公开(公告)号：KR1020110049247A

公开(公告)日：2011-05-12

申请号：KR1020090106175

申请日：2009-11-04

Applicant: 삼성전기주식회사

Inventor： 하마자키,마사시 ,  양덕진 ,  이동환 ,  김봉수 ,  전일균 ,  김광윤

IPC: H05K3/46

CPC classification number: H05K3/4069 ,  H05K1/0268 ,  H05K1/0269 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/092 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2203/0207 ,  Y10T29/49165

Abstract: PURPOSE: A printed circuit board and a method for manufacturing the same are provided to increase the operational yield by simplifying a multi layers connected structure forming process. CONSTITUTION: A base substrate includes a circuit layer. The circuit layer is in connection with a first via. The first via passes through an insulating layer. A build-up layer(120) is stacked on the base substrate. An interlayer connection material includes at least part of the first via. The interlayer connection material includes a via-hole(160). The via-hole passes through the build-up layer. The interlayer connection material is a conductive layer or a conductive paste.

Abstract translation: 目的：提供印刷电路板及其制造方法，以通过简化多层连接结构形成工艺来提高操作成品率。 构成：基底包括电路层。 电路层与第一通孔相连。 第一通孔通过绝缘层。 堆积层（120）堆叠在基底基板上。 层间连接材料包括第一通孔的至少一部分。 层间连接材料包括通孔（160）。 通孔穿过积层。 层间连接材料是导电层或导电膏。