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公开(公告)号：KR1020070113404A
公开(公告)日：2007-11-29
申请号：KR1020060046208
申请日：2006-05-23
Applicant: 삼성전기주식회사
CPC classification number: H05K3/0044 , H05K1/115 , H05K3/108 , H05K3/42
Abstract: A printed circuit board and a manufacturing method thereof are provided to improve the flexural rigidity of the printed circuit board by using a reinforcing material in a core layer of the printed circuit board. A manufacturing method of a printed circuit board includes the steps of: forming a through hole by perforating a reinforcing substrate(S11) with a mechanical method; filling the through hole with an insulating material by laminating the insulating material on both sides of the reinforcing substrate(S12); perforating a via hole which penetrates the insulating material and the through hole in correspondence to the corresponding location to the through hole(S13); and plating the inner peripheral surface of the via hole, and forming a circuit pattern on the surface of the insulating material(S14).
Abstract translation: 提供一种印刷电路板及其制造方法，以通过在印刷电路板的芯层中使用增强材料来提高印刷电路板的抗弯刚度。 印刷电路板的制造方法包括以下机械方法对增强基板（S11）进行穿孔而形成贯通孔的工序; 通过在加强基板的两侧层叠绝缘材料，用绝缘材料填充通孔（S12）; 对应于通孔的对应位置穿透贯穿绝缘材料和通孔的通孔（S13）; 并对通孔的内周面进行电镀，在绝缘材料的表面形成电路图案（S14）。
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公开(公告)号：KR1020100045659A
公开(公告)日：2010-05-04
申请号：KR1020080104700
申请日：2008-10-24
Applicant: 삼성전기주식회사
IPC: B23B39/08
Abstract: PURPOSE: A drilling machine with computer numerical control is provided to precisely control a depth for a hole boring process for an interconnection by removing an error risk of the deviation of an insulation distance. CONSTITUTION: A drilling machine with computer numerical control comprises: a work table(110) which a workpiece(120) is place on; a drilling unit(131,132,133) which drills hole in the workpiece; a supporting unit(100) which supports the drilling unit and moves the drilling unit between a working position and a ready position; an ultrasonic sensor unit(140) which measures the distance from a surface of the workpiece to an internal layers; and a computer numerical control part which controls the entire operation.
Abstract translation: 目的：提供一种具有计算机数字控制的钻孔机，通过消除绝缘距离偏差的误差风险，精确控制互连孔钻孔深度。 构成：具有计算机数字控制的钻孔机包括：放置工件（120）的工作台（110）; 钻孔单元（131,132,133），其在工件中钻孔; 支撑单元（100），其支撑所述钻井单元并且使所述钻井单元在工作位置和就绪位置之间移动; 超声波传感器单元，其测量从工件的表面到内层的距离; 以及控制整个操作的计算机数字控制部分。
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公开(公告)号：KR1020060030298A
公开(公告)日：2006-04-10
申请号：KR1020040079120
申请日：2004-10-05
Applicant: 삼성전기주식회사
IPC: H05K13/08
Abstract: 본 발명은 초음파를 이용한 인쇄회로기판의 외관을 검사하는 방법에 관한 것이다. 본 발명에 따른 인쇄회로기판 검사 방법은, 회로 패턴이 형성된 인쇄회로기판에 초음파를 주사하는 단계; 상기 초음파의 반사파를 수신하는 단계; 상기 초음파의 반사파의 도달 시간으로부터 상기 회로 패턴의 두께를 측정하는 단계; 및 상기 측정치를 기준 데이터와 비교하여 불량을 검출하는 단계를 포함하는 것을 특징으로 한다.
인쇄회로기판, PCB, 검사, 딤플, 비아홀-
公开(公告)号：KR100651561B1
公开(公告)日：2006-11-29
申请号：KR1020050058046
申请日：2005-06-30
Applicant: 삼성전기주식회사
IPC: H05K3/00
Abstract: A method for processing a via hole using a laser beam is provided to increase productivity by processing a number of via holes collectively. A base substrate with a revealed insulation layer corresponding to a via hole pattern part is formed(S100). A via hole is formed by scanning a laser beam with an equal width to the width of the base substrate along the length direction on the base substrate(S200). The laser beam is a multi-beam where an outer part of each single beam is overlapped, in order to obtain uniform energy density over the whole width of the laser beam.
Abstract translation: 提供了一种使用激光束加工通孔的方法，以通过共同处理多个通孔来提高生产率。 形成具有对应于通孔图案部分的暴露的绝缘层的基底基板（S100）。 通过在基底基板上沿着长度方向扫描与基底基板的宽度相等的宽度的激光束来形成通孔（S200）。 激光束是多光束，其中每个单光束的外部部分重叠，以便在激光束的整个宽度上获得均匀的能量密度。
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公开(公告)号：KR101044186B1
公开(公告)日：2011-06-28
申请号：KR1020080104700
申请日：2008-10-24
Applicant: 삼성전기주식회사
IPC: B23B39/08
Abstract: 본 발명은 컴퓨터 수치 제어 드릴 장치에 관한 것으로서, 홀 가공을 필요로 하는 부재가 놓이는 작업대와, 상기 작업대 상에 놓인 부재에 홀을 가공하는 드릴링 수단과, 상기 드릴링 수단을 지지하며 상기 드릴링 수단을 작업 위치와 작업 준비 위치 사이로 이동시키는 지지 수단과, 상기 드릴링 수단의 일측에 장착되어 상기 부재 표면으로부터 부재의 내부 구성 층들의 거리를 측정하는 초음파 센서부와, 전체 작동을 제어하는 컴퓨터 수치 제어부를 포함한다. 본 발명에 따른 컴퓨터 수치 제어 드릴 장치는 특히 다층 인쇄회로기판의 비아홀 가공 시 가공 깊이 두께 조절이 용이한 이점이 있다.
컴퓨터 수치 제어, 드릴 장치, 인쇄회로기판, 초음파 센서부-
Patent Agency Ranking
公开(公告)号：KR1020110049247A
公开(公告)日：2011-05-12
申请号：KR1020090106175
申请日：2009-11-04
Applicant: 삼성전기주식회사
IPC: H05K3/46
CPC classification number: H05K3/4069 , H05K1/0268 , H05K1/0269 , H05K3/0047 , H05K3/429 , H05K3/4644 , H05K2201/092 , H05K2201/09518 , H05K2201/096 , H05K2201/09781 , H05K2201/09827 , H05K2203/0207 , Y10T29/49165
Abstract: PURPOSE: A printed circuit board and a method for manufacturing the same are provided to increase the operational yield by simplifying a multi layers connected structure forming process. CONSTITUTION: A base substrate includes a circuit layer. The circuit layer is in connection with a first via. The first via passes through an insulating layer. A build-up layer(120) is stacked on the base substrate. An interlayer connection material includes at least part of the first via. The interlayer connection material includes a via-hole(160). The via-hole passes through the build-up layer. The interlayer connection material is a conductive layer or a conductive paste.
Abstract translation: 目的：提供印刷电路板及其制造方法，以通过简化多层连接结构形成工艺来提高操作成品率。 构成：基底包括电路层。 电路层与第一通孔相连。 第一通孔通过绝缘层。 堆积层（120）堆叠在基底基板上。 层间连接材料包括第一通孔的至少一部分。 层间连接材料包括通孔（160）。 通孔穿过积层。 层间连接材料是导电层或导电膏。
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公开(公告)号：KR1020100081838A
公开(公告)日：2010-07-15
申请号：KR1020090001253
申请日：2009-01-07
Applicant: 삼성전기주식회사
IPC: H05K1/02
Abstract: PURPOSE: An impedance coupon manufacturing method is provided to reduce manufacturing costs and read time of a printed circuit board by forming a micro via hole so that the circuit of an inner layer substrate and the circuit of an outer layer substrate are connected with a stack form every a pressing process. CONSTITUTION: A circuit pattern is formed in an inner layer substrate(S110). An impedance of the inner layer substrate is measured to determine whether the inner layer substrate has a defect(S120). A corresponding inner layer substrate is disused when the impedance of the inner layer substrate is determined as fault. An outer layer substrate where a circuit pattern is formed is formed in order to be connected to the circuit pattern of the inner layer substrate when the substrate has no defect(S130). The impedance of the inner layer substrate and the outer layer substrate are measured at after forming the outer layer substrate(S150).
Abstract translation: 目的：提供阻抗优惠券制造方法，通过形成微通孔来降低印刷电路板的制造成本和读取时间，使得内层基板的电路和外层基板的电路以堆叠形式连接 每一个紧迫的过程。 构成：在内层基板中形成电路图案（S110）。 测量内层基板的阻抗，以确定内层基板是否具有缺陷（S120）。 当内层衬底的阻抗确定为故障时，相应的内层衬底被废弃。 当衬底没有缺陷时，形成电路图案形成的外层衬底以便连接到内层衬底的电路图案（S130）。 在形成外层基板之后测量内层基板和外层基板的阻抗（S150）。
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公开(公告)号：KR100783459B1
公开(公告)日：2007-12-07
申请号：KR1020060046208
申请日：2006-05-23
Applicant: 삼성전기주식회사
Abstract: 인쇄회로기판 및 그 제조 방법이 개시된다. (a) 보강기판의 소정의 위치에 드릴, 레이져 및 워터젯 장치로 이루어진 군으로부터 선택된 하나를 이용하여 관통홀을 천공하는 단계, (b) 상기 보강기판의 양면에 절연재를 적층하여 상기 관통홀을 상기 절연재로 충전시키는 단계, (c) 상기 관통홀보다 작은 크기로 상기 관통홀의 내부를 관통하는 비아홀을 형성하는 단계, 및 (d) 상기 비아홀의 내주면을 도금하고, 상기 절연재의 표면에 회로 패턴을 형성하는 단계를 포함하는 인쇄회로기판 제조 방법은 금속성의 보강기판에 관통홀을 쉽게 천공할 수 있는 인쇄회로기판 제조 방법을 제공하고자 한다.
고압수 분사, 보강기판, 워터 젯 장치, 관통홀, 비아홀-
公开(公告)号：KR100757907B1
公开(公告)日：2007-09-11
申请号：KR1020060063634
申请日：2006-07-06
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4641 , H05K1/0206 , H05K1/0207 , H05K1/056 , H05K3/4069 , H05K3/4608 , H05K3/4614 , H05K3/4647 , H05K2201/0355 , H05K2201/09554 , H05K2201/096 , H05K2203/1189 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
Abstract: A PCB(Printed Circuit Board) and a method for manufacturing the same are provided to offer high radiative effect and bending stiffness by forming an inner layer or a ground layer with aluminum. A PCB includes an insulating substrate(50) and a radiative layer(40). The insulating substrate(50) has an insulating layer(30), a circuit pattern(15), and an interlayer conductive unit. The circuit pattern(15) is formed on one surface of the insulating layer(30). The interlayer conductive unit is coupled with the insulating layer(30) by penetrating the insulating layer(30) to be electrically connected to the circuit pattern(15). The radiative layer(40) is laminated on the other surface of the insulating layer(30). The interlayer conductive unit is a paste bump(20) hardened by being coupled with the circuit pattern(15). A plurality of insulating substrates(50) are laminated sequentially. The radiative layer(40) is laminated to be interposed between the insulating substrates(50).
Abstract translation: 提供PCB（印刷电路板）及其制造方法，通过用铝形成内层或接地层来提供高辐射效果和弯曲刚度。 PCB包括绝缘基板（50）和辐射层（40）。 绝缘基板（50）具有绝缘层（30），电路图案（15）和层间导电单元。 电路图案（15）形成在绝缘层（30）的一个表面上。 层间导电单元通过穿透绝缘层（30）与绝缘层（30）耦合以电连接到电路图案（15）。 辐射层（40）层叠在绝缘层（30）的另一个表面上。 层间导电单元是通过与电路图案（15）耦合而硬化的糊状凸块（20）。 依次层叠多个绝缘基板（50）。 辐射层（40）层叠以插入在绝缘基板（50）之间。
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公开(公告)号：KR100674321B1
公开(公告)日：2007-01-24
申请号：KR1020050081737
申请日：2005-09-02
Applicant: 삼성전기주식회사
IPC: H05K7/20
CPC classification number: H05K3/445 , H05K1/0206 , H05K1/056 , H05K3/4602 , H05K3/4644
Abstract: A PCB with enhanced radiating ability and a manufacturing method thereof are provided to realize a light, thin, and small PCB by not using a conventional CCL(Copper Clad Laminate) material. A manufacturing method of a PCB with enhanced radiating ability includes the steps of: forming surface roughness in an aluminum core; forming an etching resist pattern in the aluminum core; forming a circuit pattern in the aluminum core by etching the aluminum core according to the etching resist pattern; laminating an insulation layer(206) and an additional circuit layer on the aluminum core; forming a via hole(208) penetrating the insulation layer(206), the additional circuit layer, and the aluminum core; and forming a circuit pattern in the additional circuit layer.
Abstract translation: 提供具有增强的辐射能力的PCB及其制造方法，以通过不使用常规的CCL（铜包层压材料）材料来实现轻薄的和小的PCB。 具有增强的辐射能力的PCB的制造方法包括以下步骤：在铝芯中形成表面粗糙度; 在铝芯中形成蚀刻抗蚀剂图案; 通过根据蚀刻抗蚀剂图案蚀刻铝芯而在铝芯中形成电路图案; 在铝芯上层叠绝缘层（206）和附加电路层; 形成穿过绝缘层（206），附加电路层和铝芯的通孔（208）; 以及在所述附加电路层中形成电路图案。
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