其化合物。 阴离子表面活性剂选自磺酸盐，硫酸盐，羧酸盐，磷酸盐及其化合物。
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公开(公告)号：KR100936079B1
公开(公告)日：2010-01-12
申请号：KR1020080030450
申请日：2008-04-01
Applicant: 삼성전기주식회사
IPC: H05K3/18
Abstract: 인쇄회로기판 제조방법이 개시된다. 제1 금속을 기판의 표면에 스퍼터링(sputtering)하여 제1 시드층을 형성하는 단계; 제2 금속을 제1 시드층의 표면에 스퍼터링(sputtering)하여 제2 시드층을 형성하는 단계; 제2 시드층 위에 회로패턴에 상응하는 개구부가 형성된 필름층을 형성하는 단계; 개구부를 통해 드러난 제2 시드층 표면에 전해도금하여 회로패턴을 형성하는 단계; 필름층을 제거하는 단계; 및 기판의 표면에 드러난 제2 시드층 및 제1 시드층을 제거하는 단계를 포함하는 인쇄회로기판 제조방법은 공정 수를 줄일 수 있어 공정시간의 단축 할 수 있고, 설비 공간을 줄일 수 있어 비용절감 효과가 있으며, 얇고 균일한 시드층을 형성하는 것이 가능하여 미세피치 회로패턴을 구현할 수 있다.
스퍼터링(sputtering), 시드층(seed layer),-
公开(公告)号：KR1020090105162A
公开(公告)日：2009-10-07
申请号：KR1020080030450
申请日：2008-04-01
Applicant: 삼성전기주식회사
IPC: H05K3/18
CPC classification number: H05K3/06 , H05K3/108 , H05K3/188 , H05K2203/092
Abstract: PURPOSE: A manufacturing method of a printed circuit board is provided to perform a fine pitch circuit pattern by forming a uniform seed layer. CONSTITUTION: A first seed layer is formed by sputtering a first metal on a surface of a substrate(S300). A second seed layer is formed by sputtering a second metal on a surface of the first seed layer(S400). A film layer in which an opening part corresponding to a circuit pattern is formed is formed on the second seed layer(S500). The circuit pattern is formed by electrolyzing a surface of the second seed layer exposed through the opening part(S600). The film layer is removed(S700). The first seed layer and the second seed layer exposed on the surface of the substrate are removed(S800).
Abstract translation: 目的：提供印刷电路板的制造方法，以通过形成均匀的种子层来执行精细节距电路图案。 构成：通过在基板的表面上溅射第一金属形成第一晶种层（S300）。 通过在第一种子层的表面上溅射第二金属形成第二晶种层（S400）。 形成有与电路图案对应的开口部的薄膜层（S500）。 通过电解通过开口部暴露的第二籽晶层的表面形成电路图案（S600）。 去除胶片层（S700）。 去除暴露在基板表面上的第一晶种层和第二晶种层（S800）。
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公开(公告)号：KR1020000056439A
公开(公告)日：2000-09-15
申请号：KR1019990005771
申请日：1999-02-22
Applicant: 삼성전기주식회사
IPC: H01L21/68
Abstract: PURPOSE: An apparatus for fixing a wafer is provided to rapidly fix and separate the wafer, and to prevent a foreign substance from being induced in fixing the wafer, by fixing the wafer by a clamp when the wafer is mounted on the inside of a process chamber. CONSTITUTION: In an apparatus for fixing a wafer(3) on an upper surface of a jig plate(1) mounted on a robot arm in a process chamber, a plurality of fixing elements and clamps are established in the jig plate. The fixing element adheres/separates the wafer to/from an adhesion pad(2), in which the wafer is mounted on the jig plate by intervening the adhesion pad. In the clamp, a rotating plate(8) connected to a side of a operating handle(10) is built in a supporting plate(5) to rotate the fixing element.
Abstract translation: 目的：提供一种用于固定晶片的装置，以快速固定和分离晶片，并且通过在将晶片安装在工艺内部时通过夹具固定晶片来防止异物在固定晶片时被感应 室。 构成：在将晶片（3）固定在安装在处理室中的机器人臂上的夹具板（1）的上表面的装置中，在夹具板上建立多个固定元件和夹具。 固定元件将晶片粘附/分离粘合垫（2），其中通过插入粘合垫将晶片安装在夹具板上。 在夹具中，连接到操作手柄（10）的一侧的旋转板（8）内置在支撑板（5）中以旋转固定元件。
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Patent Agency Ranking
公开(公告)号：KR100924810B1
公开(公告)日：2009-11-03
申请号：KR1020080005289
申请日：2008-01-17
Applicant: 삼성전기주식회사
Abstract: 인쇄회로기판 제조방법이 개시된다. 비아홀이 형성된 절연 기판을 제공하는 단계, 절연 기판의 표면 및 비아홀의 내벽에 금속층을 형성하는 단계, 비아홀 내부에 액상 포토 레지스트를 충전하는 단계, 금속층에 에칭 레지스트를 형성하는 단계, 금속층에 에칭 용액을 공급하는 단계 및 에칭 레지스트 및 비아홀에 충전된 포토 레지스트를 제거하는 단계를 포함하는 인쇄회로기판 제조방법은, 기판 표면에 얇은 두께의 에칭 레지스트를 형성함으로써 미세 회로패턴을 형성할 수 있으며, 액상 포토 레지스트로 비아홀을 충전하고 비아홀의 주변을 노출시키는 에칭 레지스트를 형성함으로써 랜드리스(Landless) 비아를 형성할 수 있다.
포토 레지스트, 미세 회로패턴, 랜드리스 비아-
公开(公告)号：KR1020090092656A
公开(公告)日：2009-09-01
申请号：KR1020080018020
申请日：2008-02-27
Applicant: 삼성전기주식회사 , 주식회사 에스 디 씨
IPC: C09D163/00 , C09D179/02 , C09D179/08
Abstract: A coating composition for printed circuit boards is provided to exhibit strong cohesive power when lamination-molding a multiayered printed circuit board and to replace a blackening treatment process and acid etching process. A coating composition for printed circuit boards comprises (i) water-soluble .01-10 parts by weight, (ii) silane compound 0.05-15 parts by weight, (iii) thermal initiator 0.001-1 parts by weight, (iv) at least one salt 0.01-10 parts by weight selected from the group consisting of acetate, glycolate, lactate, gluconate, citrate and succinate, (v) alcohol 0.01-10 parts by weight, and (vi) water 40-95 parts by weight.
Abstract translation: 提供了一种用于印刷电路板的涂料组合物，以便在层叠多层印刷电路板的层压成型和替代黑化处理工艺和酸蚀刻工艺时具有很强的内聚力。 用于印刷电路板的涂料组合物包括（i）水溶性0.01-10重量份，（ii）0.05-15重量份的硅烷化合物，（iii）热引发剂0.001-1重量份，（iv） 至少一种选自乙酸盐，乙醇酸盐，乳酸盐，葡萄糖酸盐，柠檬酸盐和琥珀酸盐中的0.01-10重量份盐，（v）0.01-10重量份的醇，和（ⅳ）40-95重量份的水。
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公开(公告)号：KR1020090079373A
公开(公告)日：2009-07-22
申请号：KR1020080005289
申请日：2008-01-17
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4038 , H05K1/115 , H05K3/064 , H05K3/429
Abstract: A method for manufacturing a printed circuit board is provided to bury a via hole in a via and circuit pattern forming process and to form a thin etching resist on a surface of a substrate by using a liquefied photoresist having high cohesive power and resolution. An insulating substrate having a via hole is provided(S100). A seed layer is formed on a surface of the insulating substrate and an inner wall of the via hole through an electroless plating method(S200). A metal layer is formed on the seed layer by using an electroplating method(S300). The via hole is filled with a liquefied photoresist(S400). A dry process is performed to dry the liquefied photoresist within the via hole(S450). An etching resist is formed on the metal layer(S500). An etching solution is supplied to the metal layer(S600). The etching resist and the photoresist are removed(S700).
Abstract translation: 提供一种制造印刷电路板的方法，以通孔和电路图案形成工艺掩埋通孔，并通过使用具有高内聚力和分辨率的液化光致抗蚀剂在基板的表面上形成薄抗蚀剂。 提供具有通孔的绝缘基板（S100）。 通过化学镀方法在绝缘基板的表面和通孔的内壁上形成籽晶层（S200）。 通过使用电镀方法在种子层上形成金属层（S300）。 通孔填充液化光致抗蚀剂（S400）。 进行干燥处理以使通孔内的液化光致抗蚀剂干燥（S450）。 在金属层上形成抗蚀剂（S500）。 向金属层供给蚀刻溶液（S600）。 除去抗蚀剂和光致抗蚀剂（S700）。
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公开(公告)号：KR1020110019154A
公开(公告)日：2011-02-25
申请号：KR1020090076751
申请日：2009-08-19
Applicant: 삼성전기주식회사
CPC classification number: B24D13/145 , H05K3/18
Abstract: PURPOSE: A pre-grinder and a method for manufacturing a substrate using the same are provided to minimize the grinding and etching variation of a substrate by pre-grinding a protrusion formed at an edge part of a substrate before a grinding process. CONSTITUTION: A pre-grinder comprises a rotary shaft(10) and a brush part(20a,20b). The rotary shaft serves as the support bar fixing the brush part and transfers driving force to the brush part. The brush part is made of ceramics, non-woven fabric, and urethane to grain a protrusion(120a,120b).
Abstract translation: 目的：提供预磨机和使用其的基板的制造方法，以通过在研磨处理之前预先研磨形成在基板的边缘部分处的突起来最小化基板的研磨和蚀刻变化。 构成：预磨机包括旋转轴（10）和刷部（20a，20b）。 旋转轴用作固定刷部并将驱动力传递到刷部的支撑杆。 电刷部分由陶瓷，无纺布和氨基甲酸酯制成，以形成突起（120a，120b）。
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公开(公告)号：KR1020080092782A
公开(公告)日：2008-10-16
申请号：KR1020070036614
申请日：2007-04-13
Applicant: 삼성전기주식회사
IPC: C23F1/00
Abstract: An etching apparatus is provided to obtain different circuit patters at upper and lower sides of a PCB(Printed Circuit Board) and form fine circuits, using different etching liquids from two etching liquid concentration controllers. An etching apparatus comprises etching tanks(104,106), a post etching tank(108), first, second, and third etching tanks(102a,102b,102c), a flooded water tank(112), a hydrochloric acid tank(114), and first and second etching liquid concentration controllers(110a,110b). The etching tanks etch upper and lower sides of a PCB(Printed Circuit Board) by first and second etching liquids. The post etching tank flats the upper and lower surfaces of the PCB by the first and second etching liquids. The first etching tank receives and stores a mixed etching liquid of the first and second etching liquids. The second etching tank stores the first etching liquid. The third etching tank stores the second etching liquid. The first etching liquid concentration controller detects/controls concentration of the first etching liquid. The second etching liquid concentration controller detects/controls concentration of the second etching liquid.
Abstract translation: 提供蚀刻装置以在PCB（印刷电路板）的上侧和下侧获得不同的电路图案，并使用来自两个蚀刻液体浓度控制器的不同蚀刻液形成精细电路。 蚀刻装置包括蚀刻槽（104,106），后蚀刻槽（108），第一，第二和第三蚀刻槽（102a，102b，102c），淹水箱（112），盐酸罐（114） 以及第一和第二蚀刻液体浓度控制器（110a，110b）。 蚀刻槽通过第一和第二蚀刻液体蚀刻PCB（印刷电路板）的上侧和下侧。 后蚀刻槽通过第一和第二蚀刻液体平坦化PCB的上表面和下表面。 第一蚀刻槽接收并存储第一和第二蚀刻液的混合蚀刻液。 第二蚀刻槽存储第一蚀刻液。 第三蚀刻槽存储第二蚀刻液。 第一蚀刻液浓度控制器检测/控制第一蚀刻液的浓度。 第二蚀刻液浓度控制器检测/控制第二蚀刻液的浓度。
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