公开(公告)号：KR1020080020752A

公开(公告)日：2008-03-06

申请号：KR1020060083993

申请日：2006-09-01

Applicant: 삼성전자주식회사

Inventor： 부재필 ,  강종묵 ,  김강인 ,  김익주 ,  성정환

IPC: B24B37/015 ,  B24B37/04 ,  H01L21/304

CPC classification number: B24B37/04 ,  B24B55/02 ,  B24B55/04

Abstract: A chemical mechanical polishing apparatus is provided to prevent a polishing pad from overheating by using a platen over through which coolant circulates. A chemical mechanical polishing apparatus comprises a head assembly, a platen(700), a polishing pad(800), and a platen cover(300). The head assembly is configured to suck a semiconductor substrate and rotate. The platen is configured to support the semiconductor substrate, located in opposite to the head assembly. The polishing pad surrounds the outer surface of the platen contacting to the semiconductor substrate and polishes the surface of the semiconductor substrate. The platen cover is configured to cover the platen having the polishing pad and circulates coolant which prevents the polishing pad from overheating by cooling heat caused by friction between the polishing pad and the semiconductor substrate. The platen cover includes a middle cover or a platen protection cover. The middle cover surrounds the periphery of the platen cover. The platen protection cover surrounds the top of the platen.

Abstract translation: 提供化学机械抛光装置，以通过使用冷却剂循环的压板来防止抛光垫过热。 化学机械抛光装置包括头组件，压板（700），抛光垫（800）和压板盖（300）。 头部组件被配置为吸收半导体衬底并旋转。 压板被配置为支撑位于与头部组件相对的半导体衬底。 抛光垫围绕与半导体衬底接触的压板的外表面并抛光半导体衬底的表面。 压板盖构造成覆盖具有抛光垫的压板并循环冷却剂，其通过由抛光垫和半导体衬底之间的摩擦引起的散热而防止抛光垫过热。 压板盖包括中间盖或压板保护盖。 中间盖围绕压板盖的周边。 压板保护盖围绕压板的顶部。

公开(公告)号：KR1020030031790A

公开(公告)日：2003-04-23

申请号：KR1020010063672

申请日：2001-10-16

Applicant: 삼성전자주식회사

Inventor： 강종묵

IPC: H01L21/304

Abstract: PURPOSE: A cleaning apparatus of CMP(Chemical Mechanical Polishing) equipment is provided to prevent a process error due to an incorrect loading condition of a wafer by using a photo sensor to sense the loading condition of the wafer. CONSTITUTION: A cleaning portion cleans a wafer by using the chemical solution. A spin portion(48) performs a rinsing process and a drying process for the cleaned wafer. A carriage(50) is used for transferring a wafer from the cleaning portion to the spin portion. A sensing portion senses a condition of the wafer loaded on a loading position of the spin portion. The sensing portion is formed with the first to the third sensors(72,74,76). The first sensor(72) is used for sensing a loading condition or an unloading condition of the wafer. The second sensor(74) is used for sensing the wafer separated to an upper portion of the loading position. The third sensor(76) is used for sensing the wafer separated to a lower portion of the loading position.

Abstract translation: 目的：提供CMP（化学机械抛光）设备的清洁装置，以通过使用光传感器来感测晶片的负载状况来防止由于晶片的不正确的加载状态引起的过程误差。 构成：清洁部分使用化学溶液清洗晶片。 旋转部分（48）对清洁的晶片进行漂洗处理和干燥处理。 托架（50）用于将晶片从清洁部分转移到旋转部分。 感测部分感测加载在旋转部分的装载位置上的晶片的状态。 感测部分形成有第一至第三传感器（72,74,76）。 第一传感器（72）用于感测晶片的装载状态或卸载状态。 第二传感器（74）用于感测分离到装载位置的上部的晶片。 第三传感器（76）用于感测分离到装载位置的下部的晶片。

公开(公告)号：KR1020030028881A

公开(公告)日：2003-04-11

申请号：KR1020010061159

申请日：2001-10-04

Applicant: 삼성전자주식회사

Inventor： 강종묵

IPC: H01L21/304

Abstract: PURPOSE: A filtering basket of CMP of a semiconductor is provided to discharge contaminants smoothly by using a filter made up of a plastic against deformation and making it longer. CONSTITUTION: A variety of particles and contaminated slurry left on a wafer surface during CMP are cleared away by DI water to be discharged through a drain line, connected to a filter(10) on its end. The filter is made up of a plastic against deformation to preserve the original shape when pulling it out or setting it in and lengthened to make internal space of it larger so as to prevent the back stream of fume and clogging caused by contaminants.

Abstract translation: 目的：提供半导体CMP的滤篮，通过使用由塑料制成的过滤器，防止变形而使污染物顺利排放，并使其更长。 构成：在CMP期间残留在晶片表面上的各种颗粒和污染的浆料被去离子水清除，以通过排放管排出，连接到其末端的过滤器（10）。 过滤器由塑料制成，防止变形，以保持其原始形状，将其拉出或放入并延长，使其内部空间更大，以防止烟气回流和污染物引起的堵塞。

公开(公告)号：KR1020020013126A

公开(公告)日：2002-02-20

申请号：KR1020000046566

申请日：2000-08-11

Applicant: 삼성전자주식회사

Inventor： 강종묵

IPC: H01L21/304

Abstract: PURPOSE: An apparatus for preventing damage to a semiconductor wafer in polishing the semiconductor wafer is provided to prevent the semiconductor wafer from being damaged by a wafer slip, by using an optical sensor to detect whether a retain ring is absorbed to a polishing pad in polishing the wafer and by preventing the wafer from proceeding to a polishing step 2 if the retain ring is not closely attached to the polishing pad. CONSTITUTION: The polishing pad(14) polishes the wafer. A titan head(10) vacuum-absorbs the polishing pad. The retain ring(12) prevents the wafer slip, installed under the titan head. An optical sensor bracket(18) is installed in a predetermined position of a loss sensor cover(16). An optical sensor(20) detects the absorption state of the polishing pad, fixedly installed in the optical sensor bracket. A control unit(22) receives a detection signal of the absorption state from the optical sensor, and stops the operation of the polishing head when the retain ring is not absorbed to the polishing pad.

Abstract translation: 目的：提供一种用于防止在半导体晶片的研磨中损坏半导体晶片的装置，以防止半导体晶片被晶片滑移损坏，通过使用光学传感器来检测保持环是否被抛光抛光垫吸收 并且如果保持环未紧密地附着在抛光垫上，则通过防止晶片进入抛光步骤2。 构成：抛光垫（14）抛光晶片。 泰坦头（10）真空吸收抛光垫。 保持环（12）防止晶片滑动，安装在泰坦头下。 光学传感器支架（18）安装在损失传感器盖（16）的预定位置。 光学传感器（20）检测固定安装在光学传感器支架中的抛光垫的吸收状态。 控制单元（22）从光学传感器接收吸收状态的检测信号，并且当保持环未被吸收到抛光垫时停止抛光头的操作。

公开(公告)号：KR1020030084035A

公开(公告)日：2003-11-01

申请号：KR1020020022509

申请日：2002-04-24

Applicant: 삼성전자주식회사

Inventor： 강종묵

IPC: H01L21/304

Abstract: PURPOSE: A substrate processing robot of a chemical mechanical polishing apparatus is provided to prevent damage to a motor and a worm gear and prevent a wafer from being broken when the wafer exists on a blade by preventing the motor and an axis from being damaged by drop of motor for vertically transferring a supporting arm. CONSTITUTION: A track(154) is installed along a substrate transfer path. A carriage transfers along the track. The motor is installed in the carriage, including the axis. The supporting arm(156) is capable of vertically transferring along the axis, including a joint unit. A unit for preventing the motor from being dropped is further installed.

Abstract translation: 目的：提供化学机械抛光装置的基板处理机器人，以防止电机和蜗轮的损坏，并且通过防止电机和轴被损坏而使晶片存在于刀片上时防止晶片破裂 用于垂直传送支撑臂的电机。 构成：轨道（154）沿着基板传送路径安装。 一条马车沿着轨道转移。 电机安装在滑架上，包括轴。 支撑臂（156）能够沿轴线垂直传递，包括接头单元。 进一步安装用于防止电机掉落的单元。

公开(公告)号：KR1020030056674A

公开(公告)日：2003-07-04

申请号：KR1020010086952

申请日：2001-12-28

Applicant: 삼성전자주식회사

Inventor： 강종묵

IPC: H01L21/304

Abstract: PURPOSE: A cleaning apparatus of a polishing equipment is provided to be capable of preventing the contamination due to wafer scratch and particles by installing an additional nozzle for removing the slurry and foreign substance fixed between a membrane and a retaining ring. CONSTITUTION: A wafer(W) is transferred at the upper portion of a pedestal(10) by using a polishing head(20). Then, the wafer is cleaned by jetting deionized water at the high pressure using a plurality of nozzles(12) formed at the pedestal. A plurality of rinse jets(13) are installed at the peripheral portion of the pedestal for jetting the deionized water toward the gap(G) formed between a membrane(21) and a retaining ring(22). Preferably, the rinse jet is prolonged from the peripheral portion of the pedestal.

Abstract translation: 目的：提供一种抛光设备的清洁装置，以能够通过安装用于除去固定在膜和保持环之间的浆料和异物的附加喷嘴来防止由于晶片刮擦而造成的污染。 构成：通过使用抛光头（20）将晶片（W）转移到基座（10）的上部。 然后，使用形成在基座上的多个喷嘴（12），通过高压喷射去离子水来清洁晶片。 多个冲洗喷嘴（13）安装在基座的周边部分，用于向形成在隔膜（21）和保持环（22）之间的间隙（G）喷射去离子水。 优选地，冲洗射流从基座的周边部分延长。

公开(公告)号：KR1020030030168A

公开(公告)日：2003-04-18

申请号：KR1020010061998

申请日：2001-10-09

Applicant: 삼성전자주식회사

Inventor： 강종묵

IPC: H01L21/304

Abstract: PURPOSE: Chemical mechanical polishing equipment for a semiconductor wafer is provided to reduce damage to the polishing pad by continuously monitoring the rotational condition of the wafer or the conditioner contacting the polishing pad. CONSTITUTION: A rotatable table is provided with a polishing pad at its top. A driving unit moves a robot arm(16) parallel to the table, and rotates the rotation shaft(26) rotatably installed at the robot arm(16). Sensors are installed at a predetermined area of the rotation shaft(26), and the robot arm(16) to sense the rotation of the rotation shaft(26). A controller receives signals from the sensor, and controls the rotation of the table and the driving of a driving unit.

Abstract translation: 目的：提供用于半导体晶片的化学机械抛光设备，以通过连续监测接触抛光垫的晶片或调节器的旋转状态来减少对抛光垫的损伤。 构成：旋转台在其顶部设有抛光垫。 驱动单元使平行于工作台的机械臂（16）移动，并且旋转地安装在机器人手臂（16）上的旋转轴（26）旋转。 传感器安装在旋转轴（26）的预定区域，机器人臂（16）感测旋转轴（26）的旋转。 控制器从传感器接收信号，并控制工作台的旋转和驱动单元的驱动。

公开(公告)号：KR1020000020877A

公开(公告)日：2000-04-15

申请号：KR1019980039668

申请日：1998-09-24

Applicant: 삼성전자주식회사

Inventor： 박철규 ,  강종묵

IPC: H01L21/304

Abstract: PURPOSE: A semiconductor wafer polishing apparatus is provided to minimize a damage due to a separation of wafer in transferring and carrying a wafer. CONSTITUTION: A polishing head(10) is provided to move along a certain orbit. A polishingpad driving unit(20) is disposed at upper portion of the polishing head and has a polishing pad(21) adhered to the bottom thereof. The polishing head is provided with a supporting plate for supporting a wafer at the inside of the upper portion thereof. A pair of rising pins pass through symmetrically the edge of the supporting plate and then are haunted by a predetermined driving source. A moving pivot is formed at the bottom of a polishing housing and moves along a certain orbit. Thereby, a damage due to a separation of wafer is minimized in transferring and carrying a wafer.

Abstract translation: 目的：提供一种半导体晶片抛光装置，以最小化由于晶片在转移和携带晶片时分离造成的损坏。 构成：提供抛光头（10）以沿某一轨道移动。 抛光板驱动单元（20）设置在抛光头的上部，并且具有粘附到其底部的抛光垫（21）。 抛光头设置有用于在其上部内侧支撑晶片的支撑板。 一对上升销对称地穿过支撑板的边缘，然后被预定的驱动源困扰。 移动的枢轴形成在抛光壳体的底部并且沿着某个轨道移动。 因此，在转移和携带晶片时，由于晶片分离造成的损坏被最小化。

公开(公告)号：KR1020050024634A

公开(公告)日：2005-03-11

申请号：KR1020030060698

申请日：2003-09-01

Applicant: 삼성전자주식회사

Inventor： 강종묵

IPC: H01L21/304

Abstract: PURPOSE: A CMP apparatus is provided to prevent damage of other wafers due to pieces and particles of a broken wafer in wafer polishing process by blocking the movement of the particles of the broken wafer. CONSTITUTION: A CMP apparatus includes an HCLU(Head Cup Loading Unloading) part(10) as a loading/unloading location of a wafer, a plurality of pads(20), and a plurality of polishing heads(40) located at upper parts of the HCLU part and the pads. A plurality of isolation parts are formed between the HCLU and the pads. The isolation parts are elevated by a driving device. The isolation parts are formed with barrier members of vertical flat plates.

Abstract translation: 目的：提供一种CMP装置，用于通过阻止破碎的晶片的颗粒的运动来防止由于晶片抛光过程中的破碎的晶片的碎片和颗粒而导致的其它晶片损坏。 构造：CMP装置包括作为晶片的装载/卸载位置的HCLU（头杯装载卸载）部件，多个焊盘（20）和位于下部的多个抛光头（40） HCLU部件和焊盘。 在HCLU和焊盘之间形成多个隔离部件。 隔离部分由驱动装置提升。 隔离部分形成有垂直平板的阻挡构件。

公开(公告)号：KR1020030032462A

公开(公告)日：2003-04-26

申请号：KR1020010064255

申请日：2001-10-18

Applicant: 삼성전자주식회사

Inventor： 강종묵

IPC: H01L21/68

Abstract: PURPOSE: Vacuum tweezers are provided to prevent a wafer from being separated from the vacuum tweezers by making an operator easily detect an abnormal state of the vacuum tweezers when the pressure applied to the vacuum tweezers is reduced. CONSTITUTION: An inner vacuum line(23) is connected to an outer vacuum line. An open/close unit is so installed to intercept the inner vacuum line. A handle part(20) includes the inner vacuum line and the open/close unit. A wafer contact part is connected to the handle part. A vacuum hole(11) is connected to the inner vacuum line, formed on a surface to be in contact with the wafer. A wafer contact part has the surface to be in contact with the wafer and the vacuum hole. A vacuum sensor is connected to one point of the inner vacuum line, having a signal apparatus. The vacuum sensor generates a signal when the vacuum pressure in the one point of the inner vacuum line does not reach a predetermined pressure.

Abstract translation: 目的：提供真空镊子，以防止当施加到真空镊子的压力减小时，使操作者容易地检测真空镊子的异常状态，从而防止晶片与真空镊子分离。 构成：内部真空管线（23）连接到外部真空管线。 一个开/关单元被安装成拦截内部真空管线。 手柄部分（20）包括内部真空管线和打开/关闭单元。 晶片接触部分连接到手柄部分。 真空孔（11）连接到内部真空管线，形成在与晶片接触的表面上。 晶片接触部分具有与晶片和真空孔接触的表面。 真空传感器连接到具有信号装置的内部真空管线的一个点。 当内部真空管线的一个点的真空压力未达到预定压力时，真空传感器产生信号。