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公开(公告)号：KR101462724B1
公开(公告)日：2014-11-17
申请号：KR1020120107706
申请日：2012-09-27
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4644 , H05K3/4652 , H05K3/4691 , H05K2201/0723 , H05K2203/308 , Y10T29/49156
Abstract: 본 발명은 리지드 플렉시블 인쇄회로기판 제조방법에 관한 것으로, 일면 또는 양면에 내층 회로패턴이 형성되고, 리지드 영역과 플렉시블 영역으로 구분되는 플렉시블 기판을 준비하는 단계와, 상기 플렉시블 기판의 플렉시블 영역에 형성된 내층 회로패턴을 보호하도록 보호층를 형성하는 단계와, 상기 보호층이 노출되도록 상기 내층 회로패턴이 형성된 면의 상기 리지드 영역 상에 커버레이를 형성하는 단계와, 상기 리지드 영역의 상기 커버레이 상에 리지드 절연층을 적층하고, 보호층과 리지드 절연층에 금속층을 적층하는 단계와, 상기 금속층을 패터닝하여 외층 회로층을 형성하고, 플렉시블 영역의 금속층을 제거하는 단계 및 상기 보호층을 제거하는 단계를 포함한다.
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公开(公告)号：KR1020130124759A
公开(公告)日：2013-11-15
申请号：KR1020120048139
申请日：2012-05-07
Applicant: 삼성전기주식회사
CPC classification number: H05K3/10 , H05K1/0218 , H05K1/181 , H05K3/4691 , H05K2201/0715 , H05K2203/068 , Y10T29/49155
Abstract: A rigid-flexible printed circuit board according to the embodiment of the present invention includes a rigid region including a circuit layer, a flexible region formed in the end part of the rigid region, and a raw material formed in the upper part of the flexible region and having pressed surface marks.
Abstract translation: 根据本发明实施例的刚性柔性印刷电路板包括刚性区域，其包括电路层，形成在刚性区域的端部中的柔性区域和形成在柔性区域的上部中的原材料 并压制表面痕迹。
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公开(公告)号：KR1020150026258A
公开(公告)日：2015-03-11
申请号：KR1020130104834
申请日：2013-09-02
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4691 , H05K1/028 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/4652 , H05K3/4673 , H05K2203/14 , Y10T29/302
Abstract: 본 발명은 리지드 기판의 플래트니스를 개선하기 위한 것으로, 절연재에 회로층이 구성된 연성동박적층판에 커버레이가 적층된 플렉서블부; 그리고 상기 플렉서블부의 양측으로 절연층 및 카파층이 빌드 업되며, 상기 절연층의 외면을 평탄화시킬 수 있도록 평탄재가 구비된 리지드부; 를 포함할 수 있다.
Abstract translation: 本发明是为了提高刚性基板的平坦度。 它可以包括柔性部件，其具有堆叠在具有绝缘材料的电路层的柔性铜层压板上的盖子; 以及刚性部分，其具有在柔性部件的两侧上建立的绝缘层和κ层，并且具有平坦的材料以使绝缘层的外部平坦化。
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公开(公告)号：KR1020140040971A
公开(公告)日：2014-04-04
申请号：KR1020120107706
申请日：2012-09-27
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4644 , H05K3/4652 , H05K3/4691 , H05K2201/0723 , H05K2203/308 , Y10T29/49156
Abstract: The present invention relates to a method for manufacturing a rigid flexible printed circuit board. The present invention includes a step of preparing a flexible board which has a circuit pattern on one side or both sides and is divided into a rigid area and a flexible area; a step of forming a protective layer on a flexible area of the flexible board; a step of forming a coverlay on one side of the flexible board in order for the protective layer to be exposed; a step of laminating a rigid insulation layer on a rigid area and a metal layer on the protective layer and the rigid insulation layer; a step of forming an outer circuit layer by patterning the metal layer and removing the metal layer of the rigid area; and a step of removing the protective layer. [Reference numerals] (S100) Preparing a flexible board which has a circuit pattern on one side or both sides and is divided into a rigid area and a flexible area; (S200) Forming a protective layer on a flexible area of the flexible board; (S300) Forming a coverlay on one side of the flexible board in order for the protective layer to be exposed; (S400) Laminating a rigid insulation layer on a rigid area excluding the protective layer and a copper plate on the protective layer and the rigid insulation layer; (S500) Forming an outer circuit layer by patterning the metal layer andremoving the metal layer of the flexible area; (S600) Removing the protective layer
Abstract translation: 本发明涉及刚性柔性印刷电路板的制造方法。 本发明包括制备在一侧或两侧具有电路图案并被分成刚性区域和柔性区域的柔性板的步骤; 在柔性板的柔性区域上形成保护层的步骤; 在柔性板的一侧上形成覆盖层以使保护层露出的步骤; 将刚性绝缘层层叠在保护层和刚性绝缘层上的刚性区域和金属层上的步骤; 通过图案化金属层并去除刚性区域的金属层来形成外部电路层的步骤; 以及去除保护层的步骤。 （附图标记）（S100）准备在一侧或两侧具有电路图案并被划分为刚性区域和柔性区域的柔性板; （S200）在柔性板的柔性区域上形成保护层; （S300）为了保护层露出，在柔性基板的一侧上形成覆盖层; （S400）在保护层以外的刚性区域和保护层和刚性绝缘层上的铜板上层压刚性绝缘层; （S500）通过图案化金属层和移动柔性区域的金属层来形成外部电路层; （S600）取下保护层
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Patent Agency Ranking
公开(公告)号：KR1020130059144A
公开(公告)日：2013-06-05
申请号：KR1020110125301
申请日：2011-11-28
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A method for manufacturing a printed circuit board is provided to perform various processes by using a carrier thin film, thereby preventing damage due to foreign substances. CONSTITUTION: A base substrate(100) is prepared. A carrier thin film(130) is formed on the upper and lower sides of the base substrate. The carrier thin film is laminated. The base substrate is formed. The carrier thin film is removed.
Abstract translation: 目的：提供一种制造印刷电路板的方法，通过使用载体薄膜来执行各种处理，从而防止由异物引起的损害。 构成：制备基底（100）。 载体薄膜（130）形成在基底基板的上侧和下侧。 层叠载体薄膜。 形成基底基板。 去除载体薄膜。
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公开(公告)号：KR100920825B1
公开(公告)日：2009-10-08
申请号：KR1020070124563
申请日：2007-12-03
Applicant: 삼성전기주식회사
IPC: H05K3/46
Abstract: 경연성 인쇄회로기판 제조방법이 개시된다. 상기 제조방법은, 제1 회로패턴 및 제3 회로패턴이 형성되는 경성(rigid) 영역과, 패드 및 제2 회로패턴이 형성되는 연성(flexible) 영역으로 구분되는 경연성 인쇄회로기판을 제조하는 방법으로서, 상면에 패드와 상기 제1 회로패턴 및 상기 제2 회로패턴이 형성된 연성(flexible) 절연층을 제공하는 단계; 상기 제2 회로패턴을 커버하도록 상기 연성 절연층의 상면에 커버레이를 형성하는 단계; 상기 제1 회로패턴을 커버하도록 상기 연성 절연층의 상면에 경성(rigid) 절연층을 적층하는 단계; 상기 패드를 커버하도록, 상기 연성 절연층의 상면에 보호잉크를 도포하는 단계; 상기 패드의 상면 및 상기 경성 절연층의 상면을 모두 커버하도록, 상기 경성 절연층에 금속층을 적층하는 단계; 상기 금속층의 상면에 상기 제3 회로패턴에 상응하는 에칭레지스트를 형성하는 단계; 에칭액을 이용하여 상기 금속층을 선택적으로 제거하는 단계; 및 박리액을 이용하여 상기 에칭레지스트 및 상기 보호잉크를 모두 제거하는 단계를 포함한다.
경연성, 보호잉크, 아크릴-
公开(公告)号：KR1020090057817A
公开(公告)日：2009-06-08
申请号：KR1020070124563
申请日：2007-12-03
Applicant: 삼성전기주식회사
IPC: H05K3/46
CPC classification number: H05K3/4691 , H05K1/111 , H05K3/061 , H05K3/282
Abstract: A manufacturing method of a rigid-flexible printed circuit board is provided to prevent contamination of pad in a manufacturing process by covering the top of the pad with a protection ink and a metal layer. A manufacturing method of a rigid-flexible printed circuit board is comprised of the steps: a ductility insulating layer is prepared(S110); A pad, a first circuit pattern, and a second circuit pattern are formed on the ductility insulating layer; a coverlay is formed on the ductility insulating layer in order to cover the first circuit pattern (S120); a protection ink is spread on the ductility insulating layer in order to cover the pad (S130); A hardness insulating layer is laminated on the ductility insulating layer in order to cover the second circuit pattern (S140); and a metal layer is laminated on the hardness insulating layer to cover the top of the pad and hardness insulating layer(S150).
Abstract translation: 提供刚性柔性印刷电路板的制造方法，以通过用保护油墨和金属层覆盖垫的顶部来防止制造过程中垫的污染。 硬质柔性印刷电路板的制造方法包括以下步骤：制备延展性绝缘层（S110）; 在延展性绝缘层上形成焊盘，第一电路图案和第二电路图案; 为了覆盖第一电路图案，在延展性绝缘层上形成覆盖层（S120）。 保护油墨在延展性绝缘层上铺展以覆盖垫（S130）; 为了覆盖第二电路图案，在延展性绝缘层上层叠硬度绝缘层（S140）。 并且在硬度绝缘层上层叠金属层以覆盖焊盘和硬度绝缘层的顶部（S150）。
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公开(公告)号：KR101363075B1
公开(公告)日：2014-02-14
申请号：KR1020120112195
申请日：2012-10-10
Applicant: 삼성전기주식회사
CPC classification number: H05K3/361 , H05K3/4691 , H05K2201/0715 , H05K2203/068 , Y10T29/49126
Abstract: Provided is a method of manufacturing a rigid-flexible printed circuit board, which comprises: a substrate providing step of providing one pair of rigid substrates and a flexible substrate inserted between the one pair of rigid substrates and having one end extending out of the rigid substrates; a film mounting step of mounting a cover film at the extending portion of the flexible substrate; a jig providing step of providing one pair of compressing jigs which is disposed under the rigid substrates and the flexible substrate, has a protrusion corresponding to stepped portions of the rigid substrates and the flexible substrate to compress the rigid substrates and the flexible substrate and compress the flexible substrate and the mounted cover film; and a pressurizing step of pressurizing the one pair of the compressing jigs.
Abstract translation: 提供一种制造刚性 - 柔性印刷电路板的方法，其包括：提供步骤，提供一对刚性基板和插入在一对刚性基板之间并具有从刚性基板延伸出的一端的柔性基板的基板提供步骤 ; 在柔性基板的延伸部分安装覆盖膜的膜安装步骤; 提供了设置在刚性基板和柔性基板之下的一对压缩夹具的夹具提供步骤，具有对应于刚性基板和柔性基板的阶梯部分的突起，以压缩刚性基板和柔性基板并压缩 柔性基板和安装的覆盖膜; 以及对一对压缩夹具进行加压的加压工序。
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公开(公告)号：KR100815437B1
公开(公告)日：2008-03-20
申请号：KR1020060100454
申请日：2006-10-16
Applicant: 삼성전기주식회사
CPC classification number: H05K1/028 , H05K1/147 , H05K3/386 , H05K3/4691
Abstract: An apparatus and a method for laminating a printed circuit board are provided to improve a laminating correctness and productivity by efficiently improving an examining process of a laminating position and a loading position of a coverlay film. An apparatus for laminating a printed circuit board includes an absorbing unit(10), a first vision unit(20), a transfer unit(30), an attaching unit, a separation jig, and a holder(48). The absorbing unit picks up a coverlay film which is cut with a predetermined size. The first vision unit generates a first signal for aligning a position of the coverlay film by photographing the absorbing unit. The transfer unit transfers the absorbing unit to a position of the printed circuit board. The attaching unit drives the absorbing unit for the coverlayer film to be laminated on the printed circuit board. The separation jig is attached to a release film and separates the coverlay film, which is extracted from a supply roller, from the release film. The holder is closed contacted with the separation jig, and is located to be corresponding to a position of the absorbing unit. The separated coverlay film is installed on the holder.
Abstract translation: 提供一种用于层压印刷电路板的装置和方法，通过有效地改进覆盖层的层压位置和装载位置的检查处理来提高层压正确性和生产率。 一种用于层压印刷电路板的设备包括吸收单元（10），第一视觉单元（20），转印单元（30），附着单元，分离夹具和保持器（48）。 吸收单元拾取以预定尺寸切割的覆盖膜。 第一视觉单元通过拍摄吸收单元产生用于对准覆盖膜的位置的第一信号。 传送单元将吸收单元传送到印刷电路板的位置。 安装单元驱动要层压在印刷电路板上的覆盖层膜的吸收单元。 分离夹具附接到脱模膜并将从供给辊提取的覆盖膜从剥离膜分离。 保持器与分离夹具闭合接触，并且被定位成对应于吸收单元的位置。 分离的覆盖膜安装在支架上。
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