公开(公告)号：KR1020050026764A

公开(公告)日：2005-03-16

申请号：KR1020030062886

申请日：2003-09-09

Applicant: 삼성전자주식회사

Inventor： 한오연 ,  강연철 ,  배도인

IPC: H01L21/22

Abstract: A method of manufacturing a boat of a vertical diffusion furnace is provided to prevent particles from being generated on a wafer by removing previously convexoconcave type contaminant structure from a slot using a hydrogen torch. A flange and a rod are attached to each other by performing welding using a hydrogen gas(203). Residual stress and contaminants are removed from the welded portion(204). A first bonding process is performed on the resultant structure by using a molten wax(205). A slot for loading a wafer is formed by machining the resultant structure(206). A second bonding process is performed on the slot portion by using the molten wax(207). A convexoconcave type contaminant structure is removed from a surface of the slot by using a hydrogen torch(209). A heat treatment and a cleaning process are performed thereon(210).

Abstract translation: 提供一种制造垂直扩散炉的船的方法，以通过使用氢炬从槽中除去先前的凹凸型污染物结构来防止颗粒在晶片上产生。 通过使用氢气（203）进行焊接，法兰和杆彼此连接。 从焊接部分（204）去除残余应力和污染物。 通过使用熔融蜡（205）对所得结构进行第一粘合工艺。 通过加工所得到的结构（206）形成用于加载晶片的槽。 通过使用熔融蜡（207）在槽部上进行第二粘合处理。 通过使用氢炬（209）从槽的表面去除凹凸型污染物结构。 在其上进行热处理和清洁处理（210）。

公开(公告)号：KR1020080023940A

公开(公告)日：2008-03-17

申请号：KR1020060088104

申请日：2006-09-12

Applicant: 삼성전자주식회사

Inventor： 박유춘 ,  양윤식 ,  이혁재 ,  윤수한 ,  강연철

IPC: H01L21/02 ,  H01L21/00

Abstract: A gas piping and semiconductor manufacturing equipment having the same are provided to guide particles that move along with gases to be discharged to the outside without depositing inside a bellows by installing a shield in a direction where gas flows. A gas piping(116) comprises a first piping body(121), a second piping body(126), a bellows(122), and a shield(127). The first piping body has a predetermined size of inner diameter(D). The second piping body is spaced away from one end of the first piping body, in a direction where gas flows. The flexible bellows connect one end of the first piping body to second the piping body. The shield is disposed inside the bellows to cover the inside of the bellows, extending from one end of the first piping body to the second piping body, wherein an inner diameter(D') of the shield matches the size of the inner diameter of the first piping body. The shield is made of metal, and is welded to one end of the first piping body.

Abstract translation: 提供具有该气体管道和半导体制造设备的气体管道和半导体制造设备以通过沿气体流动的方向安装屏蔽来引导与待排放的气体一起移动的颗粒到外部而不沉积在波纹管内。 气体管道（116）包括第一管道主体（121），第二管道主体（126），波纹管（122）和屏蔽件（127）。 第一管体具有预定尺寸的内径（D）。 第二管道主体沿着气体流动的方向与第一管道主体的一端间隔开。 柔性波纹管将第一管道主体的一端连接到管道主体的另一端。 屏蔽件设置在波纹管内部以覆盖波纹管的内部，其从第一管道主体的一端延伸到第二管道主体，其中护罩的内径（D'）与内径的尺寸匹配 第一管道体。 屏蔽由金属制成，并焊接在第一管道主体的一端。

公开(公告)号：KR1020070106257A

公开(公告)日：2007-11-01

申请号：KR1020060038908

申请日：2006-04-28

Applicant: 삼성전자주식회사

Inventor： 박유춘 ,  배도인 ,  이태원 ,  현기철 ,  강연철 ,  이진경

IPC: H01L21/02 ,  H01L21/205

Abstract: An O-ring and a sealing device using the same are provided to prevent or minimize local damage of the O-ring due to incomplete installation thereof by inserting the O-ring in a gland in a perfect state. An O-ring includes a body(12) having a circular cross section and plural flanges(14 to 17) protruding from the body. The flanges are arranged at regular intervals, and have a rectangular cross section protruding from one or both sides of the body, respectively. A first indication line extends straightly in a longitudinal direction of the body, and a second indication line intersects a width of the body.

Abstract translation: 提供O形圈和使用其的密封装置，以通过将O形环插入到完全状态的压盖中来防止或最小化由于其不完全安装而导致的O形环的局部损坏。 O形环包括具有圆形横截面的主体（12）和从主体突出的多个凸缘（14至17）。 凸缘以规则的间隔布置，并且具有分别从主体的一侧或两侧突出的矩形横截面。 第一指示线在身体的纵向方向上直线延伸，并且第二指示线与身体的宽度相交。

公开(公告)号：KR1020040102308A

公开(公告)日：2004-12-04

申请号：KR1020030033857

申请日：2003-05-27

Applicant: 삼성전자주식회사

Inventor： 조정훈 ,  배도인 ,  유승진 ,  강연철

IPC: H01L21/20

Abstract: PURPOSE: A deposition apparatus for manufacturing a semiconductor device is provided to prevent the damage of a heater and to restrain the arcing of a connection member due to contact failure by connecting the connection member with the heater using screws. CONSTITUTION: A deposition apparatus includes a chamber, a susceptor for loading a wafer, a heater, an insulating ring, and a connection member. The heater(204b) are installed under the susceptor to heat the wafer. The insulating ring is fixed in the chamber to support the heater. A cavity is formed in the insulating ring. The connection member is prolonged from the outside of the chamber into the cavity of the insulating ring. The connection member is used for connecting a power source to the heater. The connection member includes a first connecting part, a second connecting part, and a third connection part. The first connecting part(224) includes a first plate and a second plate. The first plate is connected with the heater by using a first screw(230a). The second plate is connected with the second connecting part(226) by using a second screw(230b). The second connecting part is connected parallel with the third connecting part(228).

Abstract translation: 目的：提供一种用于制造半导体器件的沉积设备，以防止加热器的损坏，并且通过使用螺钉将连接构件与加热器连接来防止由于接触故障导致的连接构件的电弧。 构成：沉积设备包括室，用于装载晶片的基座，加热器，绝缘环和连接构件。 加热器（204b）安装在基座下方以加热晶片。 绝缘环固定在腔室中以支撑加热器。 在绝缘环中形成空腔。 连接构件从室的外部延伸到绝缘环的空腔中。 连接构件用于将电源连接到加热器。 连接构件包括第一连接部分，第二连接部分和第三连接部分。 第一连接部分（224）包括第一板和第二板。 第一板通过使用第一螺钉（230a）与加热器连接。 第二板通过使用第二螺钉（230b）与第二连接部件（226）连接。 第二连接部与第三连接部（228）平行地连接。