Abstract:
The present invention provides a touchscreen module. The touchscreen module includes a glass substrate; a bezel which includes a first photosensitive resin layer formed on the glass substrate and a second photosensitive resin layer formed on the first photosensitive resin layer; and a transparent electrode which is simultaneously formed on the glass substrate and the bezel. The present invention can prevent the haze phenomenon caused as the pigment particles included in the bezel are left on the surface of the glass substrate after exposure and development.
Abstract:
The present invention provides an insulating epoxy resin composition, an insulating film manufactured therefrom, and a multilayer printed circuit board including the same. More specifically, the present invention relates to an insulating epoxy resin composition including a liquid crystal oligomer which decrease dielectric coefficient and thermal expansion coefficient of a build-up type multilayer printed circuit board, an insulating film manufactured by using the resin composition, and a multilayer printed circuit board which forms a multilayer by insulating the internal circuit formed of copper by using the insulating film.
Abstract:
The present invention includes a transparent substrate which is partitioned into an active area and an inactive area which is the border of the active area; an electrode formed on a surface of the transparent substrate; and a bezel formed in the inactive area on the surface of the transparent substrate. The bezel is made of a bezel composition including a pigment and silane.
Abstract:
The present invention relates to a touch screen panel. The touch screen panel according to the embodiment of the present invention includes: a transparent substrate which includes a first region with first surface illumination and a second region with second surface illumination; and an ink layer which is formed on the second region. The second surface illumination is higher than the first surface illumination.
Abstract:
The present invention relates to an interlayer insulation composition for a multilayer printed circuit board comprising: an epoxy-based resin including a naphthalene deformation epoxy resin, a cresol novolac epoxy resin and a rubber deformation epoxy resin; a thermoplastic resin; a curing agent; a hardening accelerator; and an inorganic filler, and a multilayer printed circuit board comprising the same as an insulation layer. The present invention is able to provide an insulation composition which exhibits excellent adhesive strength of an insulation layer and a Cu layer in order to secure reliability and operate a final board normally. Additionally, the present invention is able to secure the reliability of the board, even when the content of the inorganic filer is increased, by maintaining a low coefficient of thermal expansion by including appropriate amounts of epoxy resins and thermoplastic resins and increasing toughness of an insulation film without brittleness. [Reference numerals] (AA) Exfoliation (mm/mm); (BB) Example 2; (CC) Comparative example 2
Abstract:
본 발명은 터치센서에 관한 것으로서, 윈도우 기판과 윈도우 기판의 테두리를 따라 형성되는 베젤과 베젤과 베젤사이를 충진하면서 적층되고, 윈도우 기판상에 형성되는 제1 절연층과 상기 베젤과 제1 절연층 상에 도포 및 접착하여 형성되는 제2 절연층 및 제2 절연층 상에 형성되는 전극패턴을 포함하는 터치센서를 제공한다.
Abstract:
The present inventions relates to an insulating resin composition for a printed circuit board which comprises epoxy resin; a first inorganic filler having low coefficient of thermal expansion; a second inorganic filler having low dielectric loss rate; and a hardening agent, wherein the entire inorganic filler which include the first and second inorganic fillers makes up 50-80 wt% of the overall composition, and to a prepreg and a printed circuit board using the same.