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公开(公告)号：KR101009080B1
公开(公告)日：2011-01-18
申请号：KR1020090008001
申请日：2009-02-02
Applicant: 삼성전기주식회사
Abstract: 본 발명은 인쇄회로기판에 관한 것으로서, 보다 상세하게는 방열 기능을 수행하기 충분한 두께를 갖으며, 전기적으로 독립된 복수의 접지부를 한 개의 층에 구비하는 인쇄회로기판 및 그 제조방법에 관한 것이다.
인쇄회로기판, PCB, 방열, heavy Cu, 독립 접지, GND-
公开(公告)号：KR1020100061069A
公开(公告)日：2010-06-07
申请号：KR1020080119948
申请日：2008-11-28
Applicant: 삼성전기주식회사
IPC: H05K1/18
CPC classification number: H05K7/205 , H05K1/115 , H05K1/185 , H05K3/0044
Abstract: PURPOSE: A heat radiation package substrate and a manufacturing method thereof are provided to increase heat radiation efficiency by directly transmitting heat to a metal core through a via or bump. CONSTITUTION: A heat radiation package substrate includes a metal core(102), a circuit layer(108b), a via(108a), and an electronic component(110). The metal core is formed on one side of an insulation layer(104). The metal core is made of stainless steel, aluminum, nickel, magnesium, zinc, tantalum, and alloy thereof. The circuit layer is formed on the other side of the insulation layer. The via passes through the insulation layer and connects the metal core with the circuit layer. The electronic component is mounted on the circuit layer.
Abstract translation: 目的：提供一种散热封装基板及其制造方法，通过直接通过通孔或凸块向金属芯片传递热量来提高散热效率。 构成：散热封装基板包括金属芯（102），电路层（108b），通孔（108a）和电子部件（110）。 金属芯形成在绝缘层（104）的一侧上。 金属芯由不锈钢，铝，镍，镁，锌，钽及其合金制成。 电路层形成在绝缘层的另一侧。 通孔穿过绝缘层并将金属芯与电路层连接。 电子元件安装在电路层上。
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公开(公告)号：KR1020170097862A
公开(公告)日：2017-08-29
申请号：KR1020160019474
申请日：2016-02-19
Applicant: 삼성전기주식회사
Abstract: 본개시의일 실시예에따른코일부품은자성물질을포함하는바디및 바디내에배치된코일부를포함하며, 코일부는지지부재, 상기지지부재의상면및 하면에각각형성된제1 및제2 코일영역을포함하며, 제1 코일영역과상기제2 코일영역은상기지지부재를관통하는제1 비아를통해전기적으로연결되며, 상기제1 비아의단면은상단면및 하단면으로부터상기상단면과상기하단면사이에위치한내부영역중 일영역까지폭이작아지는형상을가짐으로써, 인덕턴스의손실을방지하며낮은직류저항(Rdc)를확보할수 있다.
Abstract translation: 根据本公开的实施例的线圈部件包括线圈，并且包括线圈单元保持构件，所述支撑bujaeui顶面和底面分别第一mitje第二线圈面积形成就位在主体内，并且主体包括磁性材料 ，在该第一线圈区域的内部和所述支撑件的第二螺旋区电通过第一连接经由穿过所述构件，并且所述第一通路交叉银横截面，并且从下纱线的底表面的顶表面 通过将宽度减小到区域的一个区域，可以防止电感损失并确保低直流电阻（Rdc）。
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公开(公告)号：KR1020130124759A
公开(公告)日：2013-11-15
申请号：KR1020120048139
申请日：2012-05-07
Applicant: 삼성전기주식회사
CPC classification number: H05K3/10 , H05K1/0218 , H05K1/181 , H05K3/4691 , H05K2201/0715 , H05K2203/068 , Y10T29/49155
Abstract: A rigid-flexible printed circuit board according to the embodiment of the present invention includes a rigid region including a circuit layer, a flexible region formed in the end part of the rigid region, and a raw material formed in the upper part of the flexible region and having pressed surface marks.
Abstract translation: 根据本发明实施例的刚性柔性印刷电路板包括刚性区域，其包括电路层，形成在刚性区域的端部中的柔性区域和形成在柔性区域的上部中的原材料 并压制表面痕迹。
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Patent Agency Ranking
公开(公告)号：KR101109190B1
公开(公告)日：2012-01-30
申请号：KR1020100052925
申请日：2010-06-04
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4602 , H05K3/4644 , H05K2201/09345 , H05K2203/175 , Y10T29/49124
Abstract: 본 발명은 인쇄회로기판 및 그 제조방법에 관한 것으로, 다수의 영역으로 구분된 금속층, 상기 금속층의 적어도 일면에 형성된 빌드업층, 및 상기 빌드업층을 포함하여 상기 금속층을 관통하되, 상기 금속층의 상기 다수의 영역 각각을 전기적으로 분리시키는 관통부를 포함하는 것을 특징으로 하며, 금속층을 서로 다른 접지층 또는 파워층인 다수의 영역으로 구성하여 박판화를 구현하고, 금속층의 다수의 영역을 브릿지로 연결하고 이후에 관통하여 제조공정이 용이한 인쇄회로기판 및 그 제조방법을 제공한다.
Abstract translation: 但是，本发明涉及一种印刷电路板和制造方法，其中包括积层的方法，和形成在分离成多个区域的金属层的积层，通过金属层的金属层，其中，所述多个金属层中的至少一个侧 其特征在于它包括通过所述电隔离的区域的部分中的分别，并且由于通过实现薄型化，并且所述多个金属层的区域的连接桥，而所述金属层的配置成多个不同接地层或电源层的区域 本发明提供一种促进制造过程的印刷电路板及其制造方法。
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公开(公告)号：KR1020110133282A
公开(公告)日：2011-12-12
申请号：KR1020100052925
申请日：2010-06-04
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4602 , H05K3/4644 , H05K2201/09345 , H05K2203/175 , Y10T29/49124
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce the generation of eccentricity by processing a build up process as a state in which a plurality of domains is connected to a bridge. CONSTITUTION: A first build up layer is formed. A metal layer(120) in which a plurality of domains is connected through a bridge is formed on the first build up layer. The metal layer is a heat radiation layer which is composed of copper. A second build up layer is formed on the metal layer. A penetration part(130) passes through the metal layer and the build-up layers. The penetration part electrically separates a plurality of domains. A plurality of domains is composed of a ground layer or a power layer which is different each other.
Abstract translation: 目的：提供印刷电路板及其制造方法，以通过处理建立过程来减少偏心的产生，作为多个畴连接到桥的状态。 构成：形成第一个堆积层。 在第一累积层上形成有多个畴通过桥连接的金属层（120）。 金属层是由铜组成的散热层。 在金属层上形成第二堆积层。 穿透部分（130）穿过金属层和积聚层。 穿透部分电分离多个畴。 多个畴由彼此不同的接地层或功率层组成。
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公开(公告)号：KR1020110001030A
公开(公告)日：2011-01-06
申请号：KR1020090058414
申请日：2009-06-29
Applicant: 삼성전기주식회사
IPC: H01L23/34
CPC classification number: H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L23/3735 , H01L23/3736 , H01L23/481 , H01L25/0753
Abstract: PURPOSE: A heat dissipation package and a manufacturing method thereof are provided to effectively discharge heat generated in an electronic part to a metal core layer by including a heat dissipation via formed in the vicinity of the metal by passing a part of an insulating layer. CONSTITUTION: An insulating layer(130) and a metal layer are formed in one side of a metal core(110). A circuit layer(150) is formed in the other side of the insulating layer. A heat dissipation via(170) is extended from the circuit layer in order to pass through a part of the insulating layer in a thicker direction. An electronic part(300) is mounted on the circuit layer. A via hole passes through a part of the insulating layer and the metal layer.
Abstract translation: 目的：提供一种散热封装及其制造方法，通过使绝缘层的一部分通过包含形成在金属附近的散热通孔，来有效地将电子部件产生的热量排出到金属芯层。 构成：在金属芯（110）的一侧形成绝缘层（130）和金属层。 电路层（150）形成在绝缘层的另一侧。 散热通孔（170）从电路层延伸，以便在更厚的方向穿过绝缘层的一部分。 电子部件（300）安装在电路层上。 通孔穿过绝缘层和金属层的一部分。
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公开(公告)号：KR1020100101194A
公开(公告)日：2010-09-17
申请号：KR1020090018536
申请日：2009-03-04
Applicant: 삼성전기주식회사
CPC classification number: H01L33/648 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2933/0033 , H01L2933/0075
Abstract: PURPOSE: A heat radiating package substrate and a manufacturing method thereof are provided to increase heat radiation efficiency by including a heat pipe with refrigerant. CONSTITUTION: A heat radiating package substrate includes a heat pipe substrate(116a) and an electronic component(120). A circuit layer(114a) is formed on the upper side of an insulation layer to cover the refrigerant in the heat pipe. The refrigerant is injected into a refrigerant injection groove. The insulation layer is attached to the heat pipe substrate. The electronic component is mounted on the circuit layer.
Abstract translation: 目的：提供一种散热封装基板及其制造方法，其特征在于，通过在制冷剂上配置热管来提高散热效率。 构成：散热封装基板包括热管基板（116a）和电子部件（120）。 电路层（114a）形成在绝缘层的上侧，以覆盖热管中的制冷剂。 制冷剂被注入制冷剂注入槽。 绝缘层附着在热管基板上。 电子部件安装在电路层上。
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公开(公告)号：KR1020100088868A
公开(公告)日：2010-08-11
申请号：KR1020090008001
申请日：2009-02-02
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A heat dissipating printed circuit board and a manufacturing method thereof are provided to improve the electrical property and the thermal property by forming a plurality of electrically independent grounds on one layer. CONSTITUTION: A ground metal layer having a plurality of grounds is offered. The grounds are connected to each other by a bridge. A circuit board(310) having circuit pattern is laminated on one side or both sides of the ground metal layer. The bridge is removed by processing a penetration hole(500) on the forming part of the bridge. The ground metal layer has the thickness of 70μm-210μm. The penetration hole processing procedure is implemented by the machining using the CNC drill.
Abstract translation: 目的：提供散热印刷电路板及其制造方法，以通过在一层上形成多个电独立的接地来改善电性能和热性能。 构成：提供具有多个接地的接地金属层。 地面通过桥梁相互连接。 具有电路图案的电路板（310）层叠在接地金属层的一侧或两侧。 通过在桥的形成部分上加工穿孔（500）来移除桥。 接地金属层的厚度为70μm〜210μm。 贯穿孔加工程序是通过使用CNC钻头进行加工来实现的。
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